JPH04343290A - Circuit board and manufacturing method and device thereof by one writing - Google Patents

Abstract

PURPOSE:To enable a circuit board to be manufactured at a low cost in a short time by a method wherein silver paste-containing conductive polymer is made to serve as a core wire, the core wire is sheathed with insulating polymer to form a polymer wiring, and the circuit board is wired with the polymer wiring concerned. CONSTITUTION:Conductive polymer 43 is mainly composed of conductive silver powder, polymer which electrically connects the silver powder together, and another polymer which solidifies the silver powder, and these components are kneaded into paste. Insulating polymer 44 is formed into a paste which sticks to the surface of a circuit board of epoxy or the like and is quickly enhanced in viscosity and solidified when it comes into contact with air. A capillary pen tip 45a which discharges conductive polymer 43 that serves as a core wire and a capillary pen tip 46a which discharges insulating polymer 44 that serves as insulating material covering the core wire are provided to the lower ends of a conductive material measuring section 45 and an insulating material measuring section 46. Therefore, a circuit board can be formed at a low cost in a short time.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a one-writing circuit board, a method for manufacturing the same, and an apparatus for manufacturing the same, which can significantly shorten the time it takes to create a prototype circuit board, which takes a very long time when prototyping electronic devices. be.

0002

2. Description of the Related Art Conventionally, circuit boards (printed boards) used in electronic devices such as word processors have been manufactured by various methods. For example, chemically etched substrates in which circuits are formed by chemical etching, flexible substrates produced by silk printing, and the like are being used in large quantities. However, these methods are not suitable for manufacturing a prototype circuit board for use in a prototype machine. That is, in the chemical etching method, it takes three to six weeks to produce one circuit board, and a large amount of harmful reagents must be used. Additionally, the silk printing method has the disadvantage that multilayer wiring cannot be achieved. The development of products such as word processors takes place in an extremely short period of time, about six months, but how quickly a prototype circuit board can be created within that short development period is critical to development competitiveness. Make a big impact. Such a prototype circuit board is generally called an instant board.

Conventionally, as a manufacturing method of such a circuit board, for example, Japanese Patent Publication No. 59-7238 discloses a method of manufacturing an electrically insulating material board having a covering made of a conductive material such as copper foil on one or both sides. A technique has been disclosed in which conductive material other than the wiring is scraped off by using a wire, but this method has the disadvantage that wiring cannot be crossed.

[0004] As another method, for example,
Japanese Patent No. 5-2134 discloses a technique for manufacturing a so-called multi-wire wiring board. This method involves forming a semi-hardened resin layer on the surface of an insulating substrate, fixing insulated wires in the desired shape on the surface, and drilling holes to cut the wires at the points where connections are required. In this method, the inside of the hole is metallized together with the exposed wire core wire to form a wiring board. However, this method requires large manufacturing equipment such as a numerically controlled wiring machine for running the wire, and has the disadvantage of being expensive.

On the other hand, International Publication No. WO89/11209, a patent application based on the Patent Cooperation Treaty, states that after wiring is drawn on a board with conductive ink (conductive polymer), insulating paint (insulating polymer) is applied. A method using a so-called circuit writer is disclosed. That is, in this method, terminal 1 is placed on the circuit board as shown in FIG. 8(A).
After drawing the conductive polymer 2 to be connected to the wiring pattern along the wiring pattern and drying it, the conductive polymer 2 is covered with an insulating polymer 3 and dried, as shown in FIG. Next, when forming cross wiring,
As shown in Figure (D), after wiring the conductive polymer 2' on the wiring and drying it, the conductive polymer 2' is coated with an insulating polymer 3' as shown in Figure (D). It is for drying. However, with the above wiring method,
Since the conductive polymers 2, 2' and the insulating polymers 3, 3' are drawn in separate steps, there is a drawback that wiring takes time. In addition, in this method, when forming wiring directly on the surface of an insulating circuit board, as shown in FIG. 9, insulating polymer 3a, 3b cannot be completely insulated unless it is covered, and furthermore, when wiring on a conductor such as copper foil 4 on the surface of the circuit board, insulating polymers 3c and 3d are coated on the copper foil 4 in two parts in advance. The conductive polymer 2 had to be wired after being laid down, and the insulating polymers 3a and 3b had to be coated on top of it. Therefore, it is necessary to draw the conductive polymer 2 and the insulating polymer 3 in 3 or 5 steps in order to form one wiring, and there is a waiting time for drying and other solidification for drawing the conductive polymer 2 and the insulating polymer 3. There was a drawback that it required

[0006]

[Problems to be Solved by the Invention] In other words, the conventional method of forming conductive polymers and insulating polymers in separate processes has the problem that it takes a lot of time to form all the circuit patterns on a circuit board. there were. In recent years, the development period for electronic devices has been shortened, and there is a need to create prototype circuit boards for use in these electronic devices in a short time and at low cost.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a one-writing circuit board, a method for manufacturing the same, and an apparatus for manufacturing the same, which can produce circuit boards for use in prototypes in a short time and at low cost in the development of electronic devices. shall be.

[0008]

[Means for Solving the Problems] In order to achieve the above object, the one-writing circuit board of the present invention has a polymer wiring in which a conductive polymer containing silver paste is used as a core wire and the core wire is covered with an insulating polymer. It is wired with. In addition, in the one-writing circuit board manufacturing method of the present invention, a conductive polymer containing silver paste is discharged as a core wire, and at the same time, a polymer wiring whose periphery is covered with an insulated wire polymer is placed on the board along a circuit pattern. This allows you to draw the image. Further, the one-writing circuit board manufacturing apparatus of the present invention includes a conductive material metering section that discharges a conductive polymer containing silver paste as a core wire, and an insulating material metering section that supplies an insulating polymer for simultaneously covering the periphery of the core wire. a circuit drawing pen having a part;
A control mechanism that controls the discharge of the conductive polymer of the conductive material measuring section and the insulating polymer of the insulating material measuring section, and a drive mechanism that moves the circuit drawing pen along the circuit pattern on the circuit board. It is.

[0009]

[Operation] According to the present invention, a conductive polymer containing silver paste is discharged as a core wire, and at the same time, a polymer wire is formed on a circuit board with the core wire covered with an insulating polymer. The number of forming steps is reduced, and circuit boards used for prototypes and the like in the development of electronic devices can be created in a short time and at low cost.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically explained below with reference to an embodiment shown in the drawings. FIG. 1 is a sectional view of a circuit drawing pen portion according to an embodiment of the present invention, FIG. 2 is a block diagram illustrating the configuration of a manufacturing apparatus according to an embodiment of the present invention, and FIG. 3 is an external perspective view of the manufacturing apparatus according to an embodiment of the present invention. 4 is a front view of the circuit drawing pen portion of the embodiment of the present invention.

As shown in FIG. 2, the circuit board manufacturing apparatus 11 of this embodiment performs conductive conduction based on wiring pattern data provided from a circuit pattern data input device 12 such as CAD for designing a circuit pattern of a printed circuit board. This is a device that directly draws wiring on a board, the periphery of which is covered with an insulating polymer, and includes a control device 13, an air pressure supply device 14, a pressure control mechanism 15, a drive control mechanism 16, and a circuit drawing mechanism 17. It is composed of. The above control device 1
3 gives a control signal to the pressure control mechanism 15 to discharge conductive polymer and insulating polymer wiring materials by air pressure, respectively, based on the wiring pattern data given from the circuit pattern data input device 12, and drives the pressure control mechanism 15. This is a part that gives a control signal to the control mechanism 16 to move the circuit board along the circuit pattern. The circuit drawing mechanism 17 includes a circuit drawing pen for discharging wiring material, which will be described later, and a head portion for driving the circuit drawing pen, which will be described later. A drive control mechanism 16 causes the circuit drawing pen to move along the circuit pattern on the board.

As shown in FIG. 3, the external appearance of the circuit board manufacturing apparatus 11 is such that the operation surface side of the upper part of the casing 21 is covered with a transparent cover 22, and a circuit board 23 is placed inside the case 21 in the horizontal direction. A table 24 that moves is provided, and a mounting block 26 constituting a head portion 25, a box 27, and a circuit drawing pen 28 are provided on the top of the table 24. The head portion 25 is configured to move in the horizontal direction and the vertical direction.

The table 24, as shown in FIG.
It is guided by two guide rods 29, 29 arranged in parallel in the horizontal front-rear direction (Y direction perpendicular to the plane of the paper in FIG. 4) on both left and right ends, and a pulse motor for moving in the front-rear horizontal direction is provided at the bottom. A Y-direction drive screw 30 is provided which is driven by a motor or the like. Furthermore, the mounting block 26 constituting the head section 25 is guided by a guide rod 31 arranged in the left-right horizontal direction (X direction), and is driven by a pulse motor or the like to move along the guide rod 31. An X-direction drive screw 32 is provided. box 30
is attached to a guide groove formed on the front side of the mounting block 26 so as to be movable in the vertical direction (Z direction) using a pulse motor, etc. Also, at the bottom of the box 27, a circuit drawing pen 2 is attached.
8 is installed.

As shown in FIG. 1, the circuit drawing pen 28 is provided with a cylindrical conductive material storage section 41 and an insulating material storage section 42 each having an open top. conductive polymer 43 and insulating polymer 44
is stored. The conductive polymer 43 is mainly composed of silver powder that controls conductivity, a polymer for electrically connecting the silver powder, and a polymer for solidifying.
These are mixed to form a paste. The insulating polymer 44 is made of a polymer such as epoxy that adheres to the surface of the circuit board, rapidly thickens and solidifies when it comes into contact with air, and has insulating properties, and is formed into a paste form. Between the conductive material storage section 41 and the insulating material storage section 42, there is provided a conductive material measuring section 45 which is a cylindrical double tube with an open top and a small inner diameter.
and an insulating agent measuring section 46 constituting the outer tube are integrally provided. The reason why the inner diameter is formed small is to enable accurate control of the amount of polymer discharged. The lower end sides of the conductive material measuring section 45 and the insulating material measuring section 46 are as follows:
Conductive polymer 43 each formed into a thin tube and serving as a core wire
A pen tip portion 45a for discharging a core wire and a pen tip portion 46a for discharging an insulating polymer 44 which is an insulating material covering the core wire are formed. The pen tip 45a of the conductive material measuring section 45 projects slightly below the pen tip 46a of the insulating material measuring section 46. The inside of the conductive material storage section 41 and the inside of the conductive material measuring section 45 are communicated through a supply path 47, and the inside of the insulating material storage section 42 and the inside of the insulating material measuring section 46 are connected through a supply path 48.
It is communicated with. In the middle of these supply channels 47 and 48, there are valves 4 each formed in a rod shape that moves up and down.
9,50 are provided. These valves 49 and 50 are connected to supply channels 47 and 4 by springs 51 and 52, respectively.
8 are always closed, and the supply passages 47 and 48 are opened by applying pressing forces F1 and F2 from below against the respective springs 51 and 52. Inside the upper side of the conductive material storage section 41, the insulating material storage section 42, the conductive material measuring section 45, and the insulating material measuring section 46, plugs 53, 54, 55, 5 are provided to prevent the polymer from drying.
6 is provided. Then, the circuit drawing pen 28 uses the control pressures P1, P2, P formed at the lower end of the box 27.
3. Connection ports 27a, 27b, 27c, 2 that supply P4
7d, a conductive material storage section 41, an insulating material storage section 42,
The upper end openings of the conductive material measuring section 45 and the insulating material measuring section 46 are connected.

Next, an example of the operation of the circuit board manufacturing apparatus having the above configuration will be specifically explained. FIG. 5 is a flowchart showing an example of the operation of the embodiment of the invention, FIG. 6 is a timing chart of pressure control in the embodiment of the invention, and FIG. 7 is a perspective view illustrating the wiring state of the embodiment of the invention.

First, before wiring is drawn, wiring material is filled (step ST1 in FIG. 5). That is, valve 4
9, a pressing force F is applied from below against the urging force of the spring 51.
1 to open the supply path 47 and apply pressure P1 to the conductive material storage section 41 at the timing shown in FIG. . Next, after closing the valve 49, the valve 50
A pressing force F2 is applied from below against the urging force of the spring 52.
By applying pressure P2 to the insulating material storage section 42 at the timing shown in FIG. 6(B), the insulating polymer 44 is filled into the insulating material metering section 46 through the supply channel 48.

Next, wiring is drawn (step ST2 in FIG. 5). That is, predetermined circuit pattern data has already been input to the circuit pattern data input device 12, and this pattern data is given to the drive control mechanism 16 from the control device 13. As a result, the pulse motors of each part are driven, and the head section 25 is driven in the X direction along the guide rod 32 by the X direction drive screw 32, and the table 24 is driven in the Y direction by the Y direction drive screw 30 along the guide rods 29, 29. The pen tips 43a and 44a of the circuit drawing pen 28 can be moved to draw a predetermined circuit pattern on the circuit board 23. Simultaneously with this circuit pattern drawing operation, pressures P3 and P4 are applied to the conductive material measuring section 45 and the insulating material measuring section 46 via the pressure control mechanism 15 at the timings shown in FIGS. 6(C) and (D). That is, when the pen tips 43a and 44a of the circuit drawing pen 27 are located on the terminal portion of the circuit board 23, the pressure P is initially applied.
3 is applied to the conductive material measuring section 45, and then, after the drawing operation has elapsed t1, a pressure P4 is applied to the insulating material measuring section 46. Therefore, the conductive polymer 43 is discharged from the pen tip 45a of the conductive material measuring section 45, and then after t1, the insulating material measuring section 4
The insulating polymer 44 is discharged from the pen tip 46a of No. 6. As a result, as shown in FIG. 7(A), the circuit board 2
The exposed conductive polymer 43 is connected to the terminal 61 of No. 3, and a wiring in which the periphery of the conductive polymer 43 is covered with an insulating polymer 44 is formed in the subsequent portion. Similarly, at the end of the circuit pattern, the pressure P3
The conductive polymer 43 can be connected to other terminals by stopping the supply of the pressure P4 after t2 after the supply of the pressure P4 is stopped. Such a circuit pattern is drawn on the entire surface of the circuit board in areas where the wiring does not intersect.

Next, after the wiring is drawn, the wiring is dried (step ST3 in FIG. 5). That is, the circuit board 23 is moved on the table 24 to a drying section equipped with an air blower (not shown), and the drawn wiring is bonded to the circuit board 23 by blowing air and simultaneously solidified.

Next, intersecting cross wirings are drawn in the same manner (step ST4 in FIG. 5), and then they are similarly moved to the drying section and dried (step ST5 in FIG. 5). As a result, as shown in FIG. 7(B), the wiring is formed in a state that it crosses over the wiring formed first.

[0020] As described above, according to the above configuration, wiring can be drawn simultaneously covered with insulating polymer 44 around the conductive polymer 43 based on the circuit pattern by one writing process, thereby reducing the number of wiring steps. This makes it possible to produce prototype circuit boards in a short lead time, and eliminates the need to create a block plate during prototyping, reducing costs.

[0021] In the present invention, the circuit drawing pen 28 transfers the conductive polymer 43 in the conductive material measuring part 45 to the pen tip part 45.
It is sufficient that the insulating polymer 44 in the insulating material metering part 46 is discharged from the pen tip part 46a and simultaneously coated around the conductive polymer 43 while the insulating polymer 44 in the insulating material metering part 46 is discharged from the tip part 46a. but not limited to. Further, the conductive polymer 43 and the insulating polymer 44 preferably have a viscosity that allows them to maintain their discharged state, and may have a property of rapidly solidifying immediately after being discharged.

[0022]

As explained above, according to the present invention, a conductive polymer containing silver paste is discharged as a core wire, and at the same time, the core wire is covered with an insulating polymer. By forming the wire, the number of steps for forming the polymer wiring is reduced.
In the development of electronic devices, circuit boards for use in prototype devices can be produced in a short time and at low cost.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a circuit drawing pen portion according to an embodiment of the present invention.

FIG. 2 is a block diagram illustrating the configuration of a manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is an external perspective view of a circuit board manufacturing apparatus according to an embodiment of the present invention.

FIG. 4 is a front view of the circuit drawing pen portion of the embodiment of the present invention.

FIG. 5 is a flowchart showing an example of the operation of the embodiment of the present invention.

FIG. 6 is a timing chart of pressure control according to the embodiment of the present invention.

FIG. 7 is a perspective view illustrating the wiring state of the embodiment of the present invention.

FIG. 8 is a diagram showing a conventional polymer wiring method.

FIG. 9 is a cross-sectional view of a conventional polymer wiring.

FIG. 10 is a cross-sectional view of a conventional polymer wiring.

[Brief explanation of drawings]

11 Circuit board manufacturing equipment 12 Circuit pattern data input device 13 Control device 14 Air pressure supply device 15 Pressure control mechanism 16 Drive control mechanism 17 Circuit drawing mechanism 23 Circuit board 24 Table 25 Head part 26 Mounting block 27 Box 28 Circuit drawing pen 41 Conductive material storage section 42 Insulating material storage section 43 Conductive polymer 44 Insulating polymer 45 Conductive material measuring section 46 Insulation material measuring section 61 Terminal

Claims (3)

[Claims] 1. A one-writing circuit board that is wired with polymer wiring in which a conductive polymer containing silver paste is used as a core wire and the core wire is covered with an insulating polymer. 2. Manufacturing a circuit board by one writing method, in which a conductive polymer containing silver paste is discharged as a core wire, and at the same time, polymer wiring is drawn on the substrate along a circuit pattern, the core wire being covered with an insulating wire polymer. Method. 3. A circuit drawing pen comprising: a conductive material measuring section for discharging a conductive polymer containing silver paste as a core wire; and an insulating material measuring section for supplying an insulating polymer for simultaneously covering the periphery of the core wire; A one-writing system comprising a control mechanism for controlling the discharge of a conductive polymer in a material measuring section and an insulating polymer in an insulating material measuring section, and a drive mechanism for moving the circuit drawing pen along a circuit pattern on a circuit board. Circuit board manufacturing equipment.