JPH04267013A - Electric contact material and manufacture thereof - Google Patents

Electric contact material and manufacture thereof

Info

Publication number
JPH04267013A
JPH04267013A JP3049039A JP4903991A JPH04267013A JP H04267013 A JPH04267013 A JP H04267013A JP 3049039 A JP3049039 A JP 3049039A JP 4903991 A JP4903991 A JP 4903991A JP H04267013 A JPH04267013 A JP H04267013A
Authority
JP
Japan
Prior art keywords
ceramic particles
contact material
si3n4
silver
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3049039A
Other languages
Japanese (ja)
Inventor
Toshiya Yamamoto
俊哉 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP3049039A priority Critical patent/JPH04267013A/en
Publication of JPH04267013A publication Critical patent/JPH04267013A/en
Pending legal-status Critical Current

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  • Manufacture Of Switches (AREA)
  • Contacts (AREA)

Abstract

PURPOSE:To provide a low-abrasion electric contact material for practical use by dispersing ceramic grains of Si3N4 in silver. CONSTITUTION:Ti about 10wt.% is dispersed on the surface of ceramic grains of Si3N4, ceramic grains 0.1-20wt.% of Si3N4 dispersed with Ti are mixed with silver and sintered, it is chemically bonded with Ag, the hardness and arc resistance are improved, and the low-abrasion property and sintering property can be improved.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は電気回路に使用されるリ
レー、スイッチ等の電気接点材料とその製造方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electrical contact materials for relays, switches, etc. used in electrical circuits, and a method for manufacturing the same.

【0002】0002

【従来の技術】従来、Si3 N4 のセラミック粒子
を銀中に分散させると、硬度、耐アーク性等が向上する
ことが知られている。
BACKGROUND OF THE INVENTION It has been known that hardness, arc resistance, etc. can be improved by dispersing Si3 N4 ceramic particles in silver.

【0003】0003

【発明が解決しようとする課題】しかしながら、従来の
Si3 N4 のセラミック粒子を分散した複合材料で
は、Si3 N4のセラミック粒子の分散のために焼結
による緻密化が阻害されるとともに、焼結後、Si3 
N4 のセラミック粒子とAgとは化学的に結合してい
ないため、例えば接点表面にSi3 N4 のセラミッ
ク粒子が現れると表面よりSi3 N4 のセラミック
粒子が脱落する問題があった。
However, in conventional composite materials in which Si3 N4 ceramic particles are dispersed, densification by sintering is inhibited due to the dispersion of Si3 N4 ceramic particles, and after sintering, Si3
Since the N4 ceramic particles and Ag are not chemically bonded, for example, when Si3 N4 ceramic particles appear on the contact surface, there is a problem that the Si3 N4 ceramic particles fall off from the surface.

【0004】そのため、電気回路に使用されるリレー、
スイッチ等の電気接点材料に使用すると、硬度や耐アー
ク性は向上するにもかかわらず、耐磨耗性が悪いために
、十分な接点寿命が得られなかった。
[0004] Therefore, relays used in electric circuits,
When used in electrical contact materials such as switches, although the hardness and arc resistance are improved, a sufficient contact life cannot be obtained due to poor wear resistance.

【0005】本発明の目的は、上記の問題点を解決して
、Ag中にSi3 N4 のセラミック粒子を分散させ
ることにより硬度、耐アーク性が向上して、しかも十分
実用に耐える低磨耗性の電気接点材料を提供するもので
ある。
The object of the present invention is to solve the above-mentioned problems and to improve the hardness and arc resistance by dispersing Si3 N4 ceramic particles in Ag, and to create a material with low abrasion that is sufficiently suitable for practical use. The present invention provides electrical contact materials.

【0006】[0006]

【問題点を解決するための手段】本発明は、0.1〜2
0重量%のSi3 N4 のセラミック粒子と、0.0
1〜2.0重量%のバインダとしてのTiを含有し残部
銀から成ることを特徴とする電気接点材料であり、Si
3 N4 のセラミック粒子と、バインダとしてのTi
を混合した後、800〜1000℃で30分以上の拡散
処理を行いセラミック粒子の表面にTi拡散層を形成し
、さらに銀と混合した後、700〜950℃で30分以
上の焼結処理を行うことを特徴とする電気接点材料の製
造方法である。
[Means for solving the problems] The present invention provides a
0% by weight of Si3N4 ceramic particles and 0.0% by weight of Si3N4 ceramic particles.
It is an electrical contact material characterized by containing 1 to 2.0% by weight of Ti as a binder and the balance consisting of silver.
3 N4 ceramic particles and Ti as a binder
After mixing, a diffusion treatment is performed at 800 to 1000°C for 30 minutes or more to form a Ti diffusion layer on the surface of the ceramic particles, and after further mixing with silver, a sintering treatment is performed at 700 to 950°C for 30 minutes or more. A method of manufacturing an electrical contact material is characterized in that:

【0007】[0007]

【作用】上記の構成において、最も特徴とするところは
、TiをSi3 N4 のセラミック粒子の10重量%
程度含有させることによりSi3 N4 のセラミック
粒子とAgとが、Ag−Ti−N−Si結合により化学
的に強固に密着するため、例えば、電気接点表面の上記
Si3 N4 のセラミック粒子が現れても該粒子が接
点表面より脱落することが極めて少なくなる。
[Operation] The most distinctive feature of the above structure is that Ti is added to 10% by weight of the Si3 N4 ceramic particles.
By including the Si3 N4 ceramic particles to a certain extent, Ag and the Si3 N4 ceramic particles are chemically strongly bonded to each other by Ag-Ti-N-Si bonds. Particles are extremely unlikely to fall off the contact surface.

【0008】また、Ag中にTiを添加することは焼結
性を向上させるので、結果として本発明の複合材料も焼
結性が向上する。
Furthermore, since adding Ti to Ag improves sinterability, the composite material of the present invention also has improved sinterability.

【0009】また、Si3 N4 のセラミック粒子含
有量を0.1〜20重量%と規定したのは、0.1重量
%未満では硬度の増加、耐アーク性の改善が見られなく
なり、20重量%を越えると、加工性の低下はもちろん
耐磨耗性が著しく悪くなるためである。
[0009] Furthermore, the content of ceramic particles of Si3N4 is specified to be 0.1 to 20% by weight, because if it is less than 0.1% by weight, no increase in hardness or improvement in arc resistance will be observed; This is because if it exceeds this, not only the workability decreases but also the abrasion resistance deteriorates significantly.

【0010】なお、Si3 N4 のセラミック粒子の
粒度は好ましくは、2ミクロン以下の微細な粒子が良い
[0010] The particle size of the Si3 N4 ceramic particles is preferably fine particles of 2 microns or less.

【0011】以下、本発明をより詳しく説明するための
実施例を記載するが、該実施例は本発明を限定するもの
ではない。
[0011] Examples will be described below to explain the present invention in more detail, but these examples are not intended to limit the present invention.

【0012】0012

【実施例】表1に示すSi3 N4 のセラミック粒子
と、Si3 N4 のセラミック粒子の10重量%のT
iをV型混合機で1時間混合した後、850℃で1時間
の拡散処理を行った。
[Example] Si3 N4 ceramic particles shown in Table 1 and 10% by weight T of the Si3 N4 ceramic particles
After mixing i with a V-type mixer for 1 hour, a diffusion treatment was performed at 850° C. for 1 hour.

【0013】さらに、表1に示すAgを混ぜてV型混合
機で1時間混合した。その後、粉末冶金の手法に従って
、粉末の圧縮成型と850℃で4時間の焼結処理を繰り
返し行いビレットを作製した。
Further, Ag shown in Table 1 was mixed and mixed for 1 hour using a V-type mixer. Thereafter, according to powder metallurgy techniques, compression molding of the powder and sintering treatment at 850° C. for 4 hours were repeated to produce a billet.

【0014】次に、熱間押出し、伸線加工、ヘッダー加
工をへて頭部径5mm、頭高1mm、脚部径2.5mm
、脚長2.5mmの固定接点と頭部径4mm、頭高1.
1mm、脚部径2.8mm、脚長1.6mmの頭部球状
r5mmの可動接点を得た。
Next, after hot extrusion, wire drawing, and header processing, the head diameter is 5 mm, the head height is 1 mm, and the leg diameter is 2.5 mm.
, fixed contact with leg length 2.5 mm, head diameter 4 mm, and head height 1.
A movable contact with a spherical head r5mm and a leg diameter of 2.8mm and a leg length of 1.6mm was obtained.

【0015】そして、これらのリベット接点をヒンジ型
リレーに組み込み表2の試験条件にて消耗試験を行い、
図2に示す結果を得た。また、従来例も同様の方法で試
験を行った。なお、本発明の電気接点材料の製造方法工
程を図1に示す。
[0015] Then, these rivet contacts were assembled into a hinge type relay and a wear test was conducted under the test conditions shown in Table 2.
The results shown in FIG. 2 were obtained. Further, the conventional example was also tested in the same manner. Incidentally, the steps of the method for manufacturing the electrical contact material of the present invention are shown in FIG.

【0016】[0016]

【表1】[Table 1]

【0017】[0017]

【表2】[Table 2]

【0018】[0018]

【発明の効果】以上の説明から明らかなように、本発明
の電気接点材料によれば、Ag中に所定量のTiをSi
3 N4 のセラミック粒子に分散させて添加すること
により、Ag−Ti−N−Si結合により化学的に強固
に密着するため、耐磨耗性の良好な電気接点材料が得ら
れ、電気回路に使用するリレー、スイッチ等に利用でき
るものである。
Effects of the Invention As is clear from the above explanation, according to the electrical contact material of the present invention, a predetermined amount of Ti is added to Si in Ag.
By dispersing and adding it to 3N4 ceramic particles, it forms a strong chemical bond through Ag-Ti-N-Si bonds, resulting in an electrical contact material with good wear resistance, making it suitable for use in electrical circuits. It can be used for relays, switches, etc.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の電気接点材料の製造方法の工程図を示
す。
FIG. 1 shows a process diagram of a method for manufacturing an electrical contact material of the present invention.

【図2】実施例及び従来例の消耗試験結果のグラフ。FIG. 2 is a graph of the wear test results of the example and the conventional example.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】  0.1〜20重量%のSi3 N4 
のセラミック粒子と、0.01〜2.0重量%のバイン
ダとしてのTiを含有し残部銀から成ることを特徴とす
る電気接点材料。
Claim 1: 0.1-20% by weight of Si3N4
1. An electrical contact material comprising: ceramic particles; and 0.01 to 2.0% by weight of Ti as a binder, with the balance being silver.
【請求項2】  Si3 N4 のセラミック粒子と、
バインダとしてのTiを混合した後、800〜1000
℃で30分以上の拡散処理を行いセラミック粒子の表面
にTi拡散層を形成し、さらに銀と混合した後、700
〜950℃で30分以上の焼結処理を行うことを特徴と
する電気接点材料の製造方法。
[Claim 2] Ceramic particles of Si3 N4;
After mixing Ti as a binder, 800-1000
After performing a diffusion treatment at ℃ for 30 minutes or more to form a Ti diffusion layer on the surface of the ceramic particles and further mixing with silver,
A method for producing an electrical contact material, comprising performing a sintering treatment at ~950°C for 30 minutes or more.
JP3049039A 1991-02-21 1991-02-21 Electric contact material and manufacture thereof Pending JPH04267013A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3049039A JPH04267013A (en) 1991-02-21 1991-02-21 Electric contact material and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3049039A JPH04267013A (en) 1991-02-21 1991-02-21 Electric contact material and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH04267013A true JPH04267013A (en) 1992-09-22

Family

ID=12819946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3049039A Pending JPH04267013A (en) 1991-02-21 1991-02-21 Electric contact material and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH04267013A (en)

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