JPH04347607A - Manufacture of card substrate for ic card and mold for manufacture - Google Patents

Abstract

PURPOSE:To provide a method and mold for manufacturing card substrate for an IC card free from a strain and excellent in appearance with good precision without deteriorating the mechanical strength. CONSTITUTION:In a method for producing the card substrate for an IC card, a force-feeding port 40 of resin is provided to the projected part 38 of a die for forming a recessed part 36 for burying wherein an IC module is buried. Molten resin is introduced into a cavity 6 formed to the inside of the die through the force-feeding port 40 of resin and solidified to mold the card substrate 42.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to a method for manufacturing a card base material for an IC card and a mold for manufacturing it, and particularly relates to a method for manufacturing a card base material for an IC card and a mold for manufacturing the IC card.
The present invention relates to a manufacturing method for manufacturing cards and a manufacturing mold that is directly used to carry out the manufacturing method.

0002

2. Description of the Related Art A general IC card is manufactured by embedding an IC module in a embedding recess formed in a card base material. Conventionally, methods shown in FIGS. 3 and 4 are known as methods for manufacturing card base materials by injection molding.

In the conventional example shown in FIGS. 3 and 4, a cavity 6 is formed between an upper mold 2 and a lower mold 4, and melt is introduced into the cavity 6 from resin injection ports 8, 8 formed in the upper mold. Card base materials for IC cards are manufactured by pouring resin and solidifying it. However, as shown in Figure 4,
Card base material 10 for an IC card manufactured in this way
Traces 8a, 8a of resin injection ports 8, 8 remain on the surface of
This has problems in that it significantly impairs the appearance of the card and also damages the printed area on the surface of the card base material.

0004

SUMMARY OF THE INVENTION In order to solve these problems, a method of manufacturing a card base material for an IC card as shown in FIGS. 5 and 6 can be considered. In the method shown in FIGS. 5 and 6, a resin injection port 12 is provided at the end of a cavity 6 formed between an upper mold 14 and a lower mold 16, and after resin is injected from there and injection molding is performed, A card base material 18 as shown in FIG. 6 is manufactured, and the mark 12a of the resin injection port is scraped off from the end of the base material. In this manufacturing method,
A resin injection port 1 is provided on the surface of the card base material 18 for an IC card.
2 does not leave any traces, but it has the following problems.

The thickness of the card base material 18 shown in FIG.
It is as thin as 76 to 0.84 mm, and the card base material is 18 mm.
Since the thickness of the IC module embedded in the embedding recess 20 is as thin as about 0.55 to 0.65 mm, the thinnest part of the card base material 18 is only 0.2 mm. For this reason, in the method of press-fitting resin from the card edge, even if a highly fluid resin is used, it is difficult for the resin to get around to the back side of the mold protrusion 22 shown in FIG. 5 for forming the embedding recess. Therefore, there is a problem in that it is very difficult to mold the card base material 18 accurately without distortion. Moreover, when resin is press-fitted from the card end, a weld line 24 as shown in FIG. 6 is formed along the flow direction of the resin, and the strength is weak against bending loads along that line. It also has

The present invention was made in order to effectively solve the problems of the prior art, and it is possible to reduce the mechanical strength of a card base material for an IC card, which is free from distortion and has excellent appearance. It is an object of the present invention to provide a manufacturing method and a manufacturing mold for a card base material for an IC card, which can be manufactured with high accuracy without any problems.

[0007]

[Means for Solving the Problems] In order to achieve the above object, the method for manufacturing a card base material for an IC card of the present invention includes a mold convexity for forming an embedding recess in which an IC module is embedded. A resin injection port is provided in the mold, and the molten resin is injected into a cavity formed in the mold through the resin injection port and solidified to form the card base material. Further, the mold for manufacturing the card base material for an IC card of the present invention has a resin pressure for injecting molten resin into the cavity in the mold convex part for forming the embedding recess in which the IC module is buried. It is characterized by having an entrance.

[0008]

[Operation] In the present invention, a resin injection port for injecting molten resin into the cavity is provided in the convex part of the mold for forming the embedding recess in which the IC module is buried.
The molten resin injected from the resin injection port is not hindered by the protrusions of the mold and spreads throughout the cavity for forming the card, so no weld lines are formed in the finished product.

[0009]

[Example] Hereinafter, a method for manufacturing a card base material for an IC card and a manufacturing mold according to an example of the present invention will be explained in detail with reference to the drawings. FIG. 1 is a schematic sectional view of a main part of a mold for manufacturing a card base material for an IC card according to an embodiment of the present invention, and FIG. 2 is a card for an IC card manufactured by a manufacturing method according to an embodiment of the present invention. It is a top view of a base material.

As shown in FIG. 1, a mold 30 for manufacturing a card base material for an IC card according to an embodiment of the present invention has an upper mold 3.
2 and a lower mold 34. A cavity 6 for forming a card base material is formed between the upper mold 32 and the lower mold 34. Then, in either the upper mold 32 or the lower mold 34,
A mold protrusion 38 for forming a embedding recess 36 (shown in FIG. 2) in which the IC module is embedded is formed to protrude into the cavity 6.

In this embodiment, a resin injection port 40 is formed to open at the top of the mold convex portion 38 for forming the embedding recess, and the molten resin is injected through the resin injection port 40. It has become.

[0012] When manufacturing a card base material for an IC card by an injection molding method using such a mold 30 for manufacturing a card base material for an IC card, the upper mold 32 and the lower mold 34 are cut in a cut surface. They may be assembled so that they are in pressure contact with each other, and molten resin is injected from the resin injection port 40 and solidified. After that, upper mold 3
2 and the lower mold 34 and take out the product from the cavity 6, a card base material 42 as shown in FIG. 2 is obtained.

Manufacturing mold 30 according to this embodiment
According to the manufacturing method using the method, a resin press inlet 4 for injecting molten resin into the cavity 6 is provided in the mold convex portion 38 for forming the embedding recess 36 in which the IC module is embedded.
0 is provided, the molten resin injected from the resin injection port 40 is not hindered by the mold convex portion and is distributed throughout the cavity for forming the card, resulting in the card base material 42 as a completed product. No weld lines will be formed. Therefore, it is possible to prevent the mechanical strength of the card from decreasing due to the weld line.

Furthermore, in this embodiment, as shown in FIG.
The molding mark 40a of the resin injection port 40 is formed in the embedding recess 36, but since the IC module is buried in the embedding recess 36, the molding mark 40a is hidden. Therefore, the appearance of the IC card is not impaired. Moreover, in this method, the molding mark 40a is not formed on the surface of the card base material 42, so that the card base material can be manufactured with high dimensional accuracy.

It should be noted that the present invention is not limited to the above-mentioned embodiments, but can be variously modified within the scope of the present invention.

[0016]

As explained above, according to the present invention, the resin pressure for injecting molten resin into the mold convex part for forming the embedding recess in which the IC module is buried is increased. Since the inlet is provided, no trace of the resin injection port remains on the card surface, and the card surface on which the printing area is formed becomes smooth, improving the appearance and making the printing process on the card surface easier. Further, according to the present invention, the resin can circulate well into the cavity, improving the moldability of the thin part of the card, and making it possible to mold the recessed part for embedding the IC module with high precision.
It also makes it easier to bury the module. Furthermore, since weld lines are not formed, the mechanical strength of the card does not decrease.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view of a main part of a mold for manufacturing a card base material for an IC card according to an embodiment of the present invention.

FIG. 2 is a plan view of a card base material for an IC card manufactured by a manufacturing method according to an embodiment of the present invention.

FIG. 3 is a schematic sectional view of a main part of a mold for manufacturing a card base material for an IC card according to a conventional example.

FIG. 4 is a plan view of a card base material for an IC card according to a conventional example.

FIG. 5 is a schematic sectional view of a main part of a mold for manufacturing a card base material for an IC card according to a conventional example.

FIG. 6 is a plan view of a card base material for an IC card according to a conventional example.

[Explanation of symbols]

6 Cavity 30 Manufacturing mold 32 Upper mold 34 Lower mold 36 Recess for burial 38 Mold protrusion 40 Resin pressure inlet 42 Card base material for IC cards

Claims (2)

[Claims] 1. A method for manufacturing a card base material for an IC card in which an embedding recess in which an IC module is embedded is formed by an injection molding method, wherein a mold protrusion for forming the embedding recess is provided with: A card base material for an IC card, characterized in that a resin press port is provided, and a molten resin is injected into a cavity formed in a mold through the resin press port, and the card base material is formed by solidifying the resin press port. Production method. 2. A manufacturing mold for manufacturing a card base material for an IC card by an injection molding method, in which a recess for embedding an IC module is formed, a mold for forming the recess for embedding. A mold for manufacturing a card base material for an IC card, characterized in that a resin press inlet for injecting molten resin into a cavity is provided in a convex part of the mold.