JPH0426385Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to a semiconductor device storage stay for storing semiconductor devices for transportation or the like.

[Conventional technology]

As a storage container for transporting or storing semiconductor devices such as transistors, ICs, and LSIs, this stay is usually made of plastic and has a cylindrical body with a pin member attached to prevent the semiconductor device from falling out. It is used. A portion of a conventional stake for storing semiconductor devices of this type is shown in a perspective view in FIG. 3a. In the figure, 1 is a main body integrally formed of plastic with a cylindrical shape having a trapezoidal lower surface and an inverted concave cross section, and 2 a semiconductor element (not shown) placed and housed in the pedestal portion 11 of the main body 1. This is a pin member that holds the main body 1 so that it does not fall off from the open end 12. This pin member 2 consists of a band-shaped part 21 and a first protruding part 22 extending below the belt-shaped part 21, and the first protruding part 22 is inserted into a first hole 13 provided in the upper surface near the open end 12 of the main body 1. It is configured to be press-fitted and stopped at the band-shaped portion 21. This pin member 2 is removed when storing the semiconductor element, and is attached when transporting or storing the semiconductor element after storage to prevent the semiconductor element from falling off. When the semiconductor element is used, it is removed again and the required number of semiconductor elements is removed. Since it is necessary to take out the element, it is necessary to be removable, and the strip part 2
1 is provided with a groove 24 as shown in FIG. 3b,
Various structures are used for the first protrusion 22, such as a split 25 or a potbell shape.

[The problem that the idea aims to solve]

Since the main body of this type of semiconductor device storage stake is formed by drawing a thin plastic tube, the surface is extremely smooth, especially in the longitudinal direction. By the way, when using this stake for storing semiconductor elements,
Usually, a large number of stakes are bundled together for transportation or storage, so if a large number of stakes are stacked on top of each other, for example, as shown in Figure 4, even if the outer circumference is tied with string, the stakes in the center will slide out without any restraining force. There were problems with items falling off, being damaged during transportation, and requiring special care when handling.

[Means to solve the problem]

In the present invention, a first hole for attaching and detaching a pin member is provided on the upper surface of the main body, which is integrally formed of plastic into a cylindrical shape with a trapezoidal lower surface and an inverted concave cross section, and the main body is located at a position opposite to the first hole. A second hole is provided in the platform, a first protrusion of the pin member is removably attached to the first hole, and a second protrusion is provided above the strip of the pin member. When stacked one on top of the other, the second protrusion can be inserted into the second hole provided in the stand-like part of the stick directly above.

[Effect]

According to the present invention, the second protrusion is provided at the upper part of the pin member attached to the end of the upper surface of the main body of the semiconductor element storage stake, and the second hole is provided at the end of the main body platform, When semiconductor element storage stakes are stacked vertically, the second protrusion of the pin member of the lower semiconductor element storage stay is inserted into the second hole of the base body of the upper semiconductor element storage stay. Therefore, the stacks for storing semiconductor elements stacked one above the other are locked to each other by the pin members. When these semiconductor element storage stakes are arranged vertically and horizontally and their outer peripheries are tied with strings or bands as shown in FIG. 4, the upper and lower semiconductor element storage stakes are fixed to each other by pin members.
Since the string or band binding the outer periphery has friction and does not slip, it is possible to prevent an accident in which a part of the internal semiconductor element storage stay falls off. In addition, when using a semiconductor device, the pin member can be easily removed from the second hole of the main body by removing the surrounding strings, bands, etc. and lifting the semiconductor device storage stakes one by one. On the contrary, even when taking out the required number of semiconductor elements from the semiconductor element storage stake, the pin member can be easily attached and detached because the pin member has the second protrusion.

〔Example〕

FIG. 1 is a perspective view showing a part of a stake for storing semiconductor elements, which is an embodiment of the present invention. Shows the same part as Figure 3. second hole 15
is a hole provided in the platform portion 11 opposite to the first hole 13 provided in the upper surface of the main body 1;
is a protrusion provided above the strip portion 21 of the pin member 2, that is, on the opposite side to the first protrusion 22, and this second protrusion 23 is connected to the second protrusion of the other stacked semiconductor element storage stay. It has a structure that allows it to be inserted into the hole 15. Therefore, the second protrusion does not need to have a complicated structure like the first protrusion, and may be formed to have a thickness that is slightly smaller than the second hole to facilitate insertion. In addition, since the second protruding portion needs to pass through the second hole 15 provided in the platform portion 11 of the stack for storing semiconductor elements stacked above, the second protruding portion is
It is necessary to determine the length of the second protrusion 23 so that the length of the tip of the second protrusion 23 from the lower surface of the stick is slightly longer than the height of the platform of the stake. A schematic front view and a side view of the stakes stacked one above the other are shown in FIGS. 2a and 2b, respectively.

[Effect of idea]

As explained above, according to the present invention, since the stacks for storing semiconductor elements stacked vertically are held together, it becomes easy to stack a large number of stacks vertically, and even when a large number of stacks are bundled and transported. This has the effect of preventing accidents such as the center stake falling off and being damaged, and facilitating handling such as transportation and storage.

[Brief explanation of the drawing]

FIG. 1 is a partial perspective view of a stake for storing semiconductor devices according to an embodiment of the present invention, and FIGS. 2 a and 2 b are front views schematically showing the stakes for storing semiconductor devices according to the present invention stacked one above the other. Figure and side view, 3rd
Figure a is a partial perspective view of a conventional stake for storing semiconductor elements, Figure 3b is a perspective view of a pin member that is another example of the conventional technology, and Figure 4 shows a stack of multiple stakes for housing semiconductor elements stacked together in a bundle. A perspective view of the case is shown. DESCRIPTION OF SYMBOLS 1... Main body, 2... Pin member, 11... Table-shaped part, 12... Open end, 13... First hole, 15...
...Second hole, 21...Band-shaped portion, 22...First protrusion, 23...Second protrusion.

Claims (1)

[Scope of utility model registration request] It consists of a plastic main body integrally formed into a cylindrical shape with a trapezoidal lower surface and an inverted concave cross section, and a pin member for preventing the semiconductor element inserted into the main body from falling out. and a first protruding part extending below the pin member, and the first protruding part of the pin member is removably attached to a first hole provided on the upper surface near the open end of the main body. In the stick for semiconductor devices, a second hole is provided at a position opposite to the first hole on the upper surface of the main body in the platform-like portion on the lower surface of the main body, and a second protrusion is provided above the strip-shaped portion of the pin member, and the semiconductor device A semiconductor device storage device characterized in that, when the storage stakes are stacked one above the other, the second protruding portion can be inserted into a second hole provided in a platform-like portion on the lower surface of the main body of the semiconductor device storage stake directly above. For status.