JPH0432532U - - Google Patents
Info
- Publication number
- JPH0432532U JPH0432532U JP7352590U JP7352590U JPH0432532U JP H0432532 U JPH0432532 U JP H0432532U JP 7352590 U JP7352590 U JP 7352590U JP 7352590 U JP7352590 U JP 7352590U JP H0432532 U JPH0432532 U JP H0432532U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- laser beam
- laser
- laser oscillator
- oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011179 visual inspection Methods 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の第１の実施例を示すリード外
観検査装置の主要部の側面図、第２図は第１図の
リード外観検査装置を使用して四方向にリードが
突出する半導体装置のリード外観検査手順を説明
するための平面図、第３図は本考案の第２の実施
例を示すリード外観検査装置の主要部の断面図、
第４図はレーザビームの照射領域におけるリード
の位置を示す図、第５図は本考案の第３の実施例
におけるリード外観検査装置を説明するための図
である。
１ａ……レーザ発光・検知部、１ａ，１ｃ……
レーザ発振器、１ｂ，１ｄ……レーザセンサ、２
……反射鏡部、３……外郭体、４，４ａ，４ｂ…
…リード。
FIG. 1 is a side view of the main parts of a lead visual inspection device showing a first embodiment of the present invention, and FIG. 2 is a semiconductor device whose leads protrude in four directions using the lead visual inspection device of FIG. 1. FIG. 3 is a sectional view of the main parts of a lead visual inspection device showing a second embodiment of the present invention;
FIG. 4 is a diagram showing the position of a lead in the laser beam irradiation area, and FIG. 5 is a diagram for explaining a lead appearance inspection apparatus in a third embodiment of the present invention. 1a... Laser emission/detection section, 1a, 1c...
Laser oscillator, 1b, 1d...Laser sensor, 2
...Reflector part, 3... Outer body, 4, 4a, 4b...
...Lead.
Claims (1)
で突出するリードに対して、前記一方向及びこの
方向と垂直方向のいずれかの方向により、前記リ
ードに照射する所定のビーム系であるレーザビー
ムを発生するレーザ発振器と、 前記リードにより前記レーザビームが遮断され
た光を検知するレーザセンサとを備え、前記遮断
された残光量を測定することにより、前記リード
の曲りあるいは位置ずれの有無を判定することを
特徴とするリード外観検査装置。 ２ 前記レーザ発振器より発振するレーザビーム
径が前記リードの板厚より大きいことを特徴とす
る請求項１記載のリード外観検査装置。[Claims for Utility Model Registration] 1. Irradiating the leads that line up and protrude in one direction from the side surface of the outer body of the semiconductor device in either the one direction or a direction perpendicular to this direction. A laser oscillator that generates a laser beam of a predetermined beam system, and a laser sensor that detects light from which the laser beam is blocked by the lead, and by measuring the amount of afterglow after the interruption, the laser beam of the lead is detected. A lead appearance inspection device characterized by determining the presence or absence of bending or positional deviation. 2. The lead visual inspection apparatus according to claim 1, wherein the diameter of the laser beam oscillated by the laser oscillator is larger than the plate thickness of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7352590U JPH0432532U (en) | 1990-07-11 | 1990-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7352590U JPH0432532U (en) | 1990-07-11 | 1990-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0432532U true JPH0432532U (en) | 1992-03-17 |
Family
ID=31612413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7352590U Pending JPH0432532U (en) | 1990-07-11 | 1990-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432532U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003167022A (en) * | 2001-12-04 | 2003-06-13 | Seiko Epson Corp | Component detection method, component detection device, IC handler, and IC inspection device |
| WO2020070880A1 (en) * | 2018-10-05 | 2020-04-09 | 株式会社Ｆｕｊｉ | Measurement device and component mounting machine |
-
1990
- 1990-07-11 JP JP7352590U patent/JPH0432532U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003167022A (en) * | 2001-12-04 | 2003-06-13 | Seiko Epson Corp | Component detection method, component detection device, IC handler, and IC inspection device |
| WO2020070880A1 (en) * | 2018-10-05 | 2020-04-09 | 株式会社Ｆｕｊｉ | Measurement device and component mounting machine |
| JPWO2020070880A1 (en) * | 2018-10-05 | 2021-04-01 | 株式会社Ｆｕｊｉ | Measuring device and component mounting machine |
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