JPH0428473U - - Google Patents
Info
- Publication number
- JPH0428473U JPH0428473U JP6843290U JP6843290U JPH0428473U JP H0428473 U JPH0428473 U JP H0428473U JP 6843290 U JP6843290 U JP 6843290U JP 6843290 U JP6843290 U JP 6843290U JP H0428473 U JPH0428473 U JP H0428473U
- Authority
- JP
- Japan
- Prior art keywords
- board
- component
- printed circuit
- pinhole
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図は本考案の実施例を示し、第１図は片面プリ
ント回路基板の一部切欠平面図、第２図は要部の
拡大断面図、第３図は他の実施例を示す要部の拡
大断面図である。
１……片面プリント回路基板、２……基板、３
……配線パターン、４……パターン面、５……チ
ツプ部品、６……ピンホール、７……挿入部品、
９……リード線。
The drawings show an embodiment of the present invention, Fig. 1 is a partially cutaway plan view of a single-sided printed circuit board, Fig. 2 is an enlarged sectional view of the main part, and Fig. 3 is an enlarged view of the main part showing another embodiment. FIG. 1... Single-sided printed circuit board, 2... Board, 3
... Wiring pattern, 4 ... Pattern surface, 5 ... Chip parts, 6 ... Pinhole, 7 ... Insert parts,
9... Lead wire.
Claims (1)
載置して装着するチツプ部品と、該基板のピンホ
ールにリード線を挿入して装着する挿入部品とを
備えた片面プリント回路基板において、該基板の
配線パターンを設けた面であつて、且つ、該チツ
プ部品を載設する面より該挿入部品のリード線を
ピンホールへ挿入して装着したことを特徴とする
片面プリント回路基板。 A single-sided printed circuit board that has a wiring pattern on one side of the board, a chip component that is mounted on the board, and an insertion component that is mounted by inserting a lead wire into a pinhole of the board. 1. A single-sided printed circuit board, characterized in that the lead wire of the inserted component is inserted into a pinhole from the surface on which the wiring pattern is provided and on which the chip component is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6843290U JPH0428473U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6843290U JPH0428473U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428473U true JPH0428473U (en) | 1992-03-06 |
Family
ID=31602872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6843290U Pending JPH0428473U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428473U (en) |
-
1990
- 1990-06-29 JP JP6843290U patent/JPH0428473U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0428473U (en) | ||
| JPH02132971U (en) | ||
| JPH0236073U (en) | ||
| JPS63178374U (en) | ||
| JPH0173967U (en) | ||
| JPH0359666U (en) | ||
| JPH0375561U (en) | ||
| JPH0317613U (en) | ||
| JPH031469U (en) | ||
| JPH0316378U (en) | ||
| JPH02146416U (en) | ||
| JPS63162566U (en) | ||
| JPH033770U (en) | ||
| JPS61201373U (en) | ||
| JPH03104980U (en) | ||
| JPH0275765U (en) | ||
| JPH0263551U (en) | ||
| JPH0276849U (en) | ||
| JPS61205169U (en) | ||
| JPS63185269U (en) | ||
| JPS63131141U (en) | ||
| JPS5977256U (en) | Printed board | |
| JPH028165U (en) | ||
| JPH02125355U (en) | ||
| JPS6020169U (en) | Masking materials for printed wiring boards |