JPH0435859B2 - - Google Patents

Info

Publication number
JPH0435859B2
JPH0435859B2 JP58065921A JP6592183A JPH0435859B2 JP H0435859 B2 JPH0435859 B2 JP H0435859B2 JP 58065921 A JP58065921 A JP 58065921A JP 6592183 A JP6592183 A JP 6592183A JP H0435859 B2 JPH0435859 B2 JP H0435859B2
Authority
JP
Japan
Prior art keywords
proximity switch
proximity
lead frame
detection coil
switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58065921A
Other languages
Japanese (ja)
Other versions
JPS59190717A (en
Inventor
Takahiro Sakakino
Hiroyuki Yamazaki
Kenji Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP58065921A priority Critical patent/JPS59190717A/en
Publication of JPS59190717A publication Critical patent/JPS59190717A/en
Publication of JPH0435859B2 publication Critical patent/JPH0435859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/95—Proximity switches using a magnetic detector
    • H03K17/9505—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Electronic Switches (AREA)

Description

【発明の詳細な説明】 発明の分野 本発明は物体の通過の有無の検出や物体の位置
制御に用いられる高周波発振型の近接スイツチに
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high frequency oscillation type proximity switch used for detecting whether an object passes or not and controlling the position of an object.

発明の背景 物体の近接を検知する近接スイツチはその用途
に合わせて種々の形状のものが実用化されてい
る。第１図ａ〜ｇは従来より用いられている種々
の近接スイツチを示す斜視図である。第１図ａ〜
ｅの各近接スイツチの左端面、及び第１図ｆ，ｇ
の近接スイツチの上面に示す「＋」の記号は物体
の検知面であつて、高周波発振型の近接スイツチ
の場合にはその内部に検知コイルが埋め込まれて
いる。これらの近接スイツチはその形状に合わせ
て搬送ラインや各種制御装置に取り付けられる。
例えば第１図ａの近接スイツチでは第２図ａに示
すように近接スイツチの外周を覆うバンド１を用
いて所望の位置に取り付けられ、第１図ｂやｆ，
ｇの近接スイツチでは第２図ｂに示すように設置
台２にボルトによつて固定される。又第１図ｃ，
ｄ等の近接スイツチでは第２図ｃに示すようにＬ
字型金具３を介してボルトによつて設置台２に固
定される。更に第１図ｅのように近接スイツチの
円筒状のケースの外周にネジ溝が切られているも
のにあつては、第２図ｄ，ｅに示すように雌ネジ
が切られた金属板４にねじ込み、少なくとも一方
からナツトで締め付けて金属板４を貫通させて固
定する。またケースの全面にネジ溝が切られてい
るものにあつては、第２図ｆに示すように金属体
５に埋め込んで取り付けてもよく、第２図ｇに示
すように金属板４を貫通させて取り付けてもよ
い。BACKGROUND OF THE INVENTION Proximity switches that detect the proximity of objects have been put into practical use in various shapes depending on their uses. Figures 1a-g are perspective views showing various conventional proximity switches. Figure 1 a~
The left end face of each proximity switch in e, and f, g in Figure 1.
The "+" symbol shown on the top surface of the proximity switch is the object detection surface, and in the case of a high frequency oscillation type proximity switch, a detection coil is embedded inside. These proximity switches are attached to conveyor lines and various control devices depending on their shape.
For example, the proximity switch shown in FIG. 1a is attached to a desired position using a band 1 that covers the outer periphery of the proximity switch as shown in FIG. 2a, and the proximity switch shown in FIGS.
The proximity switch g is fixed to the installation stand 2 with bolts as shown in FIG. 2b. Also, Figure 1c,
For proximity switches such as d, L as shown in Figure 2c.
It is fixed to the installation base 2 with bolts via the letter-shaped metal fittings 3. Furthermore, in the case of a proximity switch in which a thread groove is cut on the outer periphery of the cylindrical case of the proximity switch as shown in FIG. , and tighten it with a nut from at least one side to pass through the metal plate 4 and fix it. In addition, if the case has threaded grooves on the entire surface, it may be installed by being embedded in the metal body 5 as shown in Fig. 2 f, or it may be installed by penetrating the metal plate 4 as shown in Fig. 2 g. You can also install it by letting it slide.

しかしながらこのように従来の近接スイツチは
いずれも固定のためのネジや取り付け板、固定用
のナツト等を必要とするため取り付けに手間がか
かり、取り付け工具も必要とするという問題点が
あつた。更に複写機や自動販売機等、機器の内部
に近接スイツチを使用する場合には、検出センサ
のために余り多くの取り付けスペースがとれなか
つたり、信号伝送用のワイヤがあまり長く伸ばせ
ないことが多い。このような場合には従来の近接
スイツチは使いにくいという問題点があつた。 However, as described above, all of the conventional proximity switches require fixing screws, mounting plates, fixing nuts, etc., and therefore have the problem of being time-consuming and requiring installation tools. Furthermore, when using a proximity switch inside a device such as a copying machine or a vending machine, there is often not enough installation space for the detection sensor, or the wire for signal transmission cannot be extended very long. . In such cases, conventional proximity switches have the problem of being difficult to use.

発明の目的 本発明はこのような従来の近接スイツチの問題
点を解消するものであつて、近接スイツチを集積
回路と同様に構成することによつて超小型化し、
プリント基板に直接接続できるようにして自動販
売機等の機器に内蔵して使用するといつた用途に
適した近接スイツチを提供することを目的とす
る。OBJECT OF THE INVENTION The present invention solves the problems of the conventional proximity switch, and the present invention is to miniaturize the proximity switch by configuring it in the same way as an integrated circuit.
The purpose of the present invention is to provide a proximity switch which can be connected directly to a printed circuit board and is suitable for use by being built into equipment such as a vending machine.

発明の構成と効果 本発明は検知コイルと、該検知コイルを発振回
路要素とする発振器を含むスイツチ回路部とを有
し、物体の近接を検知する高周波発振型の近接ス
イツチであつて、検知コイルはリードフレームを
スパイラル状に形成することによつて構成され、
スイツチ回路部はリードフレーム上に配設され、
樹脂モールド成形により一体に成形して構成した
ことを特徴とするものである。Structure and Effects of the Invention The present invention is a high-frequency oscillation type proximity switch for detecting the proximity of an object, which has a detection coil and a switch circuit section including an oscillator using the detection coil as an oscillation circuit element. is constructed by forming a lead frame into a spiral shape,
The switch circuit section is arranged on the lead frame,
It is characterized by being integrally formed by resin molding.

このような特徴を有する本発明によれば、近接
スイツチをICと共に同様の製造工程により構成
することができる。従つて部品数が大幅に減少
し、組立工数も大幅に減少するので従来の近接ス
イツチに比べて極めて低価格化することができ
る。又近接スイツチ自体を極めて薄く小型化する
ことができるので狭いスペースにも近接スイツチ
を設けて物体検知をすることが可能となる。又本
発明では近接スイツチをプリント基板に直接接続
することができ、それによつて近接スイツチを所
定の位置に固定することができる。従つてネジ等
の取り付け部材が不要となり、接続が容易で取り
付けに要する手間と工数を大幅に少なくすること
ができる。又プリント基板への接続と同時に電気
的な配線作業も完了する。そのため従来の近接ス
イツチのようにワイヤによつて電源や信号線を接
続する必要はなくノイズや誘導の影響を受けるこ
とが少なくなり、信頼性を向上させることができ
る。 According to the present invention having such features, the proximity switch can be constructed using the same manufacturing process as the IC. Therefore, the number of parts and the number of assembly steps are greatly reduced, making it possible to reduce the price significantly compared to conventional proximity switches. Furthermore, since the proximity switch itself can be made extremely thin and compact, it becomes possible to provide the proximity switch even in a narrow space to detect objects. The present invention also allows the proximity switch to be connected directly to the printed circuit board, thereby securing the proximity switch in a predetermined position. Therefore, there is no need for mounting members such as screws, and the connection is easy and the labor and man-hours required for mounting can be significantly reduced. Also, the electrical wiring work is completed at the same time as the connection to the printed circuit board. Therefore, unlike conventional proximity switches, there is no need to connect the power supply and signal lines with wires, and the influence of noise and induction is reduced, making it possible to improve reliability.

実施例の説明 第３図は一般的な高周波発振型の近接スイツチ
の構成を示すブロツク図である。本図に示すよう
に高周波発振型近接スイツチでは検知素子として
検知コイルＬを用い、この検知コイルＬに発振回
路１０が接続され、更に発振状態検出回路１１が
接続されている。発振回路は常に一定の周波数で
発振を続けておりその発振状態は発振状態検出回
路１１で常にチエツクされている。そして物体が
近接すると発振状態が変化するので出力回路１２
より出力を出して物体の近接を検出している。又
多くの近接スイツチではその動作を確認するため
の動作表示灯１３が設けられる。高周波発振型の
近接スイツチはこのような構成を持つので、小型
化しようとすれば検知コイルＬとスイツチ回路部
とを共に小型化しなければならない。DESCRIPTION OF THE EMBODIMENTS FIG. 3 is a block diagram showing the structure of a general high frequency oscillation type proximity switch. As shown in this figure, the high-frequency oscillation type proximity switch uses a detection coil L as a detection element, and an oscillation circuit 10 is connected to this detection coil L, and an oscillation state detection circuit 11 is further connected to the detection coil L. The oscillation circuit continues to oscillate at a constant frequency, and the oscillation state is constantly checked by the oscillation state detection circuit 11. When an object approaches, the oscillation state changes, so the output circuit 12
It outputs more output to detect the proximity of objects. Additionally, many proximity switches are provided with an operation indicator light 13 for confirming their operation. Since the high frequency oscillation type proximity switch has such a configuration, if it is to be miniaturized, both the detection coil L and the switch circuit section must be miniaturized.

第４図ａ及び第４図ｂは本発明の一実施例であ
る高周波発振型の近接スイツチの組立状態を示す
斜視図及び上面図である。本実施例においては検
知コイルに銅又は銅合金等の良導体であるリード
フレームを用い、リードフレームをプレスによる
打抜き又はエツチングによりスパイラル状に構成
して検知コイルＬとしている。このリードフレー
ムには加工前に検知コイルＬとして構成する部分
を金メツキとしたものを用いてもよい。このよう
にして平面状のスパイラルコイルを形成し、且つ
電子回路との接続は通常のIC実装の場合と同様
にボンデイング等によつて実現している。次に第
３図に示したスイツチ回路部、即ち発振回路１
０、発振状態検出回路１１、出力回路１２を集積
回路化してワンチツプに構成した近接スイツチ専
用のICチツプ２１を用いる。ICチツプ２１も通
常のICを製造する場合と同様にリードフレーム
２０ｂ上に形成している。リードフレームによつ
て構成されている検知コイルＬの両端はワイヤボ
ンデイングによつてこのICチツプ２１に接続さ
れる。ICチツプ２１の他の入出力端も図示のよ
うにワイヤボンデイングによつて他のリードフレ
ーム２０ｃ，２０ｂ，２０ｄ，２０ｅに接続され
る。リードフレーム２０ｄ上には近接スイツチの
動作表示灯として用いる発光ダイオードのチツプ
２２が接続されている。こうしてリードフレーム
の中央部を構成した後、第４図ｂに示すように破
線部分２３を樹脂モールドにより低圧成形して立
体的に成形する。そして一点鎖線で示す部分等の
不要なリードフレーム端部を切断して第５図に斜
視図を示すように各端子を折り曲げてデユアル・
イン・ライン型の近接スイツチを構成する。この
時発光ダイオードのチツプ２２の発光が樹脂モー
ルド成形後に検知できるようにこのチツプの上部
だけをライトガイド２４として透明樹脂により成
形する。このようにすればその上面に検知面２５
を有する近接スイツチとして構成することができ
る。 FIGS. 4a and 4b are a perspective view and a top view showing an assembled state of a high frequency oscillation type proximity switch according to an embodiment of the present invention. In this embodiment, a lead frame made of a good conductor such as copper or copper alloy is used for the detection coil, and the lead frame is formed into a spiral shape by punching or etching to form the detection coil L. This lead frame may be one in which the portion constituting the sensing coil L is plated with gold before processing. In this way, a planar spiral coil is formed, and the connection to the electronic circuit is realized by bonding, etc., as in the case of normal IC mounting. Next, the switch circuit section shown in FIG. 3, that is, the oscillation circuit 1
0. An IC chip 21 dedicated to the proximity switch is used, in which the oscillation state detection circuit 11 and the output circuit 12 are integrated into a single chip. The IC chip 21 is also formed on the lead frame 20b in the same way as when manufacturing a normal IC. Both ends of the detection coil L constituted by a lead frame are connected to this IC chip 21 by wire bonding. Other input/output terminals of the IC chip 21 are also connected to other lead frames 20c, 20b, 20d, and 20e by wire bonding as shown. A light emitting diode chip 22 used as an operation indicator of the proximity switch is connected to the lead frame 20d. After forming the central portion of the lead frame in this manner, the broken line portion 23 is molded at low pressure using a resin mold to form a three-dimensional shape, as shown in FIG. 4b. Then, cut off the unnecessary end of the lead frame, such as the part shown by the dashed-dotted line, and bend each terminal as shown in the perspective view in Figure 5.
Configures an in-line proximity switch. At this time, only the upper part of the chip 22 of the light emitting diode is molded with a transparent resin as a light guide 24 so that the light emitted from the chip 22 of the light emitting diode can be detected after resin molding. In this way, the detection surface 25 is placed on the top surface.
The proximity switch can be configured as a proximity switch.

第６図ａ及び第６図ｂは本発明の他の実施例を
示す近接スイツチの組立図及びその上面図であ
る。本実施例は近接スイツチのICチツプ２１を
スパイラル状に構成したリードフレーム３０の中
央部に配置したものである。即ち前述した実施例
と同様にリードフレームを打抜き又はエツチング
により平面状のスパイラルコイルＬとし、その中
央に近接スイツチの回路部であるICチツプ２１
を配置する。そしてそのICチツプ２１の電極部
とリードフレームの各端子を３０ｂ，３０ｃ，３
０ｄ，３０ｆにワイヤボンデイングによつて電気
的に接続する。リードフレーム３０ｃには前述し
た実施例と同じく発光ダイオードチツプ２２を設
ける。こうしてリードフレームと検知回路部を一
体に構成した後樹脂モールドによつて成形しリー
ドフレームの不要部分を切り取つてフラツトパツ
ク型もしくはデユアル・イン・ライン型の近接ス
イツチとして構成する。このように検知コイルの
中央にICチツプを設けた構造によればコイルの
巻数を増やすことができ近接スイツチの実装面積
を小さくすることができる。従つて近接スイツチ
自体を極めて小型に構成することが可能となる。 6a and 6b are an assembled view and a top view of a proximity switch showing another embodiment of the present invention. In this embodiment, an IC chip 21 of a proximity switch is arranged in the center of a lead frame 30 formed in a spiral shape. That is, in the same way as in the embodiment described above, a planar spiral coil L is formed by punching or etching the lead frame, and an IC chip 21, which is the circuit section of the proximity switch, is placed in the center of the spiral coil L.
Place. Then, connect the electrode part of the IC chip 21 and each terminal of the lead frame to 30b, 30c, 3.
It is electrically connected to 0d and 30f by wire bonding. A light emitting diode chip 22 is provided on the lead frame 30c as in the previous embodiment. After the lead frame and the detection circuit are integrally constructed in this manner, they are formed by resin molding, and unnecessary portions of the lead frame are cut out to construct a flat pack type or dual-in-line type proximity switch. With this structure in which the IC chip is provided in the center of the detection coil, the number of turns of the coil can be increased and the mounting area of the proximity switch can be reduced. Therefore, the proximity switch itself can be made extremely compact.

尚これらの実施例において、リードフレームの
フラツトコイルとなる部分の裏面にはフエライト
板等を貼付しておけば近接スイツチの検知面をそ
の上面に限定することが可能となる。 In these embodiments, if a ferrite plate or the like is attached to the back surface of the portion of the lead frame that will become the flat coil, the detection surface of the proximity switch can be limited to the upper surface thereof.

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ〜ｇは実施例の各種の近接スイツチの
外観を示す斜視図、第２図ａ〜ｇはこれらの近接
スイツチの取り付け状態を示す図、第３図は一般
的な高周波発振型の近接スイツチの構成を示すブ
ロツク図、第４図ａ及び第４図ｂは本発明の一実
施例を示す近接スイツチの組立状態を示す斜視図
及び上面図、第５図はこの実施例による近接スイ
ツチの組立完了後の状態を示す斜視図、第６図ａ
及び第６図ｂは本発明の他の実施例による近接ス
イツチの斜視図及び上面図である。 Ｌ…検知コイル、１０…発振回路、１１…発振
状態検知回路、１２…出力回路、１３…動作表示
灯、２０ａ〜２０ｆ，３０ａ〜３０ｆ…リードフ
レーム、２１…ICチツプ、２２…発光ダイオー
ドチツプ、２３…樹脂、２４…ライトガイド、２
５…検知面。 Figures 1 a to g are perspective views showing the external appearance of various proximity switches of the embodiment, Figures 2 a to g are views showing how these proximity switches are installed, and Figure 3 is a general high frequency oscillation type. A block diagram showing the structure of a proximity switch, FIGS. 4a and 4b are a perspective view and a top view showing an assembled state of a proximity switch according to an embodiment of the present invention, and FIG. 5 shows a proximity switch according to this embodiment. A perspective view showing the state after the assembly is completed, Figure 6a
and FIG. 6b are a perspective view and a top view of a proximity switch according to another embodiment of the present invention. L... Detection coil, 10... Oscillation circuit, 11... Oscillation state detection circuit, 12... Output circuit, 13... Operation indicator light, 20a to 20f, 30a to 30f... Lead frame, 21... IC chip, 22... Light emitting diode chip, 23...Resin, 24...Light guide, 2
5...Detection surface.

Claims (1)

【特許請求の範囲】 １ 検知コイルと、該検知コイルを発振回路要素
とする発振器を含むスイツチ回路部とを有し、物
体の近接を検知する高周波発振型の近接スイツチ
において、 前記検知コイルはリードフレームをスパイラル
状に形成することによつて構成され、前記スイツ
チ回路部はリードフレーム上に配設され、樹脂モ
ールド成形により一体に成形して構成したことを
特徴とする近接スイツチ。 ２ 前記スイツチ回路部を集積回路化したことを
特徴とする特許請求の範囲第１項記載の近接スイ
ツチ。 ３ 前記スイツチ回路部の集積回路は、スパイラ
ル状に形成されたリードフレームによる検知コイ
ルの中央終端に実装されてなることを特徴とする
特許請求の範囲第２項記載の近接スイツチ。[Claims] 1. A high-frequency oscillation type proximity switch for detecting the proximity of an object, which includes a detection coil and a switch circuit section including an oscillator using the detection coil as an oscillation circuit element, wherein the detection coil has a lead. 1. A proximity switch constructed by forming a frame in a spiral shape, wherein the switch circuit section is disposed on a lead frame and integrally formed by resin molding. 2. The proximity switch according to claim 1, wherein the switch circuit section is an integrated circuit. 3. The proximity switch according to claim 2, wherein the integrated circuit of the switch circuit section is mounted at the central end of a detection coil formed by a spirally formed lead frame.
JP58065921A 1983-04-13 1983-04-13 Proximity switch Granted JPS59190717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58065921A JPS59190717A (en) 1983-04-13 1983-04-13 Proximity switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58065921A JPS59190717A (en) 1983-04-13 1983-04-13 Proximity switch

Publications (2)

Publication Number Publication Date
JPS59190717A JPS59190717A (en) 1984-10-29
JPH0435859B2 true JPH0435859B2 (en) 1992-06-12

Family

ID=13300913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58065921A Granted JPS59190717A (en) 1983-04-13 1983-04-13 Proximity switch

Country Status (1)

Country Link
JP (1) JPS59190717A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4437721A1 (en) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Contactless electronic module
DE19639650A1 (en) * 1996-09-26 1998-04-02 Sican Gmbh Integrated circuit with an inductive component and method for producing this
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
US6351033B1 (en) * 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
WO2006085363A1 (en) * 2005-02-09 2006-08-17 Renesas Technology Corp. Semiconductor apparatus and electronic circuit
US20060276157A1 (en) * 2005-06-03 2006-12-07 Chen Zhi N Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
JP5749066B2 (en) * 2011-05-02 2015-07-15 新電元工業株式会社 Inductor-integrated lead frame, electronic circuit module and manufacturing method thereof
EP3183817B1 (en) * 2014-08-22 2021-05-05 Balluff GmbH Inductive proximity sensor of integrated design

Also Published As

Publication number Publication date
JPS59190717A (en) 1984-10-29

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