JPH0435543B2 - - Google Patents
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- Publication number
- JPH0435543B2 JPH0435543B2 JP59117851A JP11785184A JPH0435543B2 JP H0435543 B2 JPH0435543 B2 JP H0435543B2 JP 59117851 A JP59117851 A JP 59117851A JP 11785184 A JP11785184 A JP 11785184A JP H0435543 B2 JPH0435543 B2 JP H0435543B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- electrical discharge
- discharge machining
- electrode wire
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
技術分野
本発明は、ワイヤ放電加工用電極線に関するも
のである。
背景技術
ワイヤ放電加工(以下、単に放電加工と称す)
法とは、被加工物とワイヤ放電加工用電極線(以
下、電極線と称す)との間に水等の加工液を媒体
として放電を行わせ、該電極線と被加工物とを相
対的に移動させて被加工物を所望の形状に切断加
工するものであり、従来から実施されている方法
である。
この放電加工法において、電極線としては通常
直径が0.03〜0.25mmφの長尺線を準備し、放電加
工部分に順次新しい線を供給して使用している。
従来、電極線としては、硬銅線、黄銅線、タン
グステン線、ZnまたはAl被覆黄銅線、0.1〜4%
Al−20〜38%Zn−Cu合金線が用いられているが
硬銅線、黄銅線は放電時に電極成分が被加工面に
付着することにより、加工速度及び寸法精度上の
制限を受ける。
タングステン線は放電加工速度が小さく、仕上
がり表面状態及び寸法精度は良いが、製造が困難
でコストが高い。ZnまたはAlで被覆された黄銅
線は低融点金属で被覆されているために、放電加
工時電極線をダイスに通すため火炎等で先端を針
状になるように切断の際、先端がボール状となり
ダイスに通することが困難で作業性が悪く、更
に、被覆層が芯材に比べ引張強度が劣り、そのた
め加工精度が劣る。0.1〜4%Al−20〜38%Zn−
Cu合金線は通常の黄銅線に比べ伸線加工性が劣
り、又放電加工条件によつては大量の銅分の転
移、付着が発生する。
発明の構成
本発明は、上述の欠点を解消するために成され
たもので、電極線の製造及び伸線加工が極めて容
易で、機械的強度が大きく放電加工時の張力が高
くとれ、加工精度が大で、表面が粗面のため表面
積が大きく水に対する濡れ性が良く、それに伴う
冷却効果により加工速度が大きく、表面が低融点
金属元素濃度が高いため被加工面への電極成分の
付着が少なく仕上がり状態が良く、しかも、融点
の低い部分が、極めて薄いため電極線の切断時、
先端にボール形成が起らないためダイス通し作業
性の良好なかつ、安価な電極線を提供せんとする
ものである。なお、前述の電極線の表面が粗面と
なるのは、表面層が例えばZn濃度が高い合金で
あり表面層の延性が低く伸線時、表面荒れが起こ
るためである。即ち、本発明の電極線は例えば素
材となる銅合金線を伸線し、次に、低融点金属又
はその金属の合金の溶湯中を通過させ、該低融点
金属、又は合金が銅合金線上に部分的に付着する
程度に石綿等で拭きとつた後更に、伸線した後焼
鈍することにより、付着した低融点金属又は合金
を銅合金線内に拡散、消失させることにより得ら
れる。また、低融点金属層を形成後、不活性ガス
雰囲気中で加熱することによつても容易に製造で
きる。
本発明を実施する時に使用する低融点金属元素
は、Bi、Sb、Zn、Cd、Pu、In、Sn、Pb、Mgま
たはAlのように、単体で融点が150〜700゜である
ものが好適である。K、Na、Rbのようなアルカ
リ金属は、融点は低いが、放電加工の媒体である
水と激しく反応するために使用できない。また、
常温で液体である水銀は、毒性が強く不適当であ
る。単体の融点が150〜700℃である上記元素の中
でもCdは毒性の点でやや問題があり、Puは高価
な上に放射能を有するために不適当である。従つ
て実用的に利用される元素はBi、Sb、Zn、In、
Sn、Pb、MgまたはAlに限定される。
こうして得られた電極線は第1図、第2図に示
すように外表面ほど低融点金属元素の濃度が高
く、それに伴つて銅元素濃度が低く、中心層に近
づくほどその傾向は逆転する。
ここで、最表面の銅元素濃度が0.1〜5%、全
体の銅元素濃度が61〜95%が望ましい。表面層の
銅元素濃度が0.1〜5%と限定した理由は、0.1%
以下では低融点金属元素の濃度が高いため、ダイ
ス通しの際の電極線の切断時、先端にボールが形
成され、ダイス通し作業が困難となり、5%以上
では放電加工時、被加工面への銅の付着量が増加
し仕上がり表面状態が悪くなる。次に、全体の銅
元素濃度が61〜95%と限定した理由は、61%以下
では導電率が低く、放電加工性が悪く、95%以上
では引張強度が小さく、放電加工時の張力を低く
させざるを得ないため加工精度が悪くなる。
本発明の特徴を以下に要約して述べる。
従来例で述べたように、表面における低融点合
金元素の存在は確かに放電加工性、特に放電時に
電極成分が被加工物に付着する現象を抑制する効
果が高い。しかしながら表面が単一な低融点金属
層で形成されている場合、低融点金属は放電によ
る消耗が大であり、効果の発揮には相当度好まし
くは10μ以上の厚みを必要とする。このことか
ら、前記の引張強さの低下による加工精度の低下
や、火炎切断時のボール形成による作業性の劣化
をもたらす。本発明は、付着現象への影響の大き
い外表面ほど低融点金属元素濃度を高めて付着防
止効果を維持し、導体内部ほどCu濃度を高くす
ることによつて放電による消耗を抑制する。しか
も、引張強さの低い低融点金属濃度の高い層は極
表面に限定されるため引張強さの低下はほとんど
なく、もちろんボール形成の問題もない。最表面
のCu元素も0.1〜5%であれば付着に対し全く悪
影響を与えない。引張強さが高いために加工時の
張力を大きくとることができ、さらに付着が減少
する結果をもたらす。
以下、本発明電極線を実施例に基いて説明す
る。
実施例
実施例 1
本発明No.2に示す1.0mmφの70%Cu−30%Zn黄
銅線をZnの溶湯(温度450℃)中を5秒間通過さ
せた後、石綿で絞り取り、しかる後、0.5mmφに
伸線した。
次に500℃、24時間焼鈍した後、更に、伸線し
て、0.2mmφの電極線を得た。この電極線を用い
て25mm厚のSKD−15工具鋼を切断したところ、
従来の硬銅線を100とした時の加工速度比は180、
被加工面への銅の付着量比は20という好結果を得
た。更に、ダイス通しの際の電極線の切断時、先
端にボールが形成されず、スムースにダイスに通
すことができた。
実施例 2
本発明No.5に示す0.8mmφの65%Cu−35%Zn黄
銅線に、電気めつきにより8μのSnの電気めつき
を施した。しかる後0.5mmφに伸線した。次に、
270℃、2時間拡散焼鈍した後、更に、伸線して、
0.2mmφの電極線を得た。この電極線を用いて25
mm厚のSKD−15工具鋼を切断したところ、従来
の硬銅線を100とした時の加工速度比は160、被加
工面への銅の付着量比は45という結果を得た。
又、ダイス通しの際の電極線の切断時、先端にボ
ールが形成されず、スムースにダイスに通すこと
ができた。なお、実施例1、2とも電極線の素材
である1.0φ,0.8φの黄銅線は途中中間焼鈍なし
で、5mmφの母材から得ることができた。
比較例 1
比較例No.2に示す1.0mmφの65%Cu−33%Zn−
2%Al線を伸線、熱処理工程を数回くり返し得
られた0.2mmφ電極線を用いて25mm厚のSKD−15
工具鋼を切断したところ、従来の硬銅線を100と
した時の加工速度比は160、被加工面への銅の付
着量比は70で後者の特性があまり良くないこと
と、5mmφの母材から1.0mmφに伸線するに当つ
て3回の中間焼鈍処理が必要であつた。
比較例 2
比較例No.1に示す1.0mmφの70%Cu−30%Zn黄
銅線をZnの溶湯(430℃)中を5秒間通過させた
後、表面に付着したZnを締り取らず直接伸線し
て0.2mmφの電極線を得た。この電極線を用いて
25mm厚のSKD−15工具鋼を切断したところ、従
来の硬銅線を100としたときの加工速度比は160、
被加工面への銅の付着量比は20という結果である
が、ダイス通しの際の切断時、先端に0.3mmφの
ボールが形成し、ダイス通し作業がすこぶる困難
であつた。これらの結果を第1表に示す。
Technical Field The present invention relates to an electrode wire for wire electrical discharge machining. Background technology Wire electrical discharge machining (hereinafter simply referred to as electrical discharge machining)
The method involves causing electrical discharge to occur between the workpiece and an electrode wire for wire electrical discharge machining (hereinafter referred to as the electrode wire) using a machining liquid such as water as a medium, and then making the electrode wire and the workpiece relative to each other. This is a conventional method in which the workpiece is cut into a desired shape by moving the workpiece. In this electric discharge machining method, a long wire having a diameter of usually 0.03 to 0.25 mm is prepared as the electrode wire, and new wires are sequentially supplied to the electric discharge machining area. Conventionally, electrode wires include hard copper wire, brass wire, tungsten wire, Zn or Al coated brass wire, 0.1 to 4%
Al-20 to 38% Zn-Cu alloy wire is used, but hard copper wire and brass wire are subject to limitations in machining speed and dimensional accuracy due to electrode components adhering to the machined surface during discharge. Although tungsten wire has a low electrical discharge machining speed and good surface finish and dimensional accuracy, it is difficult to manufacture and expensive. Brass wire coated with Zn or Al is coated with a low melting point metal, so when the electrode wire is cut into a needle shape using flame etc. in order to pass it through a die during electrical discharge machining, the tip ends up in a ball shape. This makes it difficult to pass through a die, resulting in poor workability.Furthermore, the coating layer has lower tensile strength than the core material, resulting in poor processing accuracy. 0.1~4%Al−20~38%Zn−
Cu alloy wire has poor wire drawability compared to ordinary brass wire, and depending on electrical discharge machining conditions, a large amount of copper may transfer or adhere. Composition of the Invention The present invention has been made to eliminate the above-mentioned drawbacks, and it is extremely easy to manufacture and draw an electrode wire, has high mechanical strength, can take high tension during electrical discharge machining, and has high processing accuracy. The rough surface has a large surface area and good wettability with water, and the accompanying cooling effect increases processing speed.The surface has a high concentration of low-melting metal elements, which prevents electrode components from adhering to the processed surface. In addition, the part with a low melting point is extremely thin, so when cutting the electrode wire,
It is an object of the present invention to provide an inexpensive electrode wire that has good workability when passed through a die because no ball formation occurs at the tip. Note that the reason why the surface of the electrode wire described above is rough is that the surface layer is made of, for example, an alloy with a high Zn concentration, and the surface layer has low ductility, causing surface roughness during wire drawing. That is, for the electrode wire of the present invention, for example, a copper alloy wire as a raw material is drawn, and then passed through a molten metal of a low melting point metal or an alloy of the metal, so that the low melting point metal or alloy is coated on the copper alloy wire. After wiping off the partially adhered wire with asbestos or the like, the wire is further drawn and annealed to diffuse and eliminate the adhered low melting point metal or alloy within the copper alloy wire. It can also be easily manufactured by heating in an inert gas atmosphere after forming a low melting point metal layer. The low melting point metal elements used in carrying out the present invention are preferably those having a melting point of 150 to 700°, such as Bi, Sb, Zn, Cd, Pu, In, Sn, Pb, Mg, or Al. It is. Although alkali metals such as K, Na, and Rb have low melting points, they cannot be used because they react violently with water, which is the medium for electrical discharge machining. Also,
Mercury, which is liquid at room temperature, is highly toxic and unsuitable. Among the above elements, which have a melting point of 150 to 700°C, Cd is somewhat problematic in terms of toxicity, and Pu is unsuitable because it is expensive and has radioactivity. Therefore, the elements that are practically used are Bi, Sb, Zn, In,
Limited to Sn, Pb, Mg or Al. As shown in FIGS. 1 and 2, the electrode wire thus obtained has a higher concentration of the low melting point metal element on the outer surface and a correspondingly lower concentration of the copper element, and this tendency reverses as it approaches the center layer. Here, it is desirable that the copper element concentration at the outermost surface be 0.1 to 5%, and that the overall copper element concentration be 61 to 95%. The reason why the copper element concentration in the surface layer was limited to 0.1 to 5% was 0.1%.
If the concentration is below 5%, the concentration of low-melting metal elements is high, and when the electrode wire is cut during passing through the die, a ball will be formed at the tip, making it difficult to pass through the die. The amount of copper deposited increases and the finished surface condition deteriorates. Next, the reason why the overall copper element concentration was limited to 61-95% is that below 61%, the conductivity is low and the electrical discharge machinability is poor, while above 95%, the tensile strength is low and the tension during electrical discharge machining is low. As a result, machining accuracy deteriorates. The features of the present invention will be summarized below. As described in the conventional example, the presence of a low melting point alloy element on the surface is certainly highly effective in suppressing electrical discharge machinability, particularly the phenomenon in which electrode components adhere to the workpiece during electrical discharge. However, when the surface is formed of a single low-melting point metal layer, the low-melting point metal is considerably consumed by discharge, and a thickness of considerably preferably 10 μm or more is required to exhibit the effect. This results in a decrease in processing accuracy due to the aforementioned decrease in tensile strength, and a deterioration in workability due to ball formation during flame cutting. The present invention maintains the adhesion prevention effect by increasing the low melting point metal element concentration on the outer surface, which has a greater influence on the adhesion phenomenon, and suppresses consumption due to discharge by increasing the Cu concentration toward the inside of the conductor. Moreover, since the layer with a high concentration of low melting point metal having low tensile strength is limited to the extreme surface, there is almost no decrease in tensile strength and, of course, there is no problem of ball formation. If the Cu element on the outermost surface is 0.1 to 5%, it will not have any adverse effect on adhesion. Due to its high tensile strength, high tension can be applied during processing, which further results in reduced adhesion. Hereinafter, the electrode wire of the present invention will be explained based on Examples. Examples Example 1 A 1.0 mmφ 70% Cu-30% Zn brass wire shown in Invention No. 2 was passed through molten Zn (temperature 450°C) for 5 seconds, and then squeezed out with asbestos. The wire was drawn to 0.5 mmφ. Next, after annealing at 500°C for 24 hours, the wire was further drawn to obtain an electrode wire with a diameter of 0.2 mm. When cutting 25mm thick SKD-15 tool steel using this electrode wire,
The processing speed ratio is 180 when the conventional hard copper wire is set as 100.
A good result was obtained with a ratio of copper adhesion to the processed surface of 20. Furthermore, when cutting the electrode wire when passing it through the die, no ball was formed at the tip, and the electrode wire could be passed through the die smoothly. Example 2 A 0.8 mmφ 65% Cu-35% Zn brass wire shown in Invention No. 5 was electroplated with 8 μm of Sn. After that, the wire was drawn to 0.5 mmφ. next,
After diffusion annealing at 270℃ for 2 hours, it was further wire drawn.
An electrode wire with a diameter of 0.2 mm was obtained. 25 using this electrode wire
When cutting mm-thick SKD-15 tool steel, the machining speed ratio was 160, and the ratio of copper adhesion to the workpiece surface was 45, with the conventional hard copper wire being 100.
Furthermore, when cutting the electrode wire when passing it through the die, no ball was formed at the tip, and the electrode wire could be passed through the die smoothly. In addition, in both Examples 1 and 2, brass wires of 1.0φ and 0.8φ, which are the raw materials for the electrode wires, could be obtained from a base material of 5 mmφ without intermediate annealing. Comparative Example 1 65% Cu-33% Zn- of 1.0 mmφ shown in Comparative Example No. 2
25mm thick SKD-15 was made using 0.2mmφ electrode wire obtained by drawing 2% Al wire and repeating the heat treatment process several times.
When tool steel was cut, the machining speed ratio was 160 when the conventional hard copper wire was set at 100, and the copper adhesion ratio to the workpiece surface was 70. Three intermediate annealing treatments were required to draw the wire to 1.0 mmφ from the material. Comparative Example 2 After passing the 1.0 mmφ 70% Cu-30% Zn brass wire shown in Comparative Example No. 1 through molten Zn (430°C) for 5 seconds, the wire was directly stretched without tightening the Zn attached to the surface. An electrode wire with a diameter of 0.2 mm was obtained. Using this electrode wire
When cutting 25mm thick SKD-15 tool steel, the machining speed ratio was 160 when the conventional hard copper wire was 100.
Although the ratio of the amount of copper deposited on the surface to be machined was 20, a ball of 0.3 mmφ was formed at the tip during cutting when passing through the die, making the process of passing through the die extremely difficult. These results are shown in Table 1.
【表】
第1表からわかるように本発明の電極線No.1〜
6は何れも最表面の銅元素濃度が0.5〜15%の範
囲で、ダイス通し作業性、放電加工特性(加工速
度、被加工面への銅の付着量)が良い。
比較例No.1は放電加工特性は優れているが、ダ
イス通し作業性が悪く、比較例No.2は伸線加工性
が悪いため、電極線の製造に至るまでに、数多く
の中間焼鈍が必要なことと、放電加工時、被加工
面に銅の付着量が多いという欠点がある。
効 果
上述のように、本発明による電極線は、製造が
容易で、ダイス通し作業性が良く、かつ、放電加
工特性が良く、従つて、放電加工におけるランニ
ング費用を軽減しうる顕著な効果を発揮するもの
である。[Table] As can be seen from Table 1, electrode wires of the present invention No. 1~
No. 6 has a copper element concentration on the outermost surface in the range of 0.5 to 15%, and has good die passing workability and electrical discharge machining characteristics (machining speed, amount of copper deposited on the surface to be machined). Comparative Example No. 1 has excellent electrical discharge machining properties, but has poor die threading workability, and Comparative Example No. 2 has poor wire drawability, so many intermediate annealing steps were required before producing the electrode wire. However, there is a disadvantage that there is a large amount of copper deposited on the surface to be machined during electrical discharge machining. Effects As described above, the electrode wire according to the present invention is easy to manufacture, has good workability through the die, and has good electrical discharge machining characteristics, and therefore has a remarkable effect of reducing running costs in electrical discharge machining. It is something that can be demonstrated.
第1図および第2図は、本発明のワイヤ放電加
工電極線の縦断面における直径方向の低融点金属
元素および銅元素の濃度分布の例を示す図であ
る。横方向は位置を示し、縦方向は低融点金属ま
たは銅の濃度を示すものである。
FIGS. 1 and 2 are diagrams showing examples of concentration distributions of low melting point metal elements and copper elements in the diametrical direction in a longitudinal section of the wire electric discharge machining electrode wire of the present invention. The horizontal direction indicates the position, and the vertical direction indicates the concentration of the low melting point metal or copper.
Claims (1)
少なくとも表面層において該金属線の外表面程高
いことを特徴とするワイヤ放電加工用銅合金電極
線。 2 低融点金属元素がBi、Sb、Zn、In、Sn、
Pb、Mg又はAlであることを特徴とする特許請求
の範囲第1項記載のワイヤ放電加工用銅合金電極
線。 3 Cu元素濃度が全体として61〜95%であるこ
とを特徴とする特許請求の範囲第1項又は第2項
のワイヤ放電加工用銅合金電極線。 4 最表面のCu元素濃度が0.1〜5%であること
を特徴とする特許請求の範囲第1項、第2項又は
第3項記載のワイヤ放電加工用銅合金電極線。[Claims] 1. The concentration of the low melting point metal element contained in the metal wire is
A copper alloy electrode wire for wire electrical discharge machining, characterized in that at least the surface layer is higher as the outer surface of the metal wire becomes higher. 2 Low melting point metal elements include Bi, Sb, Zn, In, Sn,
The copper alloy electrode wire for wire electrical discharge machining according to claim 1, characterized in that it is made of Pb, Mg or Al. 3. The copper alloy electrode wire for wire electrical discharge machining according to claim 1 or 2, characterized in that the overall Cu element concentration is 61 to 95%. 4. The copper alloy electrode wire for wire electrical discharge machining according to claim 1, 2, or 3, characterized in that the Cu element concentration on the outermost surface is 0.1 to 5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11785184A JPS60262930A (en) | 1984-06-07 | 1984-06-07 | Electrode wire made of copper alloy for wire discharge processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11785184A JPS60262930A (en) | 1984-06-07 | 1984-06-07 | Electrode wire made of copper alloy for wire discharge processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60262930A JPS60262930A (en) | 1985-12-26 |
| JPH0435543B2 true JPH0435543B2 (en) | 1992-06-11 |
Family
ID=14721851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11785184A Granted JPS60262930A (en) | 1984-06-07 | 1984-06-07 | Electrode wire made of copper alloy for wire discharge processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262930A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3718529B2 (en) * | 1997-07-30 | 2005-11-24 | 機哲 成 | Method for producing porous electrode wire for electric discharge machining |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2015909B (en) * | 1978-03-03 | 1982-12-01 | Charmilles Sa Ateliers | Electrode for spark erosion machining |
| CH634245A5 (en) * | 1979-10-11 | 1983-01-31 | Charmilles Sa Ateliers | Method and electrode for spark cutting |
| JPS56126528A (en) * | 1980-01-28 | 1981-10-03 | Furukawa Kinzoku Kogyo Kk | Composite electrode wire for wire-cut spark machining |
| JPS599298B2 (en) * | 1980-08-19 | 1984-03-01 | 古河電気工業株式会社 | Wire-cut electrode wire for electrical discharge machining |
-
1984
- 1984-06-07 JP JP11785184A patent/JPS60262930A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60262930A (en) | 1985-12-26 |
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| EXPY | Cancellation because of completion of term |