JPH0429543Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an electronic component, and more particularly, to a structure for fixing and positioning an element body constituting an electronic component and an external lead.

Conventional technology Conventional electronic components, for example, electrolytic capacitor 1
As shown in FIG. 4, the anode lead 3 is pulled out from the end surface of the element body 2, and a conductive adhesive 4 is applied to the upper surface of the element body 2 and the upper end surface of the anode lead 3 on the opposite side to the pulled-out surface. After adhering the square-shaped cathode lead 5 through the device, the element body 2, the anode lead 3, and the base of the cathode lead 5 are covered with an insulating resin 6.

Problems to be Solved by the Invention In particular, in recent years, due to the trend toward miniaturization of components, there has been a demand for reduced dimensional accuracy in the thickness of electronic components.

Insulating resin 6 of electrolytic capacitor 1 as described above
The upper surface 7 coated with When adhering and positioning the lead 5, make sure that the thickness between the cathode lead 5 and the marking surface 7 above it (usually about 0.2 to 0.3 mm) does not change.
I had to be very careful.

However, during actual electrode lead attachment work, due to variations in the amount of conductive adhesive 4 applied, the cathode lead 5 tends to be inclined with respect to the element body 2, and the base of the cathode lead is made of insulating resin. It protrudes from the coating, making it impossible to obtain a flat stamping surface 7,
There was a risk of insulation failure.

Means for Solving the Problems In order to solve the above-mentioned problems recognized in the positioning and fixing work of conventional electronic components, especially the element body and the cathode lead, the present invention provides the following:
In an electronic component in which an external lead is provided, the element body is covered with an insulating resin, and the upper surface is used as a printing surface, one lead is placed in a U-shape with the side end surface avoiding the upper surface of the element body. The present invention provides an electronic component constructed from a lead member integrally connected with a mounting portion that is clamped.

Effect By bringing one lead into close contact with the side end face of the element body in a U-shape while avoiding the top surface of the element body, the thickness of the electronic component is reduced, and the ability of one lead to hold the element body is improved, making positioning easier. Make it.

Embodiment FIG. 1 is a developed view showing the shape of one lead used in the present invention when punched, and FIG. 2 is a developed view showing the shape of one lead used in the present invention when it is bent and formed to match the shape of the element body. FIG. Moreover, FIG. 3 is a perspective view showing the overall structure of the electrolytic capacitor according to the present invention. In addition, in the following explanation,
Components that are the same as those of conventional electrolytic capacitors are indicated by the same reference numerals, and redundant descriptions will be omitted.

As shown in FIG. 1, one of the leads, that is, the cathode lead 10, is punched out of a conductive metal sheet, with a width corresponding to the shape and dimensions of the side end surface and end surface, avoiding the upper surface of the element body 2. height,
Also, three bending lines 10a, 10b, 10c
It is a T-shaped sheet with Cathode lead 10
Thereafter, as shown in FIG. 2, each is bent about 90 degrees with the bending lines 10a and 10b as boundaries to form a U-shaped shape that holds the side end surfaces 2a, 2b and 2c of the element body 2. A mounting portion 11 is formed. The bending line 10c corresponding to the end surface 2c is provided at approximately 1/2 the height, and the upper end thereof is approximately 90cm above the bending line 10c.
Bend it several times to form a lead tab part.

After that, a conductive adhesive is applied to the inner surface of the cathode lead 10 facing the side end surfaces 2a, 2b, and 2c, and the cathode lead 10, which has been preformed in a U-shape, is fitted into the element body 2. The element main body 2 and the cathode lead 10 are bonded into an integral structure while adjusting their relative positions. Next, the anode lead 3
The device body 2, the anode lead 3, and the base end of the cathode lead 10 are further covered with an insulating resin 6. In this way, a flat stamping surface 7 is formed on the upper surface of the electrolytic capacitor 12, as shown in FIG.

Although the above embodiment is a case in which the present invention is applied to an electrolytic capacitor, it can also be applied to electronic components such as resistors and inductances.

Effects of the invention As can be understood from the above explanation, one lead can be made of a lead member that holds the side end face in a U-shape while avoiding the top surface of the element body. The positioning and clamping ability for the element body has been improved, and not only will the lead attachment position be misaligned, but since there is no conductive adhesive or lead attachment part on the top surface of the element body, the insulation from the top surface of the element body can be increased by the thickness of the adhesive. The distance from the upper surface of the resin can be increased, and furthermore, poor insulation and failure to form a flat stamped surface due to variations in the amount of conductive adhesive applied to the upper surface of the element main body can be effectively avoided.

[Brief explanation of the drawing]

FIG. 1 is a developed view showing the shape of the polar lead when punched, and FIG. 2 is a perspective view showing the shape of the lead after bending. Moreover, FIG. 3 is a perspective view showing the overall structure of the electrolytic capacitor according to the present invention.
Incidentally, FIG. 4 is a partially sectional side view of a conventional electrolytic capacitor. 2...Element body, 10...Cathode lead, 10
a, 10b, 10c...bending line, 2a, 2b,
2c... Side end surface of the element body, 11... U-shaped mounting portion, 12... Electrolytic capacitor.

Claims (1)

[Scope of Claim for Utility Model Registration] In an electronic component in which external leads are arranged on both end faces of an element body, the element body is covered with an insulating resin, and a stamping surface is formed on the upper surface, one of the leads An electronic component comprising a lead member integrally connected with a mounting portion that holds the side end surface in a U-shape while avoiding the top surface of the element body.