JPH04307780A - semiconductor laser - Google Patents
semiconductor laserInfo
- Publication number
- JPH04307780A JPH04307780A JP7172891A JP7172891A JPH04307780A JP H04307780 A JPH04307780 A JP H04307780A JP 7172891 A JP7172891 A JP 7172891A JP 7172891 A JP7172891 A JP 7172891A JP H04307780 A JPH04307780 A JP H04307780A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- optical waveguide
- semiconductor laser
- active layer
- quantum well
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 230000003287 optical effect Effects 0.000 claims abstract description 37
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000005253 cladding Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract description 11
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 3
- 230000010355 oscillation Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- RVIXKDRPFPUUOO-UHFFFAOYSA-N dimethylselenide Chemical compound C[Se]C RVIXKDRPFPUUOO-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 101100240461 Dictyostelium discoideum ngap gene Proteins 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 description 1
- 229910000058 selane Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、光ディスクのピックア
ップ用等に用いられる、化合物半導体レーザダイオード
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compound semiconductor laser diode used for picking up optical discs and the like.
【0002】0002
【従来の技術】光ディスクのピックアップ用に使用され
る半導体レーザは、データ書き込み時には高出力特性が
、またデータ読み出し時には低雑音特性が要求される。
図6は、岩野らにより応物学会講演予稿集(昭和62年
春期、28P−ZH−9)に発表された低雑音型半導体
レーザである。上記半導体レーザは、活性層(61)の
両側を活性層よりも小さな屈折率を有するクラッド層(
13, 17)ではさんだダブルヘテロ構造を有してお
り、上側クラッド層(17)の途中までエッチングを施
すことによってリブ状の光導波路が形成されている。上
記半導体レーザは、共振器端面近傍では屈折率導波構造
を、チップ中央部では利得導波構造を有している。この
様に一つのチップ内に屈折率導波領域と利得導波領域を
作り込むことにより、利得導波構造のもつマルチ縦モー
ド発振という特徴を維持しながら、屈折率導波構造の持
つ長所、すなわち低しきい値、高効率、低非点収差等も
同時に満足たすることができる。2. Description of the Related Art A semiconductor laser used for picking up an optical disk is required to have high output characteristics when writing data and low noise characteristics when reading data. FIG. 6 shows a low-noise semiconductor laser published by Iwano et al. in the Proceedings of the Japan Society of Applied Physics (Spring 1988, 28P-ZH-9). The above semiconductor laser includes a cladding layer (61) having a refractive index smaller than that of the active layer (61) on both sides of the active layer (61).
It has a double heterostructure sandwiched between layers 13 and 17), and a rib-shaped optical waveguide is formed by etching halfway through the upper cladding layer (17). The semiconductor laser has a refractive index waveguide structure near the cavity end face and a gain waveguide structure at the center of the chip. By creating a refractive index waveguide region and a gain waveguide region in one chip in this way, the advantages of the refractive index waveguide structure can be achieved while maintaining the multi-longitudinal mode oscillation feature of the gain waveguide structure. That is, low threshold value, high efficiency, low astigmatism, etc. can be satisfied at the same time.
【0003】0003
【発明が解決しようとする課題】しかし、従来技術によ
る半導体レーザでは、チップ中央部に利得導波領域を抱
えているため、通常の屈折率導波型半導体レーザに比べ
るとどうしても無効電流成分が大きくなり、しきい電流
値の上昇、あるいは発振効率の低下を招いてしまう。こ
の結果、一定の光出力を得るために大きな電流を流す必
要が生じ、チップの温度が上昇して、端面の光密度が光
学損傷レベルに達する前に、光出力は熱的に飽和してし
まう。この様なことから、従来技術のタイプの低雑音型
半導体レーザで高出力化を図るには、無効電流の削減に
よる、低しきい値化、高効率化を実現し、チップの発熱
を低く抑えることが必要である。[Problems to be Solved by the Invention] However, since conventional semiconductor lasers have a gain waveguide region in the center of the chip, they inevitably have a large reactive current component compared to a normal index-guided semiconductor laser. This results in an increase in the threshold current value or a decrease in oscillation efficiency. As a result, a large current needs to be applied to obtain a constant optical output, which increases the temperature of the chip and causes the optical output to thermally saturate before the optical density at the end face reaches the optical damage level. . For this reason, in order to achieve high output with conventional low-noise semiconductor lasers, it is necessary to reduce the reactive current to achieve a low threshold and high efficiency, and to keep the heat generation of the chip low. It is necessary.
【0004】0004
【課題を解決するための手段】本発明の半導体レーザは
、(1)少なくとも一方の端面近傍では屈折率導波路幅
と電流注入領域幅とを同じにして屈折率導波構造とし、
その他の領域では屈折率導波路幅を電流注入領域幅より
十分広くして利得導波構造とした、 III−V族化合
物半導体層よりなるリブ状の光導波路を有し、かつ該光
導波路II−VI族化合物半導体層で埋め込んだ構造の
半導体レーザにおいて、該半導体レーザの光導波路は、
少なくとも半導体基板上に積層された第1のクラッド層
、第1の光導波路層、活性層、第2の光導波路層、第2
のクラッド層より形成されており、かつ該活性層は井戸
層の数が1の単一量子井戸構造であることを特徴とする
。[Means for Solving the Problems] The semiconductor laser of the present invention has (1) a refractive index waveguide structure in which the refractive index waveguide width and the current injection region width are the same in the vicinity of at least one end face;
In other regions, the refractive index waveguide width is sufficiently wider than the current injection region width to form a gain waveguide structure, and the optical waveguide II- In a semiconductor laser having a structure embedded in a group VI compound semiconductor layer, an optical waveguide of the semiconductor laser is
At least a first cladding layer, a first optical waveguide layer, an active layer, a second optical waveguide layer, and a second optical waveguide layer are laminated on a semiconductor substrate.
The active layer has a single quantum well structure with one well layer.
【0005】(2)上記(1)記載の半導体レーザにお
いて、量子井戸層の数が2以上の複数であることを特徴
とする。(2) The semiconductor laser described in (1) above is characterized in that the number of quantum well layers is two or more.
【0006】[0006]
【実施例】本発明の半導体レーザの第1の実施例を、図
1、及び図2に示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a semiconductor laser according to the present invention is shown in FIGS. 1 and 2.
【0007】n型GaAs基板(11)上に、n型バッ
ファー層(12)、n型下側クラッド層(13)、n型
下側光導波路層(14)、量子井戸活性層(15)、p
型上側光導波路層(16)、p型上側クラッド層(17
)、p型コンタクト層(18)が順次積層されている。
コンタクト層、及び上側クラッド層はリブ状に加工され
て光導波路を形成しており、上記光導波路はII−VI
族化合物半導体であるZnSeによって埋め込まれてい
る。また、レーザチップは共振器端面近傍に屈折率導波
領域を、チップ中央部に利得導波領域をそれぞれ有して
いる。活性層はノンドープGaAsを井戸層とする単一
量子井戸で、井戸層の膜厚は50Å(0.005μm)
である。[0007] On an n-type GaAs substrate (11), an n-type buffer layer (12), an n-type lower cladding layer (13), an n-type lower optical waveguide layer (14), a quantum well active layer (15), p
mold upper optical waveguide layer (16), p-type upper cladding layer (17)
) and a p-type contact layer (18) are sequentially laminated. The contact layer and the upper cladding layer are processed into a rib shape to form an optical waveguide, and the optical waveguide is II-VI
It is filled with ZnSe, which is a group compound semiconductor. Further, the laser chip has a refractive index waveguide region near the cavity end face and a gain waveguide region at the center of the chip. The active layer is a single quantum well with non-doped GaAs as a well layer, and the thickness of the well layer is 50 Å (0.005 μm).
It is.
【0008】次に本発明の高出力半導体レーザの製造方
法を、図3、及び図4を用いて説明する。なお、図3は
屈折率導波領域、図4は利得導波領域における製造工程
中の断面図をそれぞれ示す。Next, a method for manufacturing a high-power semiconductor laser according to the present invention will be explained using FIGS. 3 and 4. Note that FIG. 3 shows a cross-sectional view of the refractive index waveguide region, and FIG. 4 shows a cross-sectional view of the gain waveguide region during the manufacturing process.
【0009】まず表1に示す様な積層構造を、n型Ga
As基板上に順次エピタキシャル成長する。成長はトリ
メチルガリウム((CH3)3Ga:TMG)等の有機
金属化合物、およびアルシン(AsH3) 等の水素化
物を原料とする有機金属化学気相成長法(MOCVD法
)によって行ない、その成長温度は730℃とする。First, a laminated structure as shown in Table 1 was prepared using n-type Ga.
Sequential epitaxial growth is performed on an As substrate. Growth is performed by metal organic chemical vapor deposition (MOCVD) using organometallic compounds such as trimethyl gallium ((CH3)3Ga:TMG) and hydrides such as arsine (AsH3) as raw materials, and the growth temperature is 730°C. ℃.
【0010】0010
【表1】[Table 1]
【0011】次いで、上記コンタクト層上に二酸化ケイ
素(SiO2 )等の絶縁膜(19)を熱CVD法によ
って蒸着し(図3,4(a))、フォトリソグラフィー
工程によってパターンニングする。さらに上記絶縁膜を
マスクとしてリブのエッチングを行う。リブのエッチン
グには硫酸系エッチャントを使用し、上側の光導波路層
とクラッド層の境界部までエッチングを行う(図3,4
(b))。Next, an insulating film (19) made of silicon dioxide (SiO2) or the like is deposited on the contact layer by thermal CVD (FIGS. 3 and 4(a)), and patterned by a photolithography process. Furthermore, ribs are etched using the insulating film as a mask. A sulfuric acid-based etchant is used to etch the ribs, and etching is performed to the boundary between the upper optical waveguide layer and the cladding layer (Figures 3 and 4).
(b)).
【0012】リブのエッチング後、絶縁物マスクを残し
たままの状態でリブをZnSeによって埋め込む。ここ
で行う埋め込み成長も、有機金属化学気相成長法によっ
て行なう。原料として、ジメチル亜鉛=ジメチルセレン
=アダクト(DMZn−DMSe)、及びセレン化水素
を用いた(図3,4(c))。After etching the ribs, the ribs are filled with ZnSe with the insulator mask left in place. The buried growth performed here is also performed by organometallic chemical vapor deposition. As raw materials, dimethylzinc=dimethylselenium adduct (DMZn-DMSe) and hydrogen selenide were used (FIGS. 3 and 4(c)).
【0013】リブ上に積層した多結晶ZnSeは、反応
性イオンビームエッチング(RIBE)法により除去す
る。ここでは、リブ上の多結晶ZnSeを完全に除去す
ると同時に、ZnSe、及びSiO2 のエッチングレ
ートの差を利用して、リブの上面とZnSe層の上面と
が同じ高さになる様にエッチング時間を調整し、チップ
に平坦化を図る(図3,4(d))。The polycrystalline ZnSe deposited on the ribs is removed by reactive ion beam etching (RIBE). Here, the polycrystalline ZnSe on the ribs is completely removed, and at the same time, by taking advantage of the difference in etching rates between ZnSe and SiO2, the etching time is increased so that the top surface of the rib and the top surface of the ZnSe layer are at the same height. Adjust and planarize the chip (Figures 3 and 4(d)).
【0014】リブ上に積層した多結晶ZnSeの除去後
、利得導波領域を作成する。利得導波領域においては、
電流注入幅を屈折率導波路幅より小さくする必要がある
。そこで、中央の電流注入領域以外のコンタクト層はエ
ッチングにより除去する。上側クラッド層はそのAl組
成が 0.45と大きいため、その上に電極を直接形成
してもコンタクトが取れず、電流注入領域以外から電流
が注入されるということはない(図4(e))。After removing the polycrystalline ZnSe layered on the ribs, a gain waveguide region is created. In the gain waveguide region,
It is necessary to make the current injection width smaller than the refractive index waveguide width. Therefore, the contact layer other than the central current injection region is removed by etching. Since the upper cladding layer has a high Al composition of 0.45, contact cannot be established even if an electrode is directly formed on it, and current is not injected from outside the current injection region (Fig. 4(e)). ).
【0015】以上のようにして、屈折率導波領域、利得
導波領域がそれぞれ形成された。最後に基板を100μ
m厚まで研磨し、p側、n側それぞれの電極を蒸着する
と、ZnSe埋め込み分離閉じ込め型単一量子井戸レー
ザ(SCH−SQW−LD)が完成する(図3,4(f
))。In the manner described above, the refractive index waveguide region and the gain waveguide region were respectively formed. Finally, attach the board to 100μ
After polishing to a thickness of m and depositing p-side and n-side electrodes, a ZnSe-embedded separated confinement single quantum well laser (SCH-SQW-LD) is completed (Figs. 3 and 4(f)
)).
【0016】本発明の半導体レーザの活性層は、その膜
厚が電子のド・ブロイ波長以下の量子井戸構造を有して
おり、活性層における電子、あるいは正孔の準位は量子
化されている。活性層が膜厚 0.1μm程度のバルク
結晶からなるダブルヘテロ構造半導体レーザに比べると
、活性層のエネルギー準位を量子化することによって、
発光効率は高く、しきい電流値は低くなる。The active layer of the semiconductor laser of the present invention has a quantum well structure whose film thickness is less than the de Broglie wavelength of electrons, and the level of electrons or holes in the active layer is quantized. There is. Compared to a double heterostructure semiconductor laser in which the active layer is made of a bulk crystal with a film thickness of about 0.1 μm, by quantizing the energy level of the active layer,
The luminous efficiency is high and the threshold current value is low.
【0017】チップの一部分に利得導波領域を導入する
ことによって低雑音化を図る半導体レーザにおいては、
利得導波領域においてある程度の無効電流が流れてしま
う。このため屈折率導波領域のみからなる半導体レーザ
(以下単純ストライプ型レーザと称する)に比べると、
一定の光出力を得るためにより多くの電流を流す必要が
生じる。特に高出力を得ようと大きな電流を流すと、レ
ーザチップの発熱量が増加して、端面が光学損傷(CO
D:Catastropic Optical Dam
age、以下CODと略する)レベルに達する前に、光
出力は熱的に飽和してしまう。ところが活性層を量子井
戸構造とした本発明の半導体レーザの場合は、光出力が
熱的に飽和することなく、最高出力 約75mWで端
面破壊した。チップの発熱を抑える、言い替えれば駆動
電流を小さくするために活性層に量子井戸構造を導入す
る効果は、無効電流成分が大きい場合程、有効である。In a semiconductor laser whose noise is reduced by introducing a gain waveguide region into a part of the chip,
A certain amount of reactive current flows in the gain waveguide region. Therefore, compared to a semiconductor laser consisting only of a refractive index waveguide region (hereinafter referred to as a simple stripe laser),
In order to obtain a constant light output, it becomes necessary to flow more current. In particular, when a large current is applied to obtain high output, the amount of heat generated by the laser chip increases, causing optical damage (CO) to the end face.
D: Catastropic Optical Dam
(hereinafter abbreviated as COD) level, the optical output becomes thermally saturated. However, in the case of the semiconductor laser of the present invention in which the active layer has a quantum well structure, the optical output was not thermally saturated and the end face was destroyed at a maximum output of about 75 mW. The effect of introducing a quantum well structure into the active layer in order to suppress heat generation of the chip, in other words, to reduce the drive current, is more effective when the reactive current component is large.
【0018】ところで、井戸層の膜厚を変えると、活性
層におけるキャリアのエネルギー準位が変化する。この
ことは、活性層の膜厚によって発振波長を変えることが
できることを意味する。従来、バルクの活性層を有する
半導体レーザにおいては、活性層のAl組成を変えるこ
とにより発振波長を制御していた。しかし量子井戸型半
導体レーザにおいては、井戸層の膜厚変化によっても発
振波長を制御することができるので、GaAsを活性層
の材質として使用することができる。GaAsは二元系
化合物半導体であり三元系であるAlGaAsと比較す
ると、制御性に優れ、良質の膜が得られやすい。このた
め、発光効率の向上が期待できる。By the way, when the thickness of the well layer is changed, the energy level of carriers in the active layer changes. This means that the oscillation wavelength can be changed depending on the thickness of the active layer. Conventionally, in a semiconductor laser having a bulk active layer, the oscillation wavelength has been controlled by changing the Al composition of the active layer. However, in quantum well semiconductor lasers, the oscillation wavelength can be controlled by changing the thickness of the well layer, so GaAs can be used as the material for the active layer. GaAs is a binary compound semiconductor, and compared to AlGaAs, which is a ternary compound semiconductor, it has excellent controllability and can easily produce a high-quality film. Therefore, improvement in luminous efficiency can be expected.
【0019】また活性層がAlGaAs系のバルク結晶
の場合、Al組成が 0.45を超えると直接遷移から
間接遷移になるため、レーザ発振が不可能になってしま
う。すなわち620nm以下の短波長レーザを作成する
ことはできない。しかし量子井戸レーザでは、井戸層、
及び障壁層のAl組成と膜厚を適当に選んでやることに
より、620nm以下の短波長で発振する半導体レーザ
を作成することも可能である。If the active layer is an AlGaAs-based bulk crystal, if the Al composition exceeds 0.45, the transition changes from direct to indirect, making laser oscillation impossible. That is, it is impossible to create a short wavelength laser of 620 nm or less. However, in quantum well lasers, the well layer,
By appropriately selecting the Al composition and film thickness of the barrier layer, it is also possible to create a semiconductor laser that oscillates at a short wavelength of 620 nm or less.
【0020】活性層を単一量子井戸構造ではなく、Ga
As及びAl0.3Ga0.7Asをそれぞれ井戸層、
障壁層とする二重量子井戸構造とすることによって、更
に高出力化を図ることができる。井戸層が1層のみの単
一量子井戸構造では、井戸層の膜厚が薄い、あるいは注
入電流が多いとき、キャリアが井戸層からオーバーフロ
ーしてしまう。この結果、発光に関与しない電流が増加
し、しきい電流値が上昇、発光効率が低下する。しかし
活性層に二重量子井戸構造を導入すると、活性層へのキ
ャリアの閉じ込めが強くなり、キャリアのオーバフロー
を低く抑えることができる。すなわち、量子井戸半導体
レーザの、発光効率をさらに高くする事ができる。[0020] The active layer is not a single quantum well structure but a Ga
Well layers of As and Al0.3Ga0.7As, respectively.
By using a double quantum well structure as a barrier layer, even higher output can be achieved. In a single quantum well structure with only one well layer, carriers overflow from the well layer when the well layer is thin or when the injection current is large. As a result, the current that is not involved in light emission increases, the threshold current value increases, and the luminous efficiency decreases. However, when a double quantum well structure is introduced into the active layer, carriers are more strongly confined in the active layer, and carrier overflow can be suppressed to a low level. In other words, the luminous efficiency of the quantum well semiconductor laser can be further increased.
【0021】図5は、本発明の第3の実施例を示すもの
で、(a)は屈折率導波領域、(B)は利得導波領域の
断面をそれぞれ示す。今までにあげた2種類の実施例と
の違いは、リブが基板に達するまでエッチングされてい
る点と、リブの埋め込みをGaAsと格子整合するZn
S0.06Se0.94(51)によって行っている点
の2点である。FIG. 5 shows a third embodiment of the present invention, in which (a) shows a cross section of the refractive index waveguide region and (B) shows a cross section of the gain waveguide region. The difference from the two examples mentioned above is that the ribs are etched until they reach the substrate, and the ribs are filled with Zn that lattice matches the GaAs.
These are the two points made by S0.06Se0.94 (51).
【0022】この実施例においては、活性層と格子定数
が一致するZnSSe混晶でリブを埋め込んでいるため
、格子ミスマッチに基づくストレスが活性層にかかりに
くくなっている。従って、活性層に格子欠陥が生じにく
くなり、この結果半導体レーザの信頼性、性能の向上が
可能となる。また、埋め込み層を形成するZnSSeの
側からみても、埋め込み成長中、リブ側面との界面にお
いてストレスが生じないため、良質の埋め込み層を形成
することができると同時に、リブ側面への密着性が向上
し、光波、及びキャリアの閉じ込め効果が向上する。In this embodiment, since the ribs are filled with ZnSSe mixed crystal whose lattice constant matches that of the active layer, stress due to lattice mismatch is less likely to be applied to the active layer. Therefore, lattice defects are less likely to occur in the active layer, and as a result, the reliability and performance of the semiconductor laser can be improved. Also, from the side of the ZnSSe that forms the buried layer, no stress is generated at the interface with the rib side surface during the buried growth, making it possible to form a high-quality buried layer and at the same time improving adhesion to the rib side surface. This improves the confinement effect of light waves and carriers.
【0023】なお、本発明の半導体レーザの実施例の説
明においては、埋め込み層としてII−VI族化合物半
導体であるZnSe、あるいはZnSSeを用いた場合
について説明を行ってきたが、他のII−VI族化合物
半導体を用いた場合でも、同様の効果を得ることができ
る。すなわち、VI族原料としてはセレン、硫黄、テル
ル等があげられ、II族原料としては亜鉛、カドミウム
等が利用でき、これらを組み合わせた、2元系、3元系
、4元系等の混晶においても、良好な特性を得ることが
できる。なお、いずれの場合でも、活性層を形成する
III−V族化合物半導体と埋め込み層とを格子マッチ
ングさせた方がよい結果が得られることは言うまでもな
い。In the description of the embodiments of the semiconductor laser of the present invention, the case where ZnSe or ZnSSe, which is a II-VI group compound semiconductor, is used as the buried layer has been explained. Similar effects can be obtained even when a group compound semiconductor is used. That is, selenium, sulfur, tellurium, etc. can be used as group VI raw materials, and zinc, cadmium, etc. can be used as group II raw materials, and mixed crystals of binary, ternary, and quaternary systems that combine these Also, good characteristics can be obtained. In addition, in any case, forming the active layer
It goes without saying that better results can be obtained by lattice matching the III-V compound semiconductor and the buried layer.
【0024】加えて、本発明の半導体レーザはAlGa
As系以外のレーザ材料、例えばInGaAsP系、I
nGaP系の材料に対しても同様に適用できる。また、
実施例において各層の導電型をすべて反対にした構造(
pをnに、nをpに置き換えた構造)についても同様の
効果が期待できる。In addition, the semiconductor laser of the present invention is made of AlGa
Laser materials other than As-based, such as InGaAsP-based, I
The present invention can be similarly applied to nGaP-based materials. Also,
In the example, the structure in which the conductivity type of each layer is all reversed (
Similar effects can be expected for structures in which p is replaced by n and n is replaced by p.
【0025】[0025]
【発明の効果】低雑音型半導体レーザに量子井戸活性層
を導入した本発明の半導体レーザは、以下の様な効果を
有する。Effects of the Invention The semiconductor laser of the present invention, in which a quantum well active layer is introduced into a low-noise semiconductor laser, has the following effects.
【0026】(1)量子井戸活性層を用いたことにより
、発光効率が飛躍的に向上すると同時に、発振しきい電
流値が低くなった。これは、活性層内のキャリアのエネ
ルギー準位が量子化されたためである。駆動電流が比較
的大きく発熱しやすい本発明の様な構造の半導体レーザ
においては、低しきい値化、高効率化は特に重要であり
、量子井戸構造の導入は非常に有効である。(1) By using a quantum well active layer, the luminous efficiency was dramatically improved, and at the same time, the oscillation threshold current value was lowered. This is because the energy levels of carriers in the active layer are quantized. In a semiconductor laser having a structure like the present invention in which the drive current is relatively large and heat is easily generated, lowering the threshold value and increasing efficiency are particularly important, and the introduction of a quantum well structure is very effective.
【0027】(2)従来、発振波長の制御は、活性層の
Al組成の変化によって行なっていた。しかし、活性層
を量子井戸構造とすると、井戸層の膜厚変化によって発
振波長を変えることができる様になる。この結果、良質
の結晶が得られるGaAsを、三元系化合物半導体であ
るAlGaAsの代わりに活性層に使用することができ
、発光効率が高く、信頼性に優れたレーザチップを得る
ことが可能となる。(2) Conventionally, the oscillation wavelength was controlled by changing the Al composition of the active layer. However, if the active layer has a quantum well structure, the oscillation wavelength can be changed by changing the thickness of the well layer. As a result, GaAs, which produces high-quality crystals, can be used in the active layer instead of AlGaAs, which is a ternary compound semiconductor, making it possible to obtain a laser chip with high luminous efficiency and excellent reliability. Become.
【0028】(3)量子井戸活性層においては、発振し
た光が活性層から上下の光導波路にしみだしやすく、活
性層の光密度が下がることから、高出力化が図れる。ま
た、端面の光学損傷を起こす光密度も、バルク活性層の
半導体レーザに比べ約 1.5〜2倍と高くなり、この
点も高出力化の点で有利である。(3) In the quantum well active layer, the oscillated light easily leaks out from the active layer into the upper and lower optical waveguides, and the optical density of the active layer decreases, so high output can be achieved. Furthermore, the light density that causes optical damage to the end facets is about 1.5 to 2 times higher than that of a semiconductor laser with a bulk active layer, which is also advantageous in terms of high output.
【0029】(4)活性層を多重量子井戸化することに
よって、活性領域からのキャリアのオーバーフローが抑
制される。すなわち、無効電流が減少しチップの発熱が
抑えられる。(4) By forming the active layer into a multiple quantum well, overflow of carriers from the active region is suppressed. That is, the reactive current is reduced and the heat generation of the chip is suppressed.
【図1】本発明の第1の実施例を示す斜視図。FIG. 1 is a perspective view showing a first embodiment of the present invention.
【図2】本発明の第1の実施例を示す断面図で、(a)
は屈折率導波領域、(b)は利得導波領域を示す断面図
。FIG. 2 is a cross-sectional view showing the first embodiment of the present invention, (a)
FIG. 4B is a cross-sectional view showing a refractive index waveguide region and FIG. 3B a gain waveguide region.
【図3】(a)から(f)は本発明の半導体レーザの屈
折率導波領域の製造工程を示す断面図。FIGS. 3(a) to 3(f) are cross-sectional views showing the manufacturing process of the refractive index waveguide region of the semiconductor laser of the present invention.
【図4】(a)から(f)は本発明の半導体レーザの利
得導波領域の製造工程を示す断面図。FIGS. 4(a) to 4(f) are cross-sectional views showing the manufacturing process of the gain waveguide region of the semiconductor laser of the present invention.
【図5】本発明の第2の実施例を示す断面図で、(a)
は屈折率導波領域、(b)は利得導波領域を示す断面図
。FIG. 5 is a sectional view showing a second embodiment of the present invention, (a)
FIG. 4B is a cross-sectional view showing a refractive index waveguide region and FIG. 3B a gain waveguide region.
【図6】従来技術を示す斜視図。FIG. 6 is a perspective view showing a prior art.
11 n型GaAs基板 12 n型GaAsバッファー層 13 n型AlGaAsクラッド層 14 n型AlGaAs光導波路層 15 量子井戸活性層 16 p型AlGaAs光導波路層 17 p型AlGaAsクラッド層 18 p型GaAsコンタクト層 19 SiO2 マスク 20 単結晶ZnSe 21 多結晶ZnSe 22 p型オーミック電極 23 n型オーミック電極 51 単結晶ZnSSe 61 活性層 11 N-type GaAs substrate 12 N-type GaAs buffer layer 13 N-type AlGaAs cladding layer 14 N-type AlGaAs optical waveguide layer 15 Quantum well active layer 16 p-type AlGaAs optical waveguide layer 17 p-type AlGaAs cladding layer 18 p-type GaAs contact layer 19 SiO2 mask 20 Single crystal ZnSe 21 Polycrystalline ZnSe 22 p-type ohmic electrode 23 N-type ohmic electrode 51 Single crystal ZnSSe 61 Active layer
Claims (2)
導波路幅と電流注入領域幅とを同じにして屈折率導波構
造とし、その他の領域では屈折率導波路幅を電流注入領
域幅より十分広くして利得導波構造とした III−V
族化合物半導体層よりなるリブ状の光導波路を有し、か
つ該光導波路II−VI族化合物半導体層で埋め込んだ
構造の半導体レーザにおいて、該半導体レーザの光導波
路は、少なくとも半導体基板上に積層された第1のクラ
ッド層、第1の光導波路層、活性層、第2の光導波路層
、第2のクラッド層より形成されており、かつ該活性層
は井戸層の数が1の単一量子井戸構造であることを特徴
とする半導体レーザ。Claim 1: A refractive index waveguide structure in which the refractive index waveguide width and the current injection region width are the same in the vicinity of at least one end face, and in other regions, the refractive index waveguide width is sufficiently wider than the current injection region width. III-V with a gain waveguide structure
In a semiconductor laser having a rib-shaped optical waveguide made of a group compound semiconductor layer and having a structure in which the optical waveguide is embedded with a group II-VI compound semiconductor layer, the optical waveguide of the semiconductor laser is laminated at least on a semiconductor substrate. The active layer is formed of a first cladding layer, a first optical waveguide layer, an active layer, a second optical waveguide layer, and a second cladding layer, and the active layer has a single quantum well layer of 1. A semiconductor laser characterized by a well structure.
ことを特徴とする請求項1記載の半導体レーザ。2. The semiconductor laser according to claim 1, wherein the number of quantum well layers is two or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7172891A JPH04307780A (en) | 1991-04-04 | 1991-04-04 | semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7172891A JPH04307780A (en) | 1991-04-04 | 1991-04-04 | semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04307780A true JPH04307780A (en) | 1992-10-29 |
Family
ID=13468873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7172891A Pending JPH04307780A (en) | 1991-04-04 | 1991-04-04 | semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04307780A (en) |
-
1991
- 1991-04-04 JP JP7172891A patent/JPH04307780A/en active Pending
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