JPH04256302A - Laminated film chip capacitor - Google Patents

Abstract

PURPOSE:To reinforce the adhesive force of a laminated material to an electrode lead-out layer by a method wherein the electrode lead-out layer is provided on the electrode edge faces of the laminated material and striplike parts on the sides of the electrode edge faces on both sides of the upper and lower sides of the laminated material into a U-shaped form via an organic metal layer. CONSTITUTION:The framework of rod-shaped capacitors 21 and isolation plates 22 of a width narrower than the widths of the capacitors 21 is made and fixed in a state that the capacitors 21 and the plates 22 are alternately arranged and a heat treatment is performed. Then, a titanium diisopropoxy bisacetylacetonato dilued with an isopropyl alcohol is applied on electrode edge faces 23 and 24, in which internal electrodes of the capacitors 21 are previously exposed, and striplike parts 25, 26, 27 and 28 made to protrude from the plates 22 on both sides of the upper and lower sides of the capacitors 21 and is dried to form an organic metal layer 14. Then, a U-shaped electrode lead-out layer 15 is formed by a sputtering system. After the plates 22 are removed, a laminated material is cut in a prescribed dimension to adhere an insulating film on the cut surface and a laminated film chip capacitor is obtained.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer film chip capacitor provided with electrodes having good electrical contact.

0002

2. Description of the Related Art A conventional multilayer film chip capacitor will be explained below with reference to the drawings.

FIG. 3 is a diagram showing a schematic structure of a conventional multilayer film chip capacitor. In FIG. 3, 31 is a dielectric layer made of a plastic film, 32 is a metal electrode layer formed by vacuum deposition, etc., 33 is an electrode end surface,
34 is an electrode extraction layer formed by metal spraying.

A method of manufacturing the multilayer film chip capacitor constructed as described above will be explained below with reference to the drawings.

As shown in FIG. 4, a large number of dielectric layers 41 made of plastic film and metal electrode layers 42 formed by vacuum evaporation are stacked alternately and bonded using a hot press method to form a plurality of capacitor elements. Obtain a wide base material. This base material is used as the electrode end surface 43 of each capacitor element.
44 to obtain a long rod-shaped capacitor 45 as shown in FIG. As shown in FIG. 6, the rod-shaped capacitors 45 and wider separation plates 46 are arranged alternately and fixed in a frame, and after heat treatment, metal is attached to the electrode end faces 43, 44 of the rod-shaped capacitors 45. After the wide separation plate 46 was removed, the material was cut to a predetermined size and an insulating coating was applied to the cut surface to obtain a multilayer film chip capacitor as shown in FIG. 3.

[0006]

[Problem to be solved by the invention] The electrode extraction layer in such a capacitor can be formed by metal spraying method, plating method,
Although they are formed by sputtering methods, etc., they have various advantages and disadvantages.

[0007] The metal spraying method can spray 0.2 to 1 mm in a short time.
It is possible to form a thick electrode extraction layer, which makes it easy to obtain highly reliable components, but the thick electrode extraction layer makes it unsuitable for chip components where very small dimensions are required. It is.

On the other hand, the electrode lead layer formed by plating or sputtering generally has a thickness of 5 to 2.
Although it is thin at 0 μm and is advantageous for chip components, the former has problems with corrosion of internal metal electrodes, and the latter has problems with weak adhesion between the electrode end surface and the electrode extension layer.

The present invention solves the above-mentioned conventional problems, and aims to provide a multilayer film chip capacitor with improved shape and characteristics by increasing the adhesion between the electrode end face and the electrode extension layer.

0010

[Means for Solving the Problems] In order to achieve this object, the multilayer film chip capacitor of the present invention has an organic metal on the electrode end face of the multilayer body and the band-like portions on the electrode end faces on both upper and lower sides of the multilayer body. An electrode lead layer is provided in a U-shape through the layers.

[0011]

[Operation] A considerable amount of hydroxyl groups are present on the surface of the organic/inorganic materials constituting the laminate. The organometallic layer is formed of several molecular layers containing at least a monomolecular layer of alkoxide, and the reaction usually starts the moment they come into contact, with the alkoxide causing a substitution reaction with the hydroxyl groups on the surface of the laminate and directly chemically bonding. In some cases, the hydroxyl groups of the alcohol formed when the alkoxide reacts with moisture in the air and the hydroxyl groups on the surface of the laminate form hydrogen bonds, resulting in highly conductive contact.

[0012] Next, when an electrode extension layer is formed by sputtering or thermal spraying, the energy released from the high energy state thermally decomposes the underlying alkoxide, creating a chemical bond between the organometallic layer and the electrode extension layer. happens.

In addition to the above-mentioned mechanism, by providing the electrode extension layer not only on the electrode end face of the laminate but also on the band-shaped portion, the adhesion area between the laminate and the electrode extension layer is expanded.

By introducing the above-mentioned chemical bonds and expanding the adhesion area, the adhesion force between the laminate and the electrode extension layer is strengthened.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

(Example) FIG. 1 is a diagram showing a schematic structure of a multilayer film chip capacitor according to the present invention. In FIG. 1, 11 is a dielectric layer made of plastic film;
2 is a metal electrode layer formed by vacuum deposition, 13 is an electrode end surface, 14 is an organic metal layer made of alkoxide, 15
is an electrode extraction layer formed by a sputtering method.

First, a rod-shaped capacitor as shown in FIG. 5 was obtained using a conventional manufacturing method. Next, as shown in FIG. 2, the rod-shaped capacitors 21 and the separation plates 22 having a narrower width were arranged alternately in a frame, fixed, and heat treated. Then, the electrode end surfaces 23 and 24 of the rod-shaped capacitor 21 with the internal electrodes exposed in advance and the band-shaped portions 25 and 2 protruding from the narrow separation plates 22 on both the upper and lower sides of the rod-shaped capacitor 21.
Titanium diisopropoxybisacetylacetonate diluted with isopropyl alcohol was applied to layers 6, 27, and 28 and dried to form an organic metal layer 14. Subsequently, an electrode extension layer 15 is provided by a sputtering method, and after removing the narrow separation plate 22, it is cut into a predetermined size, and an insulating film is applied to the cut surface to obtain a length of 1 as shown in FIG.
．． A multilayer film chip capacitor of 6 mm, width 0.8 mm, and height 0.5 mm was obtained.

(Conventional Example) In the above embodiment, the electrode extension layer is formed only on the electrode end surface of the laminate by not forming the organic metal layer 14 and using the wide separation plate 46 instead of the narrow separation plate 22. A multilayer film chip capacitor as shown in FIG. 3 was obtained.

(Comparative Example) A multilayer film chip capacitor was obtained in the same manner as in the above example except that the organic metal layer 14 was not formed.

Here, 10 each of the multilayer film chip capacitors obtained in the above example, conventional example, and comparative example
A peel strength test was conducted on 0 pieces by peeling off the electrode extension layer under a load of 700 g. The results are shown in Table 1 below.

[0021]

[Table 1]

As is clear from the above (Table 1), according to this example, the adhesion between the laminate and the electrode extension layer is strengthened by providing the electrode extension layer in a U-shape through the organic metal layer. I found out that it can be done.

In the above examples, titanium alkoxide was used as the organic metal, but silane alkoxide,
Similar effects were obtained with tantalum alkoxide and the like.

In addition, although a sputtering method was adopted as a method for forming the electrode extraction layer, similar effects can be obtained by vacuum evaporation method, chemical vapor deposition method, etc., and the effect depends on the combination with the materials constituting the laminate. It was recognized.

[0025]

[Effects of the Invention] As described above, the present invention provides a U-shaped electrode extension layer on the electrode end face of the laminate and the band-like portions on the electrode end face side on both upper and lower sides of the laminate via an organic metal layer. This makes it possible to strengthen the adhesion between the laminate and the electrode extension layer.

It is effective to make the organometallic layer thin enough to obtain conduction due to the tunnel effect, etc. Furthermore, by providing an electrode extension layer in a U-shape not only on the end surface of the electrode but also on the band-shaped part, the laminated body and the electrode extension layer can be Since the adhesion area with the layer is expanded and the soldering area when mounting the film chip capacitor on a substrate is expanded, it is possible to provide a multilayer film chip capacitor having good electrical characteristics and mounting performance.

[Brief explanation of the drawing]

[Fig. 1] Partially cutaway perspective view of a multilayer film chip capacitor of the present invention.

FIG. 2 is a perspective view showing the arrangement of a rod-shaped capacitor and a narrow separation plate, which is one form of the capacitor manufacturing process of the present invention.

[Figure 3] Partially cutaway perspective view of a conventional multilayer film chip capacitor

FIG. 4: Perspective view of a wide matrix with multiple laminated film chip capacitor elements.

[Figure 5] A perspective view of a rod-shaped capacitor cut out from the wide base material in Figure 4.

[Fig. 6] A perspective view showing the arrangement of the rod-shaped capacitor and the wide separation plate in Fig. 5.

[Explanation of symbols]

11 Dielectric layer 12 Metal electrode layer 13 Electrode end surface 14 Organometallic layer 15 Electrode extraction layer

Claims (1)

[Claims] 1. A laminate in which dielectric layers and metal electrode layers are alternately stacked, wherein an electrode end face exposing the metal electrode layer inside the laminate and an electrode end face side on both upper and lower sides of the laminate. A multilayer film chip capacitor characterized in that a U-shaped electrode extension layer is provided on the strip-shaped portion of the capacitor with an organic metal layer interposed therebetween.