JPH0430458A - High output power hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To enable a device small in thickness and excellent in operability to be offered by a method wherein two boards are arranged confronting each other through the intermediary of a casing so as to keep the surface of one of the boards exposed, and a power lead terminal fixed to one of the boards in led out along the surface of the casing. CONSTITUTION:Metal boards 1a and 1b are structured into one piece with a casing 4 interposing a casing 4 between them so as to keep the surface of the control board 1a out of the boards 1a and 1b exposed, and a power lead terminal 3b fixed to the other board 1b is led out along the surface of the connecting member 12 of the casing 4, whereby a high output power hybrid integrated circuit device where a lead terminal 3b is not protrudent can be offered. In result, a high output power hybrid integrated circuit device which is small in thickness and excellent in operability can be realized.

Description

Detailed Description of the Invention (a) Industrial Application Field The present invention is a high-output hybrid integrated circuit device in which a high-output circuit board and a control circuit board for controlling it are integrated through a case material. More specifically, the present invention relates to a package structure of a high-output hybrid integrated circuit device.

(b) Conventional technology Power semiconductor devices are generally used for power drive control of outdoor units of inverter air conditioners, etc., but in conventional power semiconductor devices of this type, power circuits to which power semiconductor elements are connected The board and the control circuit board to which various electrical components are connected are arranged separately and independently on a control panel or the like. For this reason, it has been difficult to downsize the device and to form it into an easily replaceable module.

Therefore, in recent years, in order to solve the above-mentioned problems, there has been a power semiconductor device in which a power circuit board and a control circuit board are integrated into one package.

FIG. 7 is a sectional view showing, for example, one conventional power semiconductor device.

As shown in FIG. 7, the power circuit board (51) is provided with a power circuit board (51) and a control circuit board (52). 56), and the control circuit board (52)
) is fitted into the molding resin outer frame (54) and fixed by injection hardening of a sealing resin (5B) such as epoxy resin, so that both circuit boards (51) and (52) are fitted into the molding resin outer frame (54). 54) are stacked and held parallel to each other. Then, power semiconductor elements (1) such as transistors and diodes are connected to the wiring pattern formed on the power circuit board (51).
10), various electrical components (112) are respectively connected to wiring patterns formed on the control circuit board 52). Furthermore, an external input/output terminal (114) is soldered to the power circuit board (51).
114) is the sealing resin (58) and the control circuit board 52
) and is led out to the top. Further, an external connection connector (116) is connected to the control circuit board 52), and this external connection connector (116) is connected to the sealing resin (52).
8) and protrudes from the top. The power circuit board (51) and the control circuit board (52) are electrically connected to each other by a board connection connector (118).

(c) Problems to be Solved by the Invention The conventional power semiconductor device described above has various problems as shown below.

First of all, although such power semiconductor devices have been able to achieve miniaturization and replaceable module form, the power circuit board (5
1) and the control circuit board (52) is an internally injected resin (5).
6) and the sealing tree Jl (58), the heat generated from the power semiconductor element (110) placed on the power circuit board (51) is transferred to the internally injected resin (56).
and the control circuit board (52) via the sealing resin (58)
The electric power is transmitted to various electrical components (112) placed on the power circuit board (51), and as a result, various electrical components (112) are affected by heat and their characteristics change, causing malfunctions. This was a major constraint on the power circuits formed in the 2000s. Therefore, there is a big problem that a device compatible with high power circuits of 50A to 200A class cannot be realized.

Next, the control circuit board (52) is formed of a resin-based board, and the electrical components (112) mounted on the board (52) are
Since the structure is such that the noise is completely disposed on the upper surface side, the noise resistance is extremely poor, and malfunctions due to noise occur.

Furthermore, the connection between the power circuit board (51) and the control circuit board (52) is achieved by first fixing the power circuit board (51) to the outer frame (54) and using a connecting connector fixed on the board (51) in advance. (118) needs to be protruded onto the surface of the substrate (52) and the protruding portion must be soldered, which significantly reduces workability and reliability, and there is a problem that automation cannot be performed.

Furthermore, input/output terminals (114) and connectors (116)
Since all of the terminals protrude upward from the main body, there is a problem in that stacking cannot be performed when completed, which reduces the efficiency of packaging work.

(2) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes two metal substrates and the side substrate that are arranged facing each other so that the surface of at least one of the substrates is exposed. a plurality of control system circuit elements connected to the conductive path on the one substrate, and a plurality of power system circuit elements connected to the conductive path on the other substrate. and a case material that fixes and integrally fixes the side board, and a power lead terminal fixed to the peripheral edge of at least one side of the other board is extended along the surface of the case material to lead out the power lead terminal. It is characterized by:

(1) According to the present invention, two metal substrates are arranged facing each other with a case material in between so that the surface of the - side of the substrate is exposed,
By leading the power lead terminal fixed on the other board to the outside along the surface of the case material, even though it is a high output hybrid integrated circuit device equipped with a power circuit and a control circuit, the lead terminal A high-output hybrid integrated circuit device without any protruding parts can be provided. As a result, it is easy to handle, and the external connection part of the power lead terminal can be arbitrarily placed on the side or top side of the device, and the power lead terminal can be connected with one device using the mounting force point. The position can be changed.

Furthermore, in the high-output hybrid integrated circuit device of the present invention, circuit elements such as control system transistors, ICs, chip capacitors, and chip resistors are used in chip form on one substrate, which can be arranged with its surface exposed. This makes it possible to provide a highly integrated control board.

Furthermore, since the two substrates are connected at the peripheral edge portions of each substrate, there is an advantage that the connection between the two substrates can be performed extremely easily.

Further, since the back surfaces of both substrates are exposed and the respective circuit elements are arranged to face each other, the shielding effect against external noise is significantly improved.

(F) Embodiment The high-output hybrid integrated circuit device of the present invention will be explained in detail below based on the embodiment shown in FIGS. 1 to 3.

FIG. 1 is a sectional view showing a high-output hybrid integrated circuit device of the present invention, FIG. 2 is a plan view, and FIG. 3 is a front view.

As shown in FIGS. 1 to 3, the high-output hybrid integrated circuit device of the present invention includes two metal substrates (LA) (LB) and a plurality of Control system and power system circuit elements (2a) (2b), both boards (1a
) (lb), small signal and power lead terminals (3a) (3b) fixed to the peripheral edge of the board (lb), and two boards (1a
) (1b) are separated and fixed together (4)
It consists of

As the metal substrate, for example, an aluminum substrate with a thickness of 0.5 to 5.0 mm is used. An aluminum oxide film (alumite layer) is formed on the surfaces of both substrates (la) and (lb) by well-known anodic oxidation.
A thick layer of insulating resin such as epoxy or polyimide is applied. Further, a copper foil having a thickness of 10 to 105 .mu.m is adhered onto the insulating resin layer simultaneously with the insulating resin layer by means such as a roller or hot press.

On the surface of the copper foil provided on the main surfaces of both substrates (la) and (lb), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and precious metals (gold, silver, platinum) are coated.
The plating layer is plated on the surface of the copper foil. Thereafter, the resist is removed and the copper foil is etched using the noble metal plating layer as a mask to form a desired conductive path. Here, the limit for the thinness of the conductive path by screen printing is 0.5 mm, so when an ultra-fine wiring pattern is required, it is possible to form an ultra-fine conductive path of up to about 2μ rule using well-known photo-etching technology. Become.

Figure 4 shows two substrates (
Fig. 4 is a plan view of one board (1a) of (lb), that is, a control circuit board, and as is clear from Fig. Conductive path (
5a) is formed substantially over the entire surface of the substrate (1a). A plurality of lead fixing pads (6a) are provided at the peripheral end of the substrate (1a) along which the conductive path (5a) extends.

Pads (6) provided on opposing peripheral edges of the substrate (1a)
a) has a small signal lead terminal (
3a) is fixed. This lead terminal (3a) is not clearly shown in each figure, but its tip is placed upwards from the horizontal direction, and the lead terminal (3a)
The tip of the substrate 3a) is designed not to protrude beyond the exposed surface (opposite surface) of one substrate (1a). Also, the fixing pad (
6a') is a fixing pad for connecting to the other substrate (1b) which will be described later.

Chip-shaped circuit elements (2a) such as transistors, ICs, chip capacitors, and chip resistors that do not generate heat are mounted on the control system board (1a) at predetermined positions in the form of a double die.

On the other hand, Fig. 5 is a plan view of the other board (1b), that is, the power output board, and as shown in Fig. 5, there are mainly thick conductive paths (5b) for power on the board (1b). It is formed. A plurality of pads (6b) for fixing power lead terminals are provided on the peripheral edge of the substrate (1b) extending from the conductive path (5b), and the power lead terminals (6b) are attached to the pads (6b). 3b) is fixed. In addition, on the other board (1b), not only the power conductive path (5b) but also some signal system conductive paths are not formed, and the tip of the conductive path is connected to the power lead terminal (3b). A pad (6b') is formed to extend on the opposite side to which is fixed, and is connected to the connection pad (6a') of the one substrate (1a) described above.

On this other substrate (1b) are mounted power elements such as power transistors, power MO5s, IGBTs, and a plurality of circuit elements (2b) that constitute a power system protection circuit including a large current detection resistor. There is. Needless to explain, what is necessary for the power element is the substrate (1b) via a so-called heat sink material (7) such as Cu or Invar.
It can be mounted on top.

In addition, the thickness of the copper foil of the other board (lb) in this example is 1
05μ, it is possible to flow a large current of 100A to 200A class with minimal heat generation.

As shown in FIGS. 1 and 2, the power lead terminal (3b) that has been completely fixed on the other board (1b) is transferred to the fixed pad (6b), and once led out in the horizontal direction, it is placed at a predetermined position. It is formed by bending.

This bent portion can be completely bent along the surface of the case material (4), which will be described later, but in this embodiment, it is bent at a substantially right angle.

By the way, of the two boards (la) and (lb), the other board (1b) for the power system is thicker than the one board (1a) for the control system.
) This was taken into consideration during the design so that it would be larger. Those two boards (la>(lb) are connected to the respective circuit elements (2a
) and (2b) are fixedly fixed together by the case member (4) with a predetermined distance between them so as to face each other.

The case material (4) used in this example will be explained using FIGS. 6A to 6C.

Figure 6A is a front view of the case material (4), Figure B is a plan view,
Figure C is a bottom view.

As shown in FIGS. 6A to 6C, the case material (4) has a frame portion (10) formed in a frame shape to separate both substrates (la) and (lb), and a frame portion (10). A wing-shaped locking part (11) led out from both ends and a power lead terminal (3b
) is substantially in contact with the external connecting member (12), which is connected to the external circuit, as the main part.

Furthermore, in the case material (4) of this embodiment, in addition to the above-mentioned main components, there is a protrusion 13〉 that forms a region for connecting both substrates (la) and (lb), and a case material (4) after injection molding.
A reinforcing portion (19) for preventing distortion (warping) of the case material (4) is integrally formed with the case material (4).

The characteristic of the case material (4) is that the external connection member (
12). That is, the external connection member (12) is provided on the vertical and horizontal surfaces of the case material 4) so that the connection portion of the power lead terminal (3b) can be set on the side and top surfaces of the device, respectively. 12) is provided with a hole (19') into which a nut for screwing is inserted.

Further, the plurality of external connection members (12) are partitioned into blocks by slits (14') having a predetermined depth. An insulator (not shown) is inserted into this slit (14'), which is designed to be used to maintain a constant insulation distance between power lead terminals that can be placed adjacent to each other.

Both substrates (la) and (lb) are integrally fixed to the case material (4) using such a case material (4).

One board (1a) that will become the control system circuit board is made of case material (
4> Place the other board (which will become the power circuit board) on the top side.
1b) is arranged on the lower surface side of the case material (4), and the circuit elements (2a) (
2b) are considered to be opposite to each other. By the way, the case material (4) and the respective substrates (la) and (lb) can be fixed and integrally bonded together using an adhesive sheet (J sheet: trade name) by a hot pressure bonding method.

Both boards (la) (lb) integrally fixed to case material (4)
is the protrusion (13) of the case material (4) and both substrates (la)
(lb) are electrically connected to each other within the space formed by the peripheral end portion. As the connection means, there are several methods such as a film, a gold backing lead, etc., but in this embodiment, a metal lead (15) is used for connection. After connecting both substrates (la) and (lb), the above-mentioned space is filled with an epoxy sealing resin (17) to protect each connection area. In addition, since it is necessary to fill the resin (17) into the space formed by both the substrates (1a) (1b) and the protrusion (13), the peripheral edges of the substrates (la) and (lb) are approximately It is designed to match.

One substrate (1a) placed on the top surface of the case material (4)
As shown in FIG. 2, the small signal lead terminal (3a) derived from the
As shown in FIG. 3, the tip of 3a) does not protrude from the surface of the substrate (1a).

On the other hand, the other board (
The power lead terminal (3b) fixed to the first
As shown in the figures to FIG. 3, the case material (4) is bent and arranged along the external connection member (12).

This embodiment is designed so that the connecting portion of the lead terminal (3b) is arranged on the vertical side of the case material (4), that is, in the middle part between the two substrates (la) and (lb). Case material (4)
A nut (1) is inserted into the hole (13') of the external connection member (12).
6) is placed in advance, so Natsuto (16)
is in a sealed state by the bent lead terminal (3b). Needless to explain, lead terminal (3b)
A hole is provided in the hole, and the screw (18) is inserted into the hole and the screw (18) and nut (16) are screwed together to connect the power lead terminal (3b) to the external circuit. .

In this example, the external connection part of the power lead terminal (3b) is provided between both boards (la) and (lb) as described above, but in the case material (4) of this example, one Lead terminals (3b
) can be set by bending and arranging the connecting part.

In this embodiment, a mother board (20) serving as a third board is fixed and integrated on the surface of the other board (1b).

For the purpose of improving heat dissipation and insulation, the motherboard (20) is a metal substrate, and its main surface is provided with an insulating resin layer (not shown) such as polyimide resin. There is. As is clear from FIG. 1, this mother board (20) is formed larger than the other board (1b), and is housed in the case material (4) like the two boards (la) and (1b).

That is, the mother board (20) is arranged in the area indicated by the dashed line as shown in FIG. 6C (a diagram showing the bottom surface of the case material). At this time, the position of the mother board (2o) is regulated by the wing-shaped locking parts (11) provided at both ends of the case material (4), so that the other board (1b) and the mother board (20) There is no risk of problems such as misalignment when fixing.

When the mother board (20) and the other board (1b) are fixed and integrated with the case material (4), the connection between the mother board (2o) and the case material (4) is established as shown in Figures 1 and 3. The space formed by the member (12) is filled with an epoxy sealing resin (17), and the fixed connection portion of the power lead terminal (3b) is sealed and protected.

According to the present invention, two metal substrates (la) (lb)
One board (1a) of the control system is integrated with the case material (4) so as to expose the surface, and the power lead terminal (3b) fixed to the other board (lb) is connected to the case material (4).
) to the outside along the surface of the connecting member (12), it is possible to provide a high-output hybrid integrated circuit device in which the lead terminal (3b) does not protrude.

As a result, it becomes possible to realize a high-output hybrid integrated circuit device that is thin and extremely easy to handle.

(G) Effects of the Invention As detailed above, according to the present invention, both substrates (la)
Since the lead terminals (3a) and (3b) fixed to (lb) do not protrude, it is possible to provide a device that is thin and easy to handle.

Next, according to the present invention, there is an advantage that the connecting portion of the power lead terminal (3b) to the external circuit can be selected depending on the mounting location by using the same case material (4) on the side surface and the top surface.

Furthermore, according to the present invention, one substrate (1a) is arranged so that the surface of the substrate is exposed, so that the other substrate (1a) for power
1b) is significantly reduced compared to the conventional structure. As a result, the other board (1
b) Even if a high output circuit is formed on the circuit board (1a) of the control system, heat may damage the circuit elements (
2a> reliability can be improved.

Furthermore, according to the present invention, since the chip-shaped circuit elements (2a) (2b) are mounted on the inner substrates (la) (lb), a highly integrated high output hybrid integrated circuit device is provided. be able to.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a front view of FIG. 1, FIGS. 4 and 5 are plan views showing the substrate, and FIG. A to C are views showing the case material used in this embodiment, and FIG. 7 is a sectional view showing a conventional example. (la) (1b) is the board, (2a) (2b) is the circuit element, (3a) (3b) is the lead terminal, (4) is the case material,
(5a) (5b) are conductive paths, (6a) (6b) are pads for fixing lead terminals, (7) are heat sinks, (10) are frame parts, (11) are locking parts, (12) are external connections Element,(
13) is a protruding part, (14) is a reinforcing part, (15) is a metal lead, (16) is a nut, (17) is a sealing resin, (18) is a screw, and (20) is a mother board.

Claims (5)

[Claims] (1) Two metal substrates placed opposite each other so that the surface of at least one of the substrates is exposed, a conductive path formed on both substrates having a desired shape, and a conductive path on the one substrate connected to the conductive path. At least one side of the other board, comprising a plurality of control system circuit elements, a plurality of power system circuit elements connected to conductive paths on the other board, and a case material that fixes and integrates both the boards. A high-output hybrid integrated circuit device, characterized in that a power lead terminal fixed to a peripheral edge portion is extended and led out along the surface of the case material. (2) The high output hybrid integrated circuit device according to claim 1, wherein the conductive path is made of copper foil. (3) The high-output hybrid integrated circuit device according to claim 1, wherein the other substrate is larger than the one substrate, and the respective substrates are electrically connected to each other. (4) Claim 3, wherein the peripheral edges of the respective substrates to which the two substrates are electrically connected are substantially aligned.
The high output hybrid integrated circuit device described above. (5) The high output hybrid integrated circuit device according to claim 1, wherein the power lead terminal is bent upward.