JPH04292003A - Oscillation frequency adjusting system for strip line resonator - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting the oscillation frequency of a stripline resonator. Such a stripline resonator is formed by providing a metal foil or the like on a substrate, is connected to a microwave oscillator, resonates at the oscillation frequency to be output, and outputs the required microwave.

0002

2. Description of the Related Art By the way, FIG. 11 is a schematic perspective view showing an oscillator equipped with a conventional stripline resonator. In FIG. 11, 6 is a transistor, 7 is a DC cut member, 8 is a capacitor, and 9 is a resistor, and these are connected by a strip line 13 formed of metal foil or the like.

[0003] 2 is a strip line resonator,
This stripline resonator 2 is formed of metal foil or the like, is connected to the middle of the stripline 13, extends perpendicularly to the stripline 13, and has a length equal to one of the resonant waves.
/4 wavelength.

Reference numeral 10 denotes lands for adjusting the oscillation frequency, and these lands 10 change the resonance frequency of the stripline resonator 2 by connecting them to the stripline resonator 2 using metal foil 11. The desired characteristics are obtained.

With this configuration, the frequency of the stripline resonator 2 can be adjusted by making the stripline resonator 2 short in advance, pasting the metal foil 11 on its tip by bonding, etc., and connecting the land 10 and the stripline. This is done by connecting to the resonator 2. This adds electrical capacitance and adjusts resonance characteristics.

[0006]

However, when using such a conventional method, it is necessary to prepare the metal foil 11 in advance, and it is also necessary to provide a land 10 for adjusting the oscillation frequency. There is a problem that it is difficult to adjust the desired amount every 10 lands.

The present invention was devised in view of these problems, and provides an oscillation frequency adjustment method for a stripline resonator that allows desired adjustment to be easily made without preparing lands or metal foils. The purpose is to provide

[0008]

FIG. 1 is a diagram illustrating the principle of the invention according to claim 1. In FIG.

Here, the strip line resonator 2 is formed so that its length corresponds to 1/4 wavelength of the resonant wave.

3 is a through hole, and this through hole 3
is formed on the substrate and connected to ground 15.

4 is a solder mound, and this solder mound 4 is
It is constructed by applying solder to a position close to the through-hole 3 in the stripline resonator 2, and the oscillation frequency is adjusted by the solder filling part 4 and the through-hole 3. It has become.

FIG. 2 is a diagram illustrating the principle of the invention according to claim 2. In FIG. 2, 1 is an oscillator, and the oscillator 1 is also formed so that its length corresponds to 1/4 wavelength of the resonant wave. The stripline resonator 2 has a stripline resonator 2.

15 is a ground, and this ground 1
5 is connected to a ground 15' set at the same height as the stripline resonator 2 via a through hole 15A.

A through hole 3'' connected to the 1/4 wavelength strip line resonator 2 is provided at a position close to the ground 15'.

4 is a solder mound, and this solder mound 4 is
It is constructed by applying solder at a position close to the 1/4 wavelength strip line resonator 2 on the ground 15', and the solder area 4 and the through-hole 3''
The oscillation frequency is adjusted.

[0016]

[Operation] In the method for adjusting the oscillation frequency of the stripline resonator of the present invention (claim 1) described above, the oscillation frequency is adjusted by applying solder to the position close to the through hole 3 in the stripline resonator 2. Ru.

Further, in the oscillation frequency adjustment method of the stripline resonator of the present invention (claim 2), the ground 15'
The oscillation frequency is adjusted by applying solder at a position close to the 1/4 wavelength strip line resonator 2.

[0018]

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(a) Description of the first embodiment FIG. 3 is a schematic perspective view of the main parts of the first embodiment of the present invention. In FIG. 3, 1 is an oscillator;
has a stripline resonator 2. This oscillator 1 includes a substrate 14 made of, for example, glass epoxy resin.
The substrate 14 is formed as a multilayer substrate.

Here, the stripline resonator 2 is formed so that its length corresponds to 1/4 wavelength of the resonant wave, and furthermore, the stripline resonator 2 is arranged inside the multilayer substrate. It is set up.

3 is a through hole, and this through hole 3
is constructed by forming a conductive layer on the inner wall of the hole 3A formed in the substrate 14, and its lower end is connected to the ground 15 provided on the lower surface of the substrate 14.

By the way, FIG. 4 is a schematic longitudinal cross-sectional view of the main part showing the first embodiment of the present invention. As shown in FIG. 4, the substrate 14 includes an upper layer substrate 14A and a lower layer substrate 14B. A stripline resonator 2 is disposed between the upper substrate 14A and the lower substrate 14B.

An opening 5 is provided at a position corresponding to the tip of the stripline resonator 2 in the upper layer substrate 14A.
is formed.

The through hole 3 is disposed at a position (substrate portion) in the opening 5 opposite to and close to the edge 5A of the strip line resonator 2 on the front end side.

Furthermore, in FIGS. 3 and 4, 4 is a solder mound, and this solder mound 4 is located close to the through hole 3 in the opening 5 at the tip of the strip line resonator 2. It is constructed by applying solder, and electrical capacitance is generated by the solder filling part 4 and the through hole 3, and the resonant frequency of the strip line resonator 2 is changed so that the oscillation frequency can be adjusted. It has become.

Note that the transistor 6 and the DC cut member 7
, capacitor 8, and resistor 9 are constructed in the same manner as in the conventional example, and are mounted on the substrate 14.

With this configuration, when changing the oscillation frequency of the oscillator 1, a required amount of solder (see reference numeral 4) is applied to the tip of the stripline resonator 2 located in the opening 5.

[0028] As a result, the solder mound 4 and the through-hole 3 face each other, so that the electrical capacitance between the strip line resonator 2 and the ground 15 is changed.

That is, FIG. 5 is a schematic vertical cross-sectional view equivalent to FIG. The tip of the device 2 can be substantially extended, thereby increasing the area facing the ground 15. As explained from this state, also in the structure of this embodiment, the strip line resonator 2 is extended and the capacitance is increased.

By adjusting the amount of solder, a desired capacitance can be achieved and a desired resonance characteristic can be obtained.

(b) Description of Second Embodiment Next, a second embodiment of the present invention will be described. FIG. 6 is a schematic perspective view showing the main structure of a second embodiment of the present invention. In FIG. 6, the same reference numerals as in FIGS. 3 to 5 indicate substantially the same parts.

In this embodiment, the opening 5 is formed in a portion of the substrate including the longitudinally intermediate portion of the stripline resonator 2, and a through-hole is formed in the portion of the substrate opposite to the side edge of the opening 5. 3' is provided.

With this configuration, when changing the oscillation frequency of the oscillator 1, a required amount of solder (see reference numeral 4) is applied to the side edge of the stripline resonator 2 located in the opening 5.

[0034] As a result, the solder mound 4 and the through-hole 3' face each other, so that the electrical capacitance between the strip line resonator 2 and the ground 15 is changed.

Here, the solder mound 4 has the function of widening the width of the stripline resonator 2, and
5 and increase the capacity.

By adjusting the amount of solder, a desired capacitance can be achieved and a desired resonance characteristic can be obtained.

In the structure of this embodiment, since the change in capacitance is smaller than that in the first embodiment, it is suitable for fine adjustment of resonance characteristics.

(c) Description of Third Embodiment Further, a third embodiment of the present invention will be explained. FIG. 7 is a schematic perspective view showing the main part configuration of a third embodiment of the present invention, and FIG. 8 is a model vertical sectional view showing the main part structure of the third embodiment of the present invention. 3 to 6, the same reference numerals as in FIGS. 3 to 6 indicate substantially the same parts.

In this embodiment, the opening 5 is formed in the substrate part at a required distance from the tip of the stripline resonator 2 in the longitudinal direction, and the edge of the opening 5 on the stripline resonator side A through hole 3'' is provided in the substrate portion facing 5C.

Here, the through hole 3'' has its lower end joined to the tip of the strip line resonator 2,
It constitutes a part of the stripline resonator 2.

Further, at the bottom of the opening 5C formed in the substrate, connection through holes 15A, 15B, 15C, 15
A ground 15' connected to the ground 15 via D is provided.

With this configuration, when changing the oscillation frequency of the oscillator 1, the ground 15 located in the opening 5
Pour the required amount of solder (see reference numeral 4) on '.

[0043] As a result, the solder mound 4 and the through-hole 3'' face each other, so that the electrical capacitance between the strip line resonator 2 and the ground 15' is changed.

The solder mound 4 has the function of increasing the length of the ground 15, increasing the area facing the ground 15' and increasing the capacitance.

By adjusting the amount of solder, it is possible to realize a desired capacitance and obtain a desired resonance characteristic. Note that the structure of this embodiment is electrically equivalent to that of the first embodiment.

(d) Description of Fourth Embodiment Next, a fourth embodiment of the present invention will be described. FIG. 9 is a schematic perspective view showing the main part configuration of the fourth embodiment of the present invention, and FIG. 10 is a model vertical sectional view showing the main part structure of the fourth embodiment of the present invention. 3 to 8, the same reference numerals as in FIGS. 3 to 8 indicate substantially the same parts.

In this embodiment, the opening 5 is formed in a part of the substrate at a required distance from the side edge of the stripline resonator 2, and is opposite to the edge of the opening 5 on the side of the stripline resonator. Through hole 3 in the part of the board
``'' is provided.

Here, the through hole 3''' has its lower end joined to the tip of the stripline resonator 2, and constitutes a part of the stripline resonator 2.

Furthermore, the ground 1 is connected to the bottom of the opening 5 formed in the substrate through connecting through holes 15A and 15B.
A ground 15' connected to 5 is provided.

With this configuration, when changing the oscillation frequency of the oscillator 1, the ground 15 located in the opening 5
Pour the required amount of solder (see reference numeral 4) on '.

[0051] As a result, the solder mound 4 and the through-hole 3''' face each other, so that the electrical capacitance between the strip line resonator 2 and the ground 15' is changed. .

The solder mound 4 has the function of increasing the length of the ground 15', increasing the area facing the ground 15' and increasing the capacitance.

[0053] By adjusting the amount of solder, a desired capacitance can be achieved and a desired resonance characteristic can be obtained. Note that the structure of this embodiment is electrically equivalent to that of the second embodiment.

Furthermore, in the structure of this embodiment, since the change in capacitance is smaller than that in the third embodiment, it is suitable for fine adjustment of resonance characteristics.

[0055]

As described in detail above, according to the oscillation frequency adjustment method for a stripline resonator of the present invention as set forth in claim 1, soldering is performed at a position close to a through hole in a 1/4 wavelength stripline resonator. The oscillation frequency is adjusted by adding solder, so the desired resonance characteristics can be easily obtained by adjusting the amount of solder, and there is no need to constantly prepare metal foil or land. is obtained. Further, since the adjustment does not depend on the number of lands, etc., there is an advantage that continuous fine adjustment of the value can be performed.

According to the method for adjusting the oscillation frequency of a stripline resonator according to the present invention, the oscillation frequency can be adjusted by applying solder at a position close to the 1/4 wavelength stripline resonator in the ground. Therefore, desired resonance characteristics can be easily obtained by adjusting the amount of solder, and there is an effect that there is no need to constantly prepare metal foil and lands. Furthermore, since the adjustment does not depend on the number of lands, etc., there is an advantage that continuous fine adjustment of values can be performed.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the principle configuration of the present invention.

FIG. 2 is a diagram showing the principle configuration of the present invention.

FIG. 3 is a schematic perspective view of main parts showing a first embodiment of the present invention.

FIG. 4 is a schematic longitudinal cross-sectional view of the main parts showing the first embodiment of the present invention.

FIG. 5 is a schematic vertical cross-sectional view of a main part equivalent to the first embodiment of the present invention.

FIG. 6 is a schematic perspective view of main parts showing a second embodiment of the present invention.

FIG. 7 is a schematic perspective view of main parts showing a third embodiment of the present invention.

FIG. 8 is a schematic vertical cross-sectional view of the main parts showing a third embodiment of the present invention.

FIG. 9 is a schematic perspective view of main parts showing a fourth embodiment of the present invention.

FIG. 10 is a schematic longitudinal cross-sectional view of the main parts of a fourth embodiment of the present invention.

FIG. 11 is a schematic perspective view of main parts of a conventional example.

[Explanation of symbols]

1 Oscillator 2 Strip line resonator 3, 3', 3'', 3''' through-hole 4 Solder mound 5 Opening 5A Opening edge 5B Opening side edge 5C Opening edge 6 Transistor 7 DC cut member 8 Capacitor 9 Resistor 10 Land 11 Metal foil 13 Strip line 14 Substrate 14A Upper substrate 14B Lower substrate 15, 15' Ground

Claims (2)

[Claims] [Claim 1] 1/4 wavelength strip line resonator (2)
In the oscillator (1) having a 1/4 wavelength strip line resonator (2), a ground (1)
5) with a through hole (3) connected to the 1/
By applying solder to a position close to the through hole (3) in the four-wavelength strip line resonator (2),
characterized in that it is configured to adjust the oscillation frequency;
Stripline resonator oscillation frequency adjustment method. [Claim 2] 1/4 wavelength strip line resonator (2)
In the oscillator (1), a through hole (3'') connected to the quarter wavelength strip line resonator (2) is provided at a position close to the ground (15'),
A stripline resonator characterized in that the oscillation frequency is adjusted by applying solder at a position close to the 1/4 wavelength stripline resonator (2) in the ground (15'). Oscillation frequency adjustment method.