JPH0427171Y2 - - Google Patents

Info

Publication number
JPH0427171Y2
JPH0427171Y2 JP12232287U JP12232287U JPH0427171Y2 JP H0427171 Y2 JPH0427171 Y2 JP H0427171Y2 JP 12232287 U JP12232287 U JP 12232287U JP 12232287 U JP12232287 U JP 12232287U JP H0427171 Y2 JPH0427171 Y2 JP H0427171Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
lead
terminal pins
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12232287U
Other languages
Japanese (ja)
Other versions
JPS6426854U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12232287U priority Critical patent/JPH0427171Y2/ja
Publication of JPS6426854U publication Critical patent/JPS6426854U/ja
Application granted granted Critical
Publication of JPH0427171Y2 publication Critical patent/JPH0427171Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は複数の端子ピンの一端が連結部を介し
て連結され、他端が略直角に同一方向に折り曲げ
られてなる混成集積回路用リードに関する。
[Detailed description of the invention] [Field of industrial application] The present invention provides a lead for a hybrid integrated circuit in which one end of a plurality of terminal pins is connected via a connecting part, and the other ends are bent in the same direction at a substantially right angle. Regarding.

〔従来の技術〕[Conventional technology]

第5図乃至第8図は従来の混成集積回路用リー
ドを説明するための図である。第5図及び第6図
において、1は櫛歯形をしている混成集積回路用
リードであり、複数の端子ピン2が所定間隔でも
つて一方向に配列され、夫々が一端で連結部3を
介して連結されている。また、端子ピン2の他端
は夫々所定の長さのところから略直角に同一方向
に折り曲げられており、固定部4が形成されてい
る。5は混成集積回路用基板であり、その片面に
は導体パターンが形成されており、面実装部品や
リード付き部品などの複数の電子部品6が搭載さ
れて混成集積回路7が構成されている。この混成
集積回路7の端子部8には、上記各端子ピン2の
固定部4が第6図に示すように半田付けされてい
る。
FIGS. 5 to 8 are diagrams for explaining conventional leads for hybrid integrated circuits. 5 and 6, reference numeral 1 denotes a comb-shaped lead for a hybrid integrated circuit, in which a plurality of terminal pins 2 are arranged in one direction at a predetermined interval, each connected at one end via a connecting part 3. are connected. Further, the other ends of the terminal pins 2 are each bent approximately at right angles in the same direction from a predetermined length to form a fixing portion 4. Reference numeral 5 denotes a hybrid integrated circuit board, on one side of which a conductor pattern is formed, and a plurality of electronic components 6 such as surface-mounted components and leaded components are mounted to form a hybrid integrated circuit 7. The fixing portions 4 of the respective terminal pins 2 are soldered to the terminal portions 8 of the hybrid integrated circuit 7, as shown in FIG.

また、第7図及び第8図においては、端子ピン
2の固定部4がコの字状になつている混成集積回
路用リード1が示されているが、このリードでは
第8図に示すように、固定部4によつて混成集積
回路用基板5を挟持的に嵌着されるように取り付
け、固定することができる。従つて、この場合に
は、混成集積回路用リード1をリフローにより電
子部品6と一緒に一括して半田付けすることがで
きる。
7 and 8 show a hybrid integrated circuit lead 1 in which the fixing portion 4 of the terminal pin 2 is U-shaped. In addition, the hybrid integrated circuit board 5 can be attached and fixed by the fixing portion 4 so as to be clamped therebetween. Therefore, in this case, the hybrid integrated circuit lead 1 can be soldered together with the electronic component 6 by reflow.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

ところで、第5図及び第6図に示すような従来
の混成集積回路用リード1では、各端子ピン2の
固定部4と混成集積回路8の端子部9との位置決
めがし難く、また、半田付け前の状態では混成集
積回路用リード1が混成集積回路用基板5に固定
されていないので、リフローにより電子部品7と
一緒に一括して半田付けすることができず、作業
性が極めて悪く不経済である。
By the way, in the conventional lead 1 for a hybrid integrated circuit as shown in FIGS. 5 and 6, it is difficult to position the fixing part 4 of each terminal pin 2 and the terminal part 9 of the hybrid integrated circuit 8, and it is difficult to solder. Since the hybrid integrated circuit lead 1 is not fixed to the hybrid integrated circuit board 5 before it is attached, it is not possible to solder it together with the electronic components 7 by reflow, resulting in extremely poor workability and failure. It's the economy.

また、第7図及び第8図に示すような従来の混
成集積回路用リード1では、リフローにより電子
部品6と一緒に一括して半田付けすることができ
るが、第8図に示すように混成集積回路用リード
の端子ピン2の厚さだけ混成集積回路が大型化す
ると共に、ケースに混成集積回路を収納する場合
には、混成集積回路をケースに密着して収納する
ことができないという欠点がある。
Furthermore, with conventional leads 1 for hybrid integrated circuits as shown in FIGS. 7 and 8, it is possible to solder them together with electronic components 6 by reflow, but as shown in FIG. The hybrid integrated circuit becomes larger by the thickness of the terminal pin 2 of the integrated circuit lead, and when the hybrid integrated circuit is housed in a case, there is a disadvantage that the hybrid integrated circuit cannot be housed closely in the case. be.

〔問題点を解決するための手段〕[Means for solving problems]

本考案は以上の欠点を除去するために、複数の
端子ピンの一端が連結部を介して連結され、他端
が略直角に同一方向に折り曲げられてなる混成集
積回路用リードにおいて、上記端子ピンのいずれ
かが他の端子ピンより所定の距離だけ長く、且つ
上記折り曲げ方向と逆方向に所定の距離だけずれ
ていることを特徴とする混成集積回路用リードを
提供するものである。
In order to eliminate the above-mentioned drawbacks, the present invention provides a lead for a hybrid integrated circuit in which one end of a plurality of terminal pins is connected via a connecting part and the other ends are bent in the same direction at a substantially right angle. The present invention provides a lead for a hybrid integrated circuit, characterized in that one of the terminal pins is longer than the other terminal pins by a predetermined distance, and is shifted by a predetermined distance in a direction opposite to the bending direction.

〔作用〕[Effect]

本考案は上記のような構成になつているので、
上記2種類の端子ピンの間に混成集積回路用基板
を挟持的に嵌着されるように取り付け、端子ピン
を基板の内側に固定することができる。
Since the present invention has the above structure,
The hybrid integrated circuit board can be attached so as to be sandwiched between the two types of terminal pins, and the terminal pins can be fixed inside the board.

〔実施例〕〔Example〕

第1図乃至第4図は本考案の一実施例を説明す
るための図である。これらの図において、複数の
端子ピン2が所定間隔でもつて一方向に配列され
ているが、各端子ピン2の連結部3から固定部4
までの長さが交互に長短となつており、長い端子
ピンの長さは短い端子ピンの長さよりもほぼ混成
集積回路用基板5の厚さだけ長くなつている。ま
た、長い端子ピン2の夫々が連結部3の近傍で固
定部4とは逆方向に所定の距離だけずれるように
曲げられている。従つて、第2図及び第3図に示
すように各固定部4と端子部8とを合致させるよ
うにして混成集積回路7の端部を混成集積回路用
リードの固定部4間に止まるまで挿入すれば、固
定部4と混成集積回路の端子部8との位置決めが
できると同時に、短い端子ピン2を混成集積回路
7の端部から所定の長さだけ離れた位置に固定す
ることができる。この状態で、リフローにより電
子部品6と一緒に端子ピン2を一括して半田付け
した後、連結部3を切断して除去すれば、長い端
子ピン2は混成集積回路から除去され、第4図に
示すように本来の端子ピンである短い端子ピン2
のみが混成集積回路用リードとして残る。この連
果、混成集積回路用リード1の端子ピン2は混成
集積回路7の端子から所定の距離だけ内側に接続
されるので、混成集積回路7をケースに密着して
収納することができ、小型化することができる。
FIGS. 1 to 4 are diagrams for explaining one embodiment of the present invention. In these figures, a plurality of terminal pins 2 are arranged in one direction at predetermined intervals.
The lengths up to the terminal pins are alternately long and short, and the lengths of the long terminal pins are longer than the lengths of the short terminal pins by approximately the thickness of the hybrid integrated circuit substrate 5. Further, each of the long terminal pins 2 is bent in the vicinity of the connecting portion 3 so as to be shifted by a predetermined distance in a direction opposite to the fixing portion 4. Therefore, as shown in FIGS. 2 and 3, each fixing part 4 and the terminal part 8 are aligned with each other until the end of the hybrid integrated circuit 7 is stopped between the fixing parts 4 of the hybrid integrated circuit lead. When inserted, the fixing part 4 and the terminal part 8 of the hybrid integrated circuit can be positioned, and at the same time, the short terminal pin 2 can be fixed at a position a predetermined distance from the end of the hybrid integrated circuit 7. . In this state, the long terminal pins 2 are removed from the hybrid integrated circuit by soldering the terminal pins 2 together with the electronic components 6 by reflow, and then cutting and removing the connecting portions 3, as shown in FIG. Short terminal pin 2, which is the original terminal pin, as shown in
Only the leads remain as leads for hybrid integrated circuits. As a result of this, the terminal pins 2 of the hybrid integrated circuit lead 1 are connected inward from the terminals of the hybrid integrated circuit 7 by a predetermined distance, so the hybrid integrated circuit 7 can be stored closely in the case, making it compact. can be converted into

尚、以上の実施例においては、隣合う端子ピン
が交互に混成集積回路用基板の両面を挟持する場
合について説明したが、混成集積回路用基板の両
面を挟持することができる形状であれば、以上の
実施例に限定されることなく実施することができ
る。
In the above embodiment, a case has been described in which adjacent terminal pins alternately sandwich both sides of the hybrid integrated circuit board, but any shape capable of holding both sides of the hybrid integrated circuit board may be used. The present invention can be implemented without being limited to the above embodiments.

〔考案の効果〕[Effect of idea]

以上述べたように本考案は、複数の端子ピンの
一端が連結部を介して連結され、他端が略直角に
同一方向に折り曲げられてなる混成集積回路用リ
ードにおいて、上記端子ピンのいずれかが他の端
子ピンより所定の距離だけ長く、且つ上記折り曲
げ方向と逆方向に所定の距離だけずれていること
を特徴とする混成集積回路用リードである。本考
案はこのような特徴を有するので、混成集積回路
用リードと混成集積回路用基板との位置決めを容
易に行うことができる。また、混成集積回路をケ
ースに密着して収納することができ、小型化する
ことができる。
As described above, the present invention provides a lead for a hybrid integrated circuit in which one end of a plurality of terminal pins is connected via a connecting part and the other ends are bent in the same direction at a substantially right angle. A lead for a hybrid integrated circuit is characterized in that the terminal pin is longer than other terminal pins by a predetermined distance, and is shifted by a predetermined distance in a direction opposite to the bending direction. Since the present invention has such features, it is possible to easily position the hybrid integrated circuit lead and the hybrid integrated circuit board. Further, the hybrid integrated circuit can be housed in close contact with the case, and the size can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第4図は本考案の一実施例を説明す
るための図、第5図乃至第8図は従来の混成集積
回路用リードを説明するための図である。 1……混成集積回路用リード、2……端子ピ
ン、3……連結部、4……固定部、5……混成集
積回路用基板、6……電子部品、7……混成集積
回路、8……端子部。
1 to 4 are diagrams for explaining an embodiment of the present invention, and FIGS. 5 to 8 are diagrams for explaining a conventional lead for a hybrid integrated circuit. DESCRIPTION OF SYMBOLS 1... Lead for hybrid integrated circuit, 2... Terminal pin, 3... Connection part, 4... Fixed part, 5... Board for hybrid integrated circuit, 6... Electronic component, 7... Hybrid integrated circuit, 8 ...Terminal section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の端子ピンの一端が連結部を介して連結さ
れ、他端が略直角に同一方向に折り曲げられてな
る混成集積回路用リードにおいて、上記端子ピン
のいずれかが他の端子ピンより所定の距離だけ長
く、且つ上記折り曲げ方向と逆方向に所定の距離
だけずれていることを特徴とする混成集積回路用
リード。
In a lead for a hybrid integrated circuit in which one end of a plurality of terminal pins is connected via a connecting part and the other ends are bent in the same direction at a substantially right angle, one of the terminal pins is a predetermined distance from the other terminal pin. 1. A lead for a hybrid integrated circuit, characterized in that the lead is long by a predetermined distance and is deviated by a predetermined distance in a direction opposite to the bending direction.
JP12232287U 1987-08-10 1987-08-10 Expired JPH0427171Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12232287U JPH0427171Y2 (en) 1987-08-10 1987-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12232287U JPH0427171Y2 (en) 1987-08-10 1987-08-10

Publications (2)

Publication Number Publication Date
JPS6426854U JPS6426854U (en) 1989-02-15
JPH0427171Y2 true JPH0427171Y2 (en) 1992-06-30

Family

ID=31370143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12232287U Expired JPH0427171Y2 (en) 1987-08-10 1987-08-10

Country Status (1)

Country Link
JP (1) JPH0427171Y2 (en)

Also Published As

Publication number Publication date
JPS6426854U (en) 1989-02-15

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