JPH0428474U - - Google Patents

Info

Publication number
JPH0428474U
JPH0428474U JP6914490U JP6914490U JPH0428474U JP H0428474 U JPH0428474 U JP H0428474U JP 6914490 U JP6914490 U JP 6914490U JP 6914490 U JP6914490 U JP 6914490U JP H0428474 U JPH0428474 U JP H0428474U
Authority
JP
Japan
Prior art keywords
clamping member
fixing
substrate
base
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6914490U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6914490U priority Critical patent/JPH0428474U/ja
Publication of JPH0428474U publication Critical patent/JPH0428474U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP6914490U 1990-06-29 1990-06-29 Pending JPH0428474U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6914490U JPH0428474U (cs) 1990-06-29 1990-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6914490U JPH0428474U (cs) 1990-06-29 1990-06-29

Publications (1)

Publication Number Publication Date
JPH0428474U true JPH0428474U (cs) 1992-03-06

Family

ID=31604192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6914490U Pending JPH0428474U (cs) 1990-06-29 1990-06-29

Country Status (1)

Country Link
JP (1) JPH0428474U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204097A (ja) * 2000-12-28 2002-07-19 Taiyo Yuden Co Ltd フレキシブル回路基板保持具及びそれを使用したフレキシブル回路基板の保持方法。

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204097A (ja) * 2000-12-28 2002-07-19 Taiyo Yuden Co Ltd フレキシブル回路基板保持具及びそれを使用したフレキシブル回路基板の保持方法。

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