JPH0428471U - - Google Patents
Info
- Publication number
- JPH0428471U JPH0428471U JP6844590U JP6844590U JPH0428471U JP H0428471 U JPH0428471 U JP H0428471U JP 6844590 U JP6844590 U JP 6844590U JP 6844590 U JP6844590 U JP 6844590U JP H0428471 U JPH0428471 U JP H0428471U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- printed circuit
- legs
- case
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す縦断面図、第
２図は従来例を示す縦断面図である。
２……片面プリント基板、２ａ……配線面（表
面）、２ｂ……配線しない面（裏面）、５……部
品、５ａ……部品の足、５ｂ……部品の本体部、
６……スルーホール、７……ケース、１１……ハ
トメ、１３……リフローハンダ、１４……ハンダ
。
FIG. 1 is a vertical sectional view showing an embodiment of the present invention, and FIG. 2 is a vertical sectional view showing a conventional example. 2... Single-sided printed circuit board, 2a... Wiring surface (front side), 2b... Non-wiring side (back side), 5... Component, 5a... Leg of component, 5b... Main body of component,
6...through hole, 7...case, 11...grommet, 13...reflow solder, 14...solder.
Claims (1)
位置に予め設けられた貫通孔であつて、導電性ハ
トメが打ち込まれている貫通孔に、本体部が前記
ケースの外側に位置する部品の足が挿入され、前
記基板の配線を行なう面において前記ハトメと配
線がリフローハンダ付けされ、前記基板の配線を
行なう面と反対の面において前記部品の足が前記
ハトメにハンダ付けにより接続固定されているこ
とを特徴とする片面プリント基板への部品の取り
付け構造。 The legs of the component whose main body is located outside the case are inserted into the through holes, which are pre-prepared at predetermined positions on the single-sided printed circuit board housed in the case, and into which conductive eyelets are driven. and that the grommet and the wiring are reflow soldered on the surface of the board where the wiring is performed, and that the legs of the component are connected and fixed to the eyelet by soldering on the surface of the board opposite to the surface where the wiring is performed. Features a structure for attaching components to a single-sided printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6844590U JPH0428471U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6844590U JPH0428471U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428471U true JPH0428471U (en) | 1992-03-06 |
Family
ID=31602897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6844590U Pending JPH0428471U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428471U (en) |
-
1990
- 1990-06-29 JP JP6844590U patent/JPH0428471U/ja active Pending
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