JPH0434764U - - Google Patents
Info
- Publication number
- JPH0434764U JPH0434764U JP7676390U JP7676390U JPH0434764U JP H0434764 U JPH0434764 U JP H0434764U JP 7676390 U JP7676390 U JP 7676390U JP 7676390 U JP7676390 U JP 7676390U JP H0434764 U JPH0434764 U JP H0434764U
- Authority
- JP
- Japan
- Prior art keywords
- leadless chip
- board
- electrode
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案に係るプリント基板の一実施例
を示す縦断面図、第２図は第１図のプリント基板
にチツプ部品を実装した例を示す縦断面図、第３
図は本考案プリント基板に圧入専用チツプ部品を
実装した第２の実施例を示す縦断面図、第４図は
半田付けによつてチツプ部品をプリント基板に実
装した従来例を示す縦断面図、第５図は同じく半
田付けによつてチツプキヤリアをプリント基板に
実装した従来例を示す縦断面図である。
１……プリント基板、２……基板ランド、３…
…チツプ部品、４……チツプ部品電極、８……チ
ツプ固定部材。
FIG. 1 is a vertical sectional view showing an embodiment of the printed circuit board according to the present invention, FIG. 2 is a vertical sectional view showing an example in which chip components are mounted on the printed circuit board of FIG. 1, and FIG.
The figure is a vertical cross-sectional view showing a second embodiment in which a press-fit chip component is mounted on a printed circuit board of the present invention, and FIG. 4 is a vertical cross-sectional view showing a conventional example in which a chip component is mounted on a printed circuit board by soldering. FIG. 5 is a longitudinal sectional view showing a conventional example in which a chip carrier is mounted on a printed circuit board by soldering. 1... Printed circuit board, 2... Board land, 3...
...Chip component, 4...Chip component electrode, 8...Chip fixing member.
Claims (1)
を固定し、前記基板ランドとリードレスチツプの
電極とを電気的に結合するプリント基板において
、前記基板上に、リードレスチツプを圧入して基
板ランドとリードレスチツプの電極とを圧着固定
する固定部材を具備してなることを特徴とするプ
リント基板。 In a printed circuit board in which a leadless chip is fixed on a board land via an electrode, and the board land and the electrode of the leadless chip are electrically connected, the leadless chip is press-fitted onto the board and the leadless chip is connected to the board land. A printed circuit board comprising a fixing member for crimping and fixing an electrode of a leadless chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7676390U JPH0434764U (en) | 1990-07-19 | 1990-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7676390U JPH0434764U (en) | 1990-07-19 | 1990-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434764U true JPH0434764U (en) | 1992-03-23 |
Family
ID=31618527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7676390U Pending JPH0434764U (en) | 1990-07-19 | 1990-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434764U (en) |
-
1990
- 1990-07-19 JP JP7676390U patent/JPH0434764U/ja active Pending