JPH0433537U - - Google Patents
Info
- Publication number
- JPH0433537U JPH0433537U JP7619990U JP7619990U JPH0433537U JP H0433537 U JPH0433537 U JP H0433537U JP 7619990 U JP7619990 U JP 7619990U JP 7619990 U JP7619990 U JP 7619990U JP H0433537 U JPH0433537 U JP H0433537U
- Authority
- JP
- Japan
- Prior art keywords
- steel plate
- adhesive layer
- thermosetting adhesive
- conductive thermosetting
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Description
第１図は、本考案の鋼板補強材を示す部分断面
図である。第２ａ図、第２ｂ図、第２ｃ図および
第２ｄ図は、本考案の鋼板補強材に用いるピン付
鋼板の好適例を示す線図的模式図である。第３ａ
図、第３ｂ図、第３ｃ図および第３ｄ図は、本考
案の鋼板補強材に用いるピン付鋼板の好適例を示
す部分断面図である。第４図は、従来の鋼板補強
材を示す部分断面図である。
符号の説明、１ａ……冷延鋼板、１ｂ……ピン
付鋼板、２……導電性接着剤層、３……非導電性
接着剤層、４……ピン、１０……鋼板補強材。
FIG. 1 is a partial sectional view showing the steel plate reinforcing material of the present invention. FIGS. 2a, 2b, 2c, and 2d are schematic diagrams showing preferred examples of the steel plate with pins used in the steel plate reinforcing material of the present invention. 3rd a
3b, 3c, and 3d are partial cross-sectional views showing preferred examples of the steel plate with pins used in the steel plate reinforcing material of the present invention. FIG. 4 is a partial sectional view showing a conventional steel plate reinforcing material. Explanation of symbols, 1a...Cold rolled steel plate, 1b...Steel plate with pin, 2...Conductive adhesive layer, 3...Non-conductive adhesive layer, 4...Pin, 10...Steel plate reinforcement material.
Claims (1)
非導電性熱硬化型接着剤層を介して導電性熱硬化
型接着剤層を有し、かつ、前記ピンの先端が前記
導電性熱硬化型接着剤層に埋入していることを特
徴とする鋼板補強材。 (2) 前記ピンが、鋼板のプレス打抜加工で形成
されたものである請求項１に記載の鋼板補強材。[Scope of claims for utility model registration] (1) On the surface of the steel plate with pins from which the pins protrude,
A conductive thermosetting adhesive layer is provided via a non-conductive thermosetting adhesive layer, and the tip of the pin is embedded in the conductive thermosetting adhesive layer. Steel plate reinforcement material. (2) The steel plate reinforcing material according to claim 1, wherein the pin is formed by press punching a steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7619990U JPH0433537U (en) | 1990-07-18 | 1990-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7619990U JPH0433537U (en) | 1990-07-18 | 1990-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0433537U true JPH0433537U (en) | 1992-03-18 |
Family
ID=31617448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7619990U Pending JPH0433537U (en) | 1990-07-18 | 1990-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0433537U (en) |
-
1990
- 1990-07-18 JP JP7619990U patent/JPH0433537U/ja active Pending
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