JPH0433557U - - Google Patents
Info
- Publication number
- JPH0433557U JPH0433557U JP7485090U JP7485090U JPH0433557U JP H0433557 U JPH0433557 U JP H0433557U JP 7485090 U JP7485090 U JP 7485090U JP 7485090 U JP7485090 U JP 7485090U JP H0433557 U JPH0433557 U JP H0433557U
- Authority
- JP
- Japan
- Prior art keywords
- cover
- wiring board
- longitudinal direction
- wiring
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
第１図は本考案によるサーマルヘツドの一実施
例を示す斜視図、第２図および第３図はそれぞれ
第１図のＡ−Ａ，Ｂ−Ｂ断面図、第４図および第
５図は第２図の作用説明図である。
１……放熱板、２……発熱体列、３……薄膜用
基板、４……ＩＣ、５……配線基板、６，７……
接着剤、８……カバー、９，１０……取付け穴、
１１……ねじ、１２……ねじ穴、１３……リベツ
ト、１４，１５……長穴またはばか穴からなる取
付け穴、１６……ワツシヤ、１７……抜け止め具
。
FIG. 1 is a perspective view showing an embodiment of the thermal head according to the present invention, FIGS. 2 and 3 are sectional views taken along lines A-A and B-B in FIG. 1, and FIGS. FIG. 2 is an explanatory diagram of the action of FIG. 1... Heat sink, 2... Heating element array, 3... Thin film substrate, 4... IC, 5... Wiring board, 6, 7...
Adhesive, 8...Cover, 9, 10...Mounting hole,
11...Screw, 12...Screw hole, 13...Rivet, 14, 15...Mounting hole consisting of an oblong hole or blank hole, 16...Washer, 17...Removal stopper.
Claims (1)
用基板と、配線部が形成された配線基板とを配置
し、少なくとも配線部の一部を覆うカバーを配線
基板上に設けたサーマルヘツドにおいて、前記カ
バーは、その長手方向の中央付近で、放熱板にね
じ込むねじにより配線基板を介して相対移動不能
に固定すると共に、長手方向の両端部近傍では、
カバーと配線基板の少なくとも一方の取付け穴を
長穴またはばか穴としてこれらの取付け穴に挿着
したリベツトにより、カバーを配線基板に対して
少なくとも長手方向に相対移動可能に結合したこ
とを特徴とするサーマルヘツド。 A thermal head in which a thin film substrate on which a heating element row is formed on the surface and a wiring board on which a wiring part is formed are arranged on a heat sink, and a cover is provided on the wiring board to cover at least a part of the wiring part. In the above, the cover is fixed so as not to be relatively movable via the wiring board by screws screwed into the heat sink near the center in the longitudinal direction, and near both ends in the longitudinal direction,
The cover is coupled to the wiring board so that the cover can move relative to the wiring board at least in the longitudinal direction by means of rivets inserted into the mounting holes of at least one of the cover and the wiring board as long holes or blank holes. thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7485090U JPH0433557U (en) | 1990-07-13 | 1990-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7485090U JPH0433557U (en) | 1990-07-13 | 1990-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0433557U true JPH0433557U (en) | 1992-03-18 |
Family
ID=31614907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7485090U Pending JPH0433557U (en) | 1990-07-13 | 1990-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0433557U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61230400A (en) * | 1985-04-05 | 1986-10-14 | 株式会社日立製作所 | Assembly structure for flexible printed circuit |
| JPH023834B2 (en) * | 1981-02-28 | 1990-01-25 | Sankin Ind Co |
-
1990
- 1990-07-13 JP JP7485090U patent/JPH0433557U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023834B2 (en) * | 1981-02-28 | 1990-01-25 | Sankin Ind Co | |
| JPS61230400A (en) * | 1985-04-05 | 1986-10-14 | 株式会社日立製作所 | Assembly structure for flexible printed circuit |
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