JPH0427458U - - Google Patents
Info
- Publication number
- JPH0427458U JPH0427458U JP6700190U JP6700190U JPH0427458U JP H0427458 U JPH0427458 U JP H0427458U JP 6700190 U JP6700190 U JP 6700190U JP 6700190 U JP6700190 U JP 6700190U JP H0427458 U JPH0427458 U JP H0427458U
- Authority
- JP
- Japan
- Prior art keywords
- view
- photo
- showing
- printing plate
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001259 photo etching Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図乃至第６図は本考案フオト・エツチング
用版下の実施の一例を示すもので第１図は平面図
、第２図及び第３図はフオト・エツチング用版下
の作成工程を示すもので第２図は版下原稿の上に
絶縁シート部材を重ねる様子を示す斜視図、第３
図は絶縁シート部材に導電性テープを貼る作業を
示す斜視図、第４図はフオト・エツチング用版下
の回路パターンをチエツクしている様子を示す概
略平面図、第５図は当該フオト・エツチング用版
下を使用してプリント基板を作成する工程を示す
もので、Ａはフオト・エツチング用版下をフオト
・マスクとして露光している状態を示す要部の断
面図、Ｂは露光後の銅貼基板を現像した状態を示
す要部の断面図、Ｃは現像後の銅貼基板をエツチ
ングした状態を示す要部の断面図、第６図は本考
案フオト・エツチング用版下を用いて作成したプ
リント基板を示す斜視図である。
符号の説明、１……フオト・エツチング用版下
、２……絶縁シート部材、３……回路パターン、
４……導電性部材。
Figures 1 to 6 show an example of the implementation of the photo-etching block of the present invention, with Figure 1 being a plan view, and Figures 2 and 3 showing the process of creating the photo-etching block. Figure 2 is a perspective view showing how the insulating sheet member is stacked on top of the original manuscript, and Figure 3 is
The figure is a perspective view showing the work of applying conductive tape to an insulating sheet member, Figure 4 is a schematic plan view showing checking the circuit pattern on a photo-etching plate, and Figure 5 is a diagram showing the photo-etching process. This figure shows the process of creating a printed circuit board using a printing plate. A is a cross-sectional view of the main part showing the state in which the photo-etching printing plate is exposed as a photo mask, and B is a cross-sectional view of the copper after exposure. C is a cross-sectional view of the main part showing the developed state of the copper-plated board, C is a cross-sectional view of the main part showing the etched state of the copper-plated board after development, and Figure 6 was created using the photo etching printing plate of the present invention. FIG. 2 is a perspective view showing a printed circuit board. Explanation of symbols, 1... Photo-etching plate, 2... Insulating sheet member, 3... Circuit pattern,
4... Conductive member.
Claims (1)
たフオト・エツチング用版下であつて、 上記回路パターンを導電性部材により形成した ことを特徴とするフオト・エツチング用版下。[Scope of Claim for Utility Model Registration] A photo etching printing plate in which a desired circuit pattern is formed on an insulating sheet member, the printing plate for photo etching characterized in that the circuit pattern is formed from a conductive material. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6700190U JPH0427458U (en) | 1990-06-25 | 1990-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6700190U JPH0427458U (en) | 1990-06-25 | 1990-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0427458U true JPH0427458U (en) | 1992-03-04 |
Family
ID=31600193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6700190U Pending JPH0427458U (en) | 1990-06-25 | 1990-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427458U (en) |
-
1990
- 1990-06-25 JP JP6700190U patent/JPH0427458U/ja active Pending
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