JPH0426565U - - Google Patents
Info
- Publication number
- JPH0426565U JPH0426565U JP1990067245U JP6724590U JPH0426565U JP H0426565 U JPH0426565 U JP H0426565U JP 1990067245 U JP1990067245 U JP 1990067245U JP 6724590 U JP6724590 U JP 6724590U JP H0426565 U JPH0426565 U JP H0426565U
- Authority
- JP
- Japan
- Prior art keywords
- board
- main board
- display component
- film carrier
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案の実施例を示す側面図、第2図
は実施例の一部を示す斜視図、第3図は実施例に
おけるフイルムキヤリアICの取付状態を示す側
面図、第4図は従来例を示す斜視図、第5図は従
来例を示す側面図、第6図は他の従来例を示す斜
視図、第7図は他の従来例を示す側面図、第8図
は他の従来例におけるQFPの取付状態を示す側
面図である。
5……表示部品、31……メイン基板、33…
…サブ基板、37……フイルムキヤリアIC、3
7a……ベアチツプ、37b……インナーリード
、37c……アウターリード、39……リード部
、46……筐体。
FIG. 1 is a side view showing an embodiment of the present invention, FIG. 2 is a perspective view showing a part of the embodiment, FIG. 3 is a side view showing the mounting state of the film carrier IC in the embodiment, and FIG. FIG. 5 is a side view of the conventional example, FIG. 6 is a perspective view of another conventional example, FIG. 7 is a side view of another conventional example, and FIG. 8 is a side view of another conventional example. FIG. 3 is a side view showing a state in which a QFP is attached in a conventional example. 5... Display parts, 31... Main board, 33...
...Sub board, 37...Film carrier IC, 3
7a...bear chip, 37b...inner lead, 37c...outer lead, 39...lead section, 46...casing.
Claims (1)
ちの一方の面に、表示部品が筐体に臨んだ状態で
設けられる実装構造において、前記サブ基板の他
方の面には前記表示部品の駆動用のフイルムキヤ
リアICが設けられ、このフイルムキヤリアIC
に対向した状態で前記メイン基板に電気部品が設
けられていることを特徴とする実装構造。 In a mounting structure in which a display component is provided on one surface of a sub-board that is mounted facing the main board in a state facing the housing, the other surface of the sub-board is provided with a display component for driving the display component. A film carrier IC is provided, and this film carrier IC
A mounting structure characterized in that an electrical component is provided on the main board in a state facing the main board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067245U JPH0755014Y2 (en) | 1990-06-27 | 1990-06-27 | Mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067245U JPH0755014Y2 (en) | 1990-06-27 | 1990-06-27 | Mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426565U true JPH0426565U (en) | 1992-03-03 |
| JPH0755014Y2 JPH0755014Y2 (en) | 1995-12-18 |
Family
ID=31600654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990067245U Expired - Lifetime JPH0755014Y2 (en) | 1990-06-27 | 1990-06-27 | Mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755014Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104783A (en) * | 2010-11-15 | 2012-05-31 | Fuji Xerox Co Ltd | Substrate mounting method |
-
1990
- 1990-06-27 JP JP1990067245U patent/JPH0755014Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104783A (en) * | 2010-11-15 | 2012-05-31 | Fuji Xerox Co Ltd | Substrate mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755014Y2 (en) | 1995-12-18 |
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