JPH0434016U - - Google Patents
Info
- Publication number
- JPH0434016U JPH0434016U JP7586490U JP7586490U JPH0434016U JP H0434016 U JPH0434016 U JP H0434016U JP 7586490 U JP7586490 U JP 7586490U JP 7586490 U JP7586490 U JP 7586490U JP H0434016 U JPH0434016 U JP H0434016U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- vibrating element
- vibrating
- sealing substrate
- extraction electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 12
- 238000000605 extraction Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本願第１の考案の一実施例にかかるチ
ツプ型圧電部品を示す図、第２図は上記実施例及
び従来例にかかる振動素子を示す図、第３図は上
記実施例にかかる封止基板を示す図、第４図は上
記チツプ型圧電部品の製造工程を説明する図、第
５図は本願第２の考案にかかるチツプ型圧電部品
を示す要部断面図、第６図は該圧電部品に用いら
れている傾斜機能材料からなる封止基板を示す図
、第７図及び第８図は従来のチツプ型圧電部品を
示す斜視図及び要部断面図、第９図は上記従来例
の封止基板を示す図である。
７ａ，１７ａ……上部封止基板、７ｂ，１７ｂ
……下部封止基板、９……外部電極、１０……電
極、１１……異方性導電膜、２１……圧電基板、
２２……振動電極、２３……引出し電極、２４…
…振動素子。
FIG. 1 is a diagram showing a chip type piezoelectric component according to an embodiment of the first invention of the present application, FIG. 2 is a diagram showing a vibration element according to the above embodiment and a conventional example, and FIG. 3 is a diagram according to the above embodiment. FIG. 4 is a diagram illustrating the manufacturing process of the chip-type piezoelectric component, FIG. 5 is a cross-sectional view of a main part of the chip-type piezoelectric component according to the second invention of the present application, and FIG. 6 is a diagram showing a sealing substrate. FIGS. 7 and 8 are perspective views and sectional views of essential parts of a conventional chip-type piezoelectric component, and FIG. It is a figure which shows the sealing board of an example. 7a, 17a...upper sealing substrate, 7b, 17b
... lower sealing substrate, 9 ... external electrode, 10 ... electrode, 11 ... anisotropic conductive film, 21 ... piezoelectric substrate,
22... Vibration electrode, 23... Extraction electrode, 24...
...Vibration element.
Claims (1)
する引出し電極を設けてなる振動素子と、 前記振動素子と対向する面に、少なくとも一部
が前記引出し電極と対向する電極を設けた、前記
振動素子を挾持する上部及び下部封止基板と、 前記封止基板に形成された電極と前記電極に対
向する前記振動素子の引出し電極との間に配設さ
れた異方性導電膜と、 前記振動素子の端面側に、前記上部封止基板の
端部上面から前記下部封止基板の端部下面にわた
つて形成された、前記振動素子の引出し電極及び
前記上部及び下部封止基板に形成された電極と接
続する外部電極と を具備するチツプ型圧電部品。 (2) 圧電基板に振動電極及び該振動電極と導通
する引出し電極を設けてなる振動素子と、 前記振動素子を挾持する封止基板であつて、両
端部が金属で構成され、中央部がセラミツクスで
構成された傾斜機能材料からなり、前記金属で構
成された部分の少なくとも一部が前記振動素子の
引出し電極と対向する上部及び下部封止基板と、 前記封止基板の金属で構成された部分と前記振
動素子の引出し電極の間に配設された異方性導電
膜と、 前記振動素子の端面側に、前記上部封止基板の
金属で構成された部分側の上面から前記下部封止
基板の金属で構成された部分側の下面にわたつて
形成された、前記振動素子の引出し電極と接続す
る外部電極と を具備するチツプ型圧電部品。[Claims for Utility Model Registration] (1) A vibrating element comprising a piezoelectric substrate provided with a vibrating electrode and an extraction electrode that is electrically connected to the vibrating electrode, and a surface facing the vibrating element, at least a portion of which is connected to the extraction electrode. upper and lower sealing substrates that sandwich the vibrating element and are provided with opposing electrodes, and disposed between the electrode formed on the sealing substrate and a lead-out electrode of the vibrating element that faces the electrode. an anisotropic conductive film; an extraction electrode of the vibrating element formed on the end surface side of the vibrating element from an upper surface of the end of the upper sealing substrate to a lower surface of the end of the lower sealing substrate; and a chip-type piezoelectric component comprising an external electrode connected to an electrode formed on a lower sealing substrate. (2) A vibrating element comprising a piezoelectric substrate provided with a vibrating electrode and an extraction electrode that conducts with the vibrating electrode; and a sealing substrate that clamps the vibrating element, both ends of which are made of metal and the center part of which is made of ceramic. upper and lower sealing substrates made of a functionally graded material, at least a part of which is made of metal and faces an extraction electrode of the vibrating element; and a portion of the sealing substrate made of metal. and an anisotropic conductive film disposed between the extraction electrode of the vibration element; and an anisotropic conductive film disposed between the lead electrode of the vibration element; A chip-type piezoelectric component comprising an external electrode formed over a lower surface of a portion made of metal and connected to an extraction electrode of the vibrating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586490U JPH084739Y2 (en) | 1990-07-16 | 1990-07-16 | Chip type piezoelectric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586490U JPH084739Y2 (en) | 1990-07-16 | 1990-07-16 | Chip type piezoelectric component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0434016U true JPH0434016U (en) | 1992-03-19 |
| JPH084739Y2 JPH084739Y2 (en) | 1996-02-07 |
Family
ID=31616822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7586490U Expired - Lifetime JPH084739Y2 (en) | 1990-07-16 | 1990-07-16 | Chip type piezoelectric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084739Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006057078A1 (en) * | 2004-11-25 | 2006-06-01 | Murata Manufacturing Co., Ltd. | Piezoelectric filter device |
-
1990
- 1990-07-16 JP JP7586490U patent/JPH084739Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006057078A1 (en) * | 2004-11-25 | 2006-06-01 | Murata Manufacturing Co., Ltd. | Piezoelectric filter device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH084739Y2 (en) | 1996-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |