JPH0435871A - Cleaning device for abrasive cloth in polishing device - Google Patents

Cleaning device for abrasive cloth in polishing device

Info

Publication number
JPH0435871A
JPH0435871A JP2141860A JP14186090A JPH0435871A JP H0435871 A JPH0435871 A JP H0435871A JP 2141860 A JP2141860 A JP 2141860A JP 14186090 A JP14186090 A JP 14186090A JP H0435871 A JPH0435871 A JP H0435871A
Authority
JP
Japan
Prior art keywords
polishing
plate
brush
abrasive
cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2141860A
Other languages
Japanese (ja)
Inventor
Shinobu Kitamura
喜多村 忍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Altemira Co Ltd
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Priority to JP2141860A priority Critical patent/JPH0435871A/en
Publication of JPH0435871A publication Critical patent/JPH0435871A/en
Pending legal-status Critical Current

Links

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PURPOSE:To remove swept abrasive chips without their being left, by arranging a driving means which migrates a plate and brush so as to arrange them fore and aft each other in the peripheral direction of an abrasive cloth to the position located on the abrasive cloth from a standby position at the cleaning time of the abrasive cloth. CONSTITUTION:The abrasive chips of abrasive clothes 8, 9 are swept by the action of a brush 12, when surface plates 2, 3 are driven with their rotations and also a brush 12 and plate 13 are migrated onto the abrasive cloth face by driving means 14, 15 and the abrasive chips swept by the brush 12 are removed by the action of the plate 13. The abrasive chips in swept state are not left on the abrasive cloth parts 8, 9 where both of the brush 12 and plate 13 are pass through and they are cleaned clearly. And yet the abrasive chips accompanied by the plate 13 are migrated to the side of the plate 13 with the plate 13 being inclined at the specific angle for the radial directions of the surface plates 2, 3 and are swept away to the side part from this side.

Description

【発明の詳細な説明】 研磨布が取着された研磨用定盤が備えられ、ワークを該
研磨布に押当て状態に保持して該ワクの研磨を行う研磨
装置における研磨布の清浄装置であって、 前記定盤が自軸回りで回転駆動可能に支持されると共に
、研磨布の研磨屑を掻き出す掻出し用ブラシと、研磨布
面に掻き出された研磨屑を側部側に除去するように定盤
の半径線方向に対し所定の角度に傾斜された研磨屑除去
用プレートとが同定盤の側方位置に待機状態に配置され
、かつ研磨布の清浄時に該プレートと前記ブラシとを、
前記待機位置から研磨布上の位置に、研磨布の周方向に
おいて相前後して配置される態様において移行させる駆
動手段が具備されてなることを特徴とする研磨装置にお
ける研磨布の清浄装置。
DETAILED DESCRIPTION OF THE INVENTION A polishing cloth cleaning device in a polishing apparatus which is equipped with a polishing surface plate to which a polishing cloth is attached, and which holds a workpiece pressed against the polishing cloth and polishes the workpiece. The surface plate is rotatably supported around its own axis, and a scraping brush scrapes out polishing debris from the polishing cloth, and a scraping brush scrapes off polishing debris scraped onto the surface of the polishing cloth toward the side. A polishing debris removal plate inclined at a predetermined angle with respect to the radial direction of the polishing plate is placed in standby at a side position of the polishing plate, and when cleaning the polishing cloth, the plate and the brush are removed. ,
A cleaning device for a polishing cloth in a polishing apparatus, characterized in that the cleaning device for a polishing cloth in a polishing apparatus is provided with driving means for moving from the standby position to a position on the polishing cloth in a manner that they are arranged one after the other in the circumferential direction of the polishing cloth.

3、発明の詳細な説明 産業上の利用分野 この発明は、例えば磁気ディスク用アルミニウム基板等
のワークを研磨する研磨布を備えた研磨装置における研
磨布の清浄装置に関する。
3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a polishing cloth cleaning device in a polishing apparatus equipped with a polishing cloth for polishing a work such as an aluminum substrate for a magnetic disk.

従来の技術 従来、例えば磁気ディスク用アルミニウム基板の研磨を
行う研磨装置として、第6図に示されるような装置(5
1)が用いられている。同図の研磨装置(51)は、回
転駆動可能に保持されかつ上面にドーナツ状の研磨布(
52)が取着された下部定盤(53)と、該下部定盤(
53)の上方位置に該定盤(53)と対向同軸状に配置
されると共に回転駆動及び昇降作動可能に保持されかつ
下面に同じくドーナツ状の研磨布(54)が取着された
上部定盤(55)と、各研磨布(52)(54)間にお
いて研磨布の軸芯位置に配置された太陽歯車(57)と
、該太陽歯車(57)の径方向外方位置に同心状に配置
された内歯歯車(59)と、該内歯歯車(59)及び前
記太陽歯車(57)の両歯車に噛合され下部定盤(53
)の研磨布(52)上に載置された状態で両歯車(57
)  (59)間に配置された外歯歯車によるワークキ
ャリアー (58)とからなる。
2. Description of the Related Art Conventionally, as a polishing apparatus for polishing, for example, an aluminum substrate for a magnetic disk, an apparatus (5) as shown in FIG.
1) is used. The polishing device (51) in the figure is rotatably held and has a donut-shaped polishing cloth (
52) is attached to the lower surface plate (53), and the lower surface plate (52) is attached to the lower surface plate (53).
53) An upper surface plate which is disposed coaxially with the surface plate (53) at an upper position, is rotatably driven and movable up and down, and has a donut-shaped polishing cloth (54) attached to its lower surface. (55), a sun gear (57) arranged between each polishing cloth (52) and (54) at the axial center position of the polishing cloth, and a sun gear (57) arranged concentrically at a position radially outward of the sun gear (57). The lower surface plate (53) is meshed with both the internal gear (59) and the sun gear (57).
) is placed on the polishing cloth (52) of both gears (57).
) (59) and a work carrier (58) with external gears arranged between them.

この研磨装置(51)では、上部定盤(55)が上方待
機位置に位置された状態で磁気ディスク用基板(A)が
ワークキャリアー(56)の保持孔(BO)内に配置さ
れ、そして上部定盤(55)が下降作動されて磁気ディ
スク用基板(A)の両面が上下の研磨布(52)  (
54)により押付は状態に挾まれる。そして、所定の研
磨液供給下において、太陽歯車(57)が回転されるこ
とによりワークキャリアー(5B)が自転されながら太
陽歯車(57)の回りで公転され、更に上下の定盤(5
3)  (55)も回転されて磁気ディスク用基板(A
)の両面の研磨加工がなされる。
In this polishing device (51), the magnetic disk substrate (A) is placed in the holding hole (BO) of the work carrier (56) with the upper surface plate (55) positioned at the upper standby position, and the upper The surface plate (55) is lowered and both sides of the magnetic disk substrate (A) are covered with upper and lower polishing cloths (52) (
54) causes the pressing to be caught in the state. Then, while supplying a predetermined amount of polishing liquid, the sun gear (57) is rotated, so that the work carrier (5B) is rotated and revolved around the sun gear (57).
3) (55) is also rotated and the magnetic disk substrate (A
) is polished on both sides.

ところで、上記研磨袋ffi (51)では、ワーク(
A)の研磨加工を繰り返すうち、研磨布(52)(54
)の表面層に研摩屑が溜まり、研磨性能が低下する傾向
が現れる。そのため、この研摩屑を除去して、研磨布(
52)  (54)の清浄を行う必要かある。
By the way, in the polishing bag ffi (51), the workpiece (
While repeating the polishing process in A), polishing cloths (52) (54
), abrasive debris accumulates on the surface layer, which tends to reduce polishing performance. Therefore, remove this abrasive debris and use a polishing cloth (
52) Is it necessary to clean (54)?

従来、この清浄は、第7図に示されるようなナイロン製
のブラシ(62)を作業者が研磨布(52)の表面層に
押し当てて定盤(53)を回転駆動することにより、あ
るいは第8図に示されるようなステンレス鋼製のプレー
ト(64)を作業者が研磨布(52)の表面に押し当て
て定盤(53)を回転駆動することにより、行われてい
た。
Conventionally, this cleaning has been carried out by an operator pressing a nylon brush (62) as shown in FIG. 7 against the surface layer of the polishing cloth (52) and rotating the surface plate (53), or by This was done by an operator pressing a stainless steel plate (64) as shown in FIG. 8 against the surface of the polishing cloth (52) and rotating the surface plate (53).

発明が解決しようとする課題 しかしながら、ブラシ(62)を用いる第7図に示され
る方法では、研磨布(54)の表面層の研摩屑の掻出し
を効果的に行うことができる反面、掻き出された研摩屑
の多くがブラシ(62)の通過経路上に残ってしてしま
い、その研摩屑の除去が容易ではないという欠点があっ
た。
Problem to be Solved by the Invention However, while the method shown in FIG. 7 using the brush (62) can effectively scrape off the abrasive debris from the surface layer of the polishing cloth (54), There is a drawback that most of the abrasive debris left on the passage of the brush (62) is difficult to remove.

また一方、プレート(64)を用いる第8図に示される
方法では、該プレート(64)を研磨布(52)に強く
押し当てるようにすることによって、研磨布(52)の
表面層の研摩屑の掻出しを行うことができかつ掻き出さ
れた研摩屑をプレートに伴わせて移行させて研摩屑の多
くをプレート(64)の通過経路上に残さないようにし
て研摩屑の除去を行える反面、この場合、上記のように
プレート(64)を研磨布(52)に強く押し当てるこ
とが必要で、そのため研磨布(52)に傷をつけてしま
うおそれがあった。
On the other hand, in the method shown in FIG. 8 using a plate (64), by strongly pressing the plate (64) against the polishing cloth (52), polishing debris on the surface layer of the polishing cloth (52) can be removed. On the other hand, it is possible to remove the abrasive debris by moving the scraped abrasive debris along with the plate and not leaving much of the abrasive debris on the path through which the plate (64) passes. In this case, as described above, it is necessary to forcefully press the plate (64) against the polishing cloth (52), which may cause damage to the polishing cloth (52).

この発明は、上記のような従来の問題点を解決し、研磨
布に傷をつけることなく、その表面層に溜まった研摩屑
を掻き出し、かつ掻き出した研摩屑を容易に除去するこ
とかできる研磨装置における研磨布の清浄装置を提供す
ることを目的とする。
This invention solves the conventional problems as described above, and provides a polishing method that scrapes out the abrasive debris accumulated on the surface layer of the polishing cloth without damaging it, and can easily remove the scraped abrasive debris. An object of the present invention is to provide a cleaning device for polishing cloth in an apparatus.

課題を解決するための手段 上記目的において、この発明は、研磨布が取着された研
磨用定盤が備えられ、ワークを該研磨布に押当て状態に
保持して該ワークの研磨を行う研磨装置における研磨布
の清浄装置であって、 前記定盤か自軸回りで回転駆動可能に支持されると共に
、研磨布の研摩屑を掻き出す掻出し用ブラシと、研磨布
面に掻き出された研摩屑を側部側に除去するように定盤
の半径線方向に対し所定の角度に傾斜された研磨屑除去
用プレートとが同定盤の側方位置に待機状態に配置され
、かつ研磨布の清浄時に該プレートと前記ブラシとを、
前記待機位置から研磨布上の位置に、研磨布の周方向に
おいて相前後して配置される態様において移行させる駆
動手段が具備されてなることを特徴とする研磨装置にお
ける研磨布の清浄装置を要旨とする。
Means for Solving the Problems To achieve the above object, the present invention provides a polishing method that includes a polishing surface plate to which a polishing cloth is attached, and polishes the workpiece by holding the workpiece against the polishing cloth. An abrasive cloth cleaning device in an apparatus, which is rotatably supported around its own axis by the surface plate, and includes a scraping brush that scrapes out abrasive debris from the abrasive cloth, and a cleaning brush that scrapes out abrasive debris from the abrasive cloth; A polishing debris removal plate, which is inclined at a predetermined angle with respect to the radial direction of the polishing plate so as to remove debris to the side, is placed on standby at a side position of the polishing plate, and is used to clean the polishing cloth. When the plate and the brush are
Abstract: A cleaning device for a polishing cloth in a polishing apparatus, characterized in that the cleaning device for a polishing cloth in a polishing machine is provided with driving means for moving from the standby position to a position above the polishing cloth in a manner arranged one after another in the circumferential direction of the polishing cloth. shall be.

なお、上記発明において、研磨布の清浄に際し、前記掻
出し用ブラシと研磨屑除去用プレートのうち少なくとも
研磨屑除去用プレートを研磨布上でその半径線方向に所
定の速度で進退移動させる駆動装置が具備されると共に
、該研磨屑除去用プレートの半径線方向への進退移動の
際に、該プレートを、研摩屑がプレートの移動方向の前
方側に除去される態様において、定盤の手軽線方向に対
し所定の角度に傾斜させる機構が具備されているのが好
ましい。
In the above invention, when cleaning the polishing cloth, a drive device that moves at least the scraping brush and the polishing debris removing plate forward and backward in the radial direction of the polishing cloth at a predetermined speed. is provided, and when the plate for removing polishing debris is moved back and forth in the radial direction, the polishing debris is removed to the front side in the direction of movement of the plate. Preferably, a mechanism for tilting at a predetermined angle with respect to the direction is provided.

作用 上記構成では、定盤が回転駆動されると共に、ブラシと
プレートとが駆動手段によって研磨布面上に移行される
と、研磨布の研磨屑はブラシの作用によって掻き出され
、該ブラシによって掻き出された研磨屑は、プレートの
作用によって除去される。これにより、ブラシ及びプレ
ートの両方が通過した研磨布部分には掻き出され状態の
研磨屑が残存せず、きれいに清浄される。
Function In the above configuration, when the surface plate is rotationally driven and the brush and plate are transferred onto the surface of the polishing cloth by the driving means, the polishing debris on the polishing cloth is scraped out by the action of the brush; The ejected polishing debris is removed by the action of the plate. As a result, the portion of the polishing cloth through which both the brush and the plate have passed is cleanly cleaned without any scraped-out polishing debris remaining.

しかも、プレートが定盤の半径方向に対して所定角度に
傾斜されていることにより、プレートに伴われる研磨屑
は、該プレートの側部側に移行され、該側部から側方に
払い除けられる。
Moreover, since the plate is inclined at a predetermined angle with respect to the radial direction of the surface plate, polishing debris accompanying the plate is transferred to the side of the plate and is swept away from the side. .

従って、該プレートに伴われる研磨屑の量が一定以上に
多くならず、そのためプレートによる研磨屑の除去効果
が低下してしまうというようなことも起こらない。
Therefore, the amount of polishing debris accompanying the plate does not increase beyond a certain level, so that the effect of removing polishing debris by the plate does not deteriorate.

実施例 以下、この発明を磁気ディスク用アルミニウム基板の研
磨加工を行う場合の装置に適用した実施例につき、図面
に基づいて説明する。
EXAMPLE Hereinafter, an example in which the present invention is applied to an apparatus for polishing an aluminum substrate for a magnetic disk will be described based on the drawings.

第1図(イ)(ロ)に示される研磨装M(1)において
、(2)は下部定盤、(3)は上部定盤、(4)は太陽
歯車、(5)は内歯歯車、(6)はワークキャリアー、
そして(7)は研磨布清浄装置である。
In the polishing tool M (1) shown in Figures 1 (a) and (b), (2) is the lower surface plate, (3) is the upper surface plate, (4) is the sun gear, and (5) is the internal gear. , (6) is a work carrier,
And (7) is a polishing cloth cleaning device.

下部定盤(2)は、その上部にドーナツ状の研磨布(8
)が取着されたもので、図示しない駆動装置により自軸
回りでの回転駆動及び上下方向への移動を行いうるちの
となされている。
The lower surface plate (2) has a donut-shaped polishing cloth (8
) is attached, and is driven to rotate around its own axis and move up and down by a drive device (not shown).

上部定盤(3)は、下部定盤(2)の上方位置に同軸状
に対向配置され、その下部に同じくドーナツ状の研磨布
(9)が前記下部定盤(2)の研磨布(8)に対向する
ように取着されたものである。そして、この上部定盤(
3)も、図示しない駆動装置により、自軸回りでの回転
駆動及び上下方向への移動を行いうるちのとなされてい
る。
The upper surface plate (3) is disposed coaxially opposite the lower surface plate (2), and a donut-shaped polishing cloth (9) is placed below the polishing cloth (8) of the lower surface plate (2). ) is attached so as to face it. And this upper surface plate (
3) is also configured to rotate around its own axis and move in the vertical direction by a drive device (not shown).

太陽歯車(4)は、上下両定盤(2)(3)間において
研磨布(8)(9)の軸芯位置に配置されており、図示
しない駆動装置により自軸回りで回転駆動されるものと
なされている。
The sun gear (4) is arranged between the upper and lower surface plates (2) and (3) at the axis of the polishing cloths (8) and (9), and is driven to rotate around its own axis by a drive device (not shown). It is considered a thing.

内歯歯車(5)は、太陽歯車(4)の径方向外方位置に
太陽歯車(4)との間にドーナツ状のスペースをおいて
同心状に配置されている。
The internal gear (5) is arranged concentrically at a position radially outward of the sun gear (4) with a donut-shaped space between the internal gear (5) and the sun gear (4).

ワークキャリアー(6)は、薄板状外歯歯車によるもの
で、上記太陽歯車(4)と内歯歯車(5)との間の環状
のスペース内に1(11ないし複数個配置され、太陽、
内歯の両歯車(4)(5)に噛合されている。なお、ワ
ークキャリアー(6)には、その中心位置から偏心した
位置に、磁気ディスク用基板(A)の外周形状に沿う円
形の保持孔(10)が1個ないし複数個設けられている
。また、このワークキャリアー(6)の厚さは、磁気デ
ィスク用基板(A)の厚さよりも薄く形成され、前記保
持孔(10)内に磁気ディスク用基板(A)を配置した
状態でその上下の面が保持孔(10)の外方に突出しう
るものとなされている。
The work carrier (6) is formed by a thin plate-shaped external gear, and one (11 or a plurality of them) are arranged in an annular space between the sun gear (4) and the internal gear (5).
It meshes with both internal gears (4) and (5). The work carrier (6) is provided with one or more circular holding holes (10) that follow the outer circumferential shape of the magnetic disk substrate (A) at positions eccentric from its center position. Further, the thickness of this work carrier (6) is formed to be thinner than the thickness of the magnetic disk substrate (A), and when the magnetic disk substrate (A) is placed in the holding hole (10), The surface of the holding hole (10) can protrude outward from the holding hole (10).

そして、研磨布清浄装W(7)は、上下両定盤(2)(
3)の側方位置に配置されている。
Then, the polishing cloth cleaning device W (7) has both upper and lower surface plates (2) (
3) is placed in a lateral position.

この研磨布清浄装置(7)において、(12)は研磨屑
掻出し用ブラシ、(13)は研磨屑除去用のプレート、
(14)  (15)は駆動手段としての進退作動装置
である。
In this abrasive cloth cleaning device (7), (12) is a brush for scraping off abrasive debris, (13) is a plate for removing abrasive debris,
(14) (15) is a forward/backward actuating device as a driving means.

研磨屑掻出し用ブラシ(12)はその上下両部にナイロ
ン等による植毛の施されたものである。
The brush (12) for scraping out abrasive debris has bristles made of nylon or the like on both its upper and lower parts.

研磨屑除去用のプレート(13)はステンレス鋼等の材
料により方形板状に製作されたもので、その上下両縁部
は断面円弧状に加工されている。
The plate (13) for removing polishing debris is made of a material such as stainless steel and has a rectangular plate shape, and both upper and lower edges thereof are processed to have an arc-shaped cross section.

進退作動装置(14)  (15)はギアー装置等によ
るもので、研磨装置(1)の側部に相互隣接状態に配置
されている。前記ブラシ(12) 、プレー) (13
)はそれぞれ、この進退作動装置(14)  (15)
の各作動ロッドの先端部に取り付けられ、両進退作動装
置(14)  (15)の作動により、相互隣接状態で
、上下の定盤(2)(3)の側方位置から上下両定盤(
2)(3)の研磨布(8)(9)間の内方に向けて定盤
の径方向に所定の速度で水平進退移動されるようになさ
れている。
The advancing/retracting actuating devices (14) and (15) are gear devices or the like, and are arranged adjacent to each other on the side of the polishing device (1). Said brush (12), play) (13
) are the advancing/retracting actuating devices (14) and (15), respectively.
The upper and lower surface plates (2) and (3) are moved from the side positions of the upper and lower surface plates (2) and (3) in a mutually adjacent state by the operation of the forward and backward movement actuators (14) and (15), which are attached to the tips of the respective operating rods.
2) The abrasive cloth (8) and (9) of (3) are horizontally moved forward and backward in the radial direction of the surface plate at a predetermined speed.

なお、上記ブラシ(12)とプレート(13)とは、プ
レート(13)の上下両縁部がブラシ(12)の毛先の
位置よりも内方に位置するような関係配置にされ、ブラ
シ(12)の毛先が研磨布(8)(9)に強く当たる一
方、プレート(13)の上下両縁部は研磨布(8)(9
)を痛めずかつ研磨屑を除去しうる範囲で軽く当たるよ
うにされている。
The brush (12) and the plate (13) are arranged in a relationship such that the upper and lower edges of the plate (13) are located inward from the bristles of the brush (12). The bristles of the plate (12) strongly hit the polishing cloths (8) and (9), while the upper and lower edges of the plate (13) hit the polishing cloths (8) and (9).
) is applied as lightly as possible to remove polishing debris without damaging the surface.

また、研磨屑除去用プレート(13)は、その長さ方向
中央部において上下方向のピン(16)によって水平面
内で回動自在に保持されており、かつ図示しない回動作
動装置により、ピン(16)を中心に回動作動され、定
盤(2)(3)の半径線方向に対して傾斜した状態に角
度変更されるようになされている。
In addition, the polishing debris removal plate (13) is held rotatably in a horizontal plane by a vertical pin (16) at the central portion in its longitudinal direction, and is held by a rotation movement device (not shown) such that the pin (16) can rotate freely in a horizontal plane. 16), and the angle is changed to be inclined with respect to the radial direction of the surface plates (2) and (3).

なお、この回動作動装置としては、例えば、プレート(
13)の、進退作動装置(15)側における側縁部を挾
んで1対のシリンダー装置を対向配置し、該シリンダー
装置の作動によりプレート(13)をピン(16)回り
で回動させるようにしたものや、あるいはプレート(1
3)の、進退作動装置(15)側における側縁部に突片
部を設け、この突片部を円板部材の周端部に形成した切
欠凹部に内在せしめ、該円板をその垂直軸線回りで回動
制御することによって、プレートをピン(16)回りで
回動せさるようにしたものなどが採用される。
In addition, as this rotation movement device, for example, a plate (
13), a pair of cylinder devices are arranged opposite to each other with the side edges on the advance/retreat actuating device (15) side in between, and the plate (13) is rotated around the pin (16) by the operation of the cylinder device. or a plate (1
3), a protruding piece is provided on the side edge on the side of the advance/retreat actuator (15), and this protruding piece is embedded in the notch recess formed in the peripheral end of the disc member, so that the disc is aligned with its vertical axis. A device in which the plate is rotated around the pin (16) by controlling the rotation around the pin (16) is adopted.

次に上記研磨装置(1)及び該装置における研磨布の清
浄装置(7)の作動を装置の制御方法と併せて説明する
Next, the operation of the polishing apparatus (1) and the polishing cloth cleaning device (7) in the apparatus will be explained together with a method of controlling the apparatus.

研磨加工において、下部定盤(2)は、第1図に示され
るように、ワークキャリアー(6)を太陽歯車(4)及
び内歯歯車(5)に噛合させた状態に保持できるような
高さ位置に設定され、研磨加工を行う間その高さ位置に
保持される。そして、磁気ディスク用基板(A)は、上
部定盤(3)が上方待機位置に待機された状態において
ワークキャリアー(6)の保持孔(10)内に配置され
る。
During the polishing process, the lower surface plate (2) has a height that allows it to hold the work carrier (6) in mesh with the sun gear (4) and the internal gear (5), as shown in Figure 1. and is held at that height during the polishing process. Then, the magnetic disk substrate (A) is placed in the holding hole (10) of the work carrier (6) with the upper surface plate (3) waiting at the upper standby position.

基板(A)の配置完了後、上部定盤(3)か下降作動さ
れることによって、上下の研磨布(8)(9)がともに
基板(A)の両面に接触され、かつ図示しない加圧装置
により加圧状態にされる。そして、研磨液の供給下、太
陽歯車(4)、上下の定盤(2)(’3)が回転駆動さ
れ、それによりワークキャリアー(6)が自転しながら
太陽歯車(4)の回りを公転され、磁気ディスク用基板
(A)が研磨布(8)(9)面上を摺動して該基板(A
)の研磨がなされる。
After the placement of the substrate (A) is completed, the upper surface plate (3) is lowered, so that both the upper and lower polishing cloths (8) and (9) come into contact with both surfaces of the substrate (A), and pressurization (not shown) is applied. A pressurized state is applied by the device. Then, while the polishing liquid is being supplied, the sun gear (4) and the upper and lower surface plates (2) ('3) are driven to rotate, and as a result, the work carrier (6) revolves around the sun gear (4) while rotating. Then, the magnetic disk substrate (A) slides on the surfaces of the polishing cloths (8) and (9) to remove the magnetic disk substrate (A).
) is polished.

そして、該基板(A)に所定量の研磨が施された時点で
、太陽歯車(4)等の回転か停止され、上部定盤(3)
が上昇作動されて、ワークキャリアー(6)から基板(
A)が取り出される。
When the substrate (A) has been polished by a predetermined amount, the rotation of the sun gear (4) etc. is stopped and the upper surface plate (3)
is operated to rise, and the substrate (
A) is taken out.

その後、新たな基板(A)がまたワークキャリアー(6
)の保持孔(10)内に配置され、上記同様の動作が繰
り返されて基板(A)が研磨されていく。
After that, the new substrate (A) is placed on the work carrier (6) again.
), and the same operation as above is repeated to polish the substrate (A).

そして、この研磨加工を繰り返すうち、上下の研磨布(
8)(9)に研磨屑が溜まって研磨布(8)(9)の清
浄を行う必要を生したら、基板(A)、キャリアー(6
)が取り出された状態において、上下の定盤(2)(3
)は、第2図(イ)に示されるように、清浄装置(7)
によって研磨布(8)(9)のth浄を行うに適した所
定の高さ位置、即ちブラシ(12)の毛先が研磨布(8
)(9)に強く当たり、かつプレート(13)の上下の
縁部が同研磨布に軽く当たるような高さ位置に位置する
ように上下方向に移行される。
As this polishing process is repeated, the upper and lower polishing cloths (
8) If polishing debris accumulates on (9) and it becomes necessary to clean the polishing cloths (8) and (9), clean the substrate (A) and carrier (6).
) is taken out, the upper and lower surface plates (2) (3
) is the cleaning device (7) as shown in Figure 2 (a).
The bristles of the brush (12) are at a predetermined height position suitable for cleaning the abrasive cloths (8) and (9).
) (9) and is moved in the vertical direction so that it is located at a height such that the upper and lower edges of the plate (13) lightly contact the polishing cloth.

そして、上下の定盤(2)(3)がいずれも第2図(ロ
)の矢印方向、即ち研磨布(8)(9)の研磨屑がプレ
ート(13)よりも先にブラシ(12)と干渉する方向
に回転駆動されると共に、回動作動装置の作動によりプ
レート(13)がその前面側を定a(2)(3)の中心
側に向けるような態様において定盤(2)(3)の半径
線方向に対し所定角度傾斜され、そして両進退作動装置
(14)  (15)の同期的な作動により、ブラシ(
12)及びプレート(13)が、定盤(2)(3)の側
方の待機位置から定盤の径方向内方に向けて研磨布(8
)(9)閣内に進出されていく。
The upper and lower surface plates (2) and (3) are both moved in the direction of the arrow in Fig. 2 (b), that is, the polishing debris from the polishing cloths (8) and (9) reaches the brush (12) before the plate (13). The surface plate (2) ( The brush (3) is tilted at a predetermined angle with respect to the radial direction of the brush (3).
12) and plate (13) are moved from the standby position on the sides of the surface plates (2) and (3) to the polishing cloth (8
) (9) Advancement into the Cabinet.

ブラシ(12) 、プレー) (13)の進出過程にお
いて、ブラシ(12)は上下の研磨布(8)(9)の表
面層の研磨屑を掻き出し、プレート(13)は、その直
ぐ後で、掻き出された研磨屑を、伴わせるようにして移
行させる。それにより、ブラシ(12)とプレート(1
3)との両者が通過した研磨布(8)(9)上からは研
磨屑がきれいに除去される。
During the advancing process of the brush (12) and plate (13), the brush (12) scrapes out the polishing debris from the surface layer of the upper and lower polishing cloths (8) and (9), and immediately after that, the plate (13) The scraped out polishing debris is transferred along with it. Thereby, the brush (12) and plate (1
Polishing debris is cleanly removed from the polishing cloths (8) and (9) through which both the polishing cloths (3) and (3) have passed.

また、プレート(13)に伴われながら移行される研磨
屑は、該プレート(13)か上述のように傾斜されてい
ることにより、第2図(ロ)(ハ)に示されるように、
研磨布(8)(9)の中心側における側部から研磨布(
8)(9)の内方に払い除けられる。従って、プレート
(13)の上下の縁部に経時的に多量の研磨屑が溜まっ
てしまうというようなことが起こらず、そのため、プレ
ート(13)による研磨屑の除去効果は清浄中常時適正
に保たれる。
Furthermore, since the plate (13) is tilted as described above, the polishing debris transferred along with the plate (13) can be removed as shown in FIGS.
Polishing cloth (8) (9) from the side on the center side
8) It is swept away inward from (9). Therefore, a large amount of polishing debris does not accumulate on the upper and lower edges of the plate (13) over time, and therefore, the polishing debris removal effect of the plate (13) is maintained properly at all times during cleaning. drooping

そして、ブラシ(12)及びプレート(13)か研磨布
(8)(9)の内方に進むに連れて、ブラシ(12)は
研磨布(8)(9)の径方向の更に内方に溜まっている
研磨屑を掻き出していき、プレート(13)は掻き出さ
れた研磨屑を、前述の内方に払われた研磨屑とともに、
研磨布(8)(9)の更に内方に払い除けていく。そし
て、ブラシ(12) 、プレート(13)が研磨布(8
)(9)の中心開口部周縁部に達するようになると、プ
レート(13)が研磨屑を研磨布(8)(9)の外に排
出する。
Then, as the brush (12) and plate (13) move inward of the polishing cloths (8) and (9), the brush (12) moves further inward in the radial direction of the polishing cloths (8) and (9). The accumulated abrasive debris is scraped out, and the plate (13) collects the scraped out abrasive debris together with the aforementioned inwardly swept abrasive debris.
The polishing cloths (8) and (9) are further swept away inward. Then, the brush (12) and plate (13) are attached to the polishing cloth (8).
) (9), the plate (13) discharges the polishing debris out of the polishing cloths (8) and (9).

なお、上部定盤(3)の研磨布(9)の表面の研磨屑に
ついては、ブラシ(12)で掻き出されたのち自重によ
り部分的に落下して下部の研磨布(8)上でプレート(
13)により除去されるが、上部研磨布(9)に付着し
た状態にあるものもあり、この付着した研磨屑は上部研
磨布(9)上でプレート(13)によって除去される。
Note that polishing debris on the surface of the polishing cloth (9) on the upper surface plate (3) is scraped off by the brush (12) and then falls partially due to its own weight and is deposited on the lower polishing cloth (8) on the plate. (
13), some of them remain attached to the upper polishing cloth (9), and these attached polishing debris are removed by the plate (13) on the upper polishing cloth (9).

この除去にともなって更に研磨屑は部分的に落下するか
、落下しない研磨屑はプレート(13)によって研磨布
(9)の内方側に払い除けられていき、最終的に研磨布
(9)外に排出される。
Along with this removal, the polishing debris either partially falls down, or the polishing debris that does not fall is swept away by the plate (13) toward the inside of the polishing cloth (9), and finally the polishing debris (9) is discharged outside.

その後今度は、第3図(イ)(ロ)に示されるように、
プレート(13)が回動作動装置の作動により定盤(2
)(3)の半径線方向に対し外開き状に傾斜された状態
に回動され、そして、進退作動装置(14)  (15
)により、ブラシ(12)、プレート(13)は退出方
向に移動される。これにより、前記の進出作動時に掻き
出されなかった研磨屑か、研磨布(8)(9)から掻き
出され、かつ掻き出された研磨屑がプレート(13)に
伴われなから移行され、該プレート(13)の外方側の
側部から研磨布外方側に払い除けられる。そして、ブラ
シ(12)及びプレート(13)が研磨布(8)(9)
の外方に向けて退出していくに従って、上記とは逆に、
ブラシ(12)は更に外方の領域に溜まっている研磨屑
を掻き出し、プレート(13)は掻き出された研磨屑を
、外方に払われた研磨屑と共に、研磨布(8)(9)の
更に外方側に払い除けていき、そして、ブラシ(12)
 、プレート(13)が研磨布(8)(9)の外周縁部
をこえるようになると、プレート(13)が研磨屑を研
磨布(8)(9)の外に排出し、これにより、研磨布(
8)(9)の清浄か達成される。
After that, as shown in Figure 3 (a) and (b),
The plate (13) is moved to the surface plate (2) by the operation of the rotational movement device.
) (3) are rotated in an outwardly inclined state with respect to the radial direction, and the advance/retreat actuating devices (14) (15
), the brush (12) and plate (13) are moved in the exit direction. As a result, the polishing debris that was not scraped out during the advance operation or scraped out from the polishing cloths (8) and (9) is transferred to the plate (13) without being accompanied by it. The polishing cloth is swept away from the outer side of the plate (13) to the outer side. The brush (12) and the plate (13) are attached to the polishing cloths (8) and (9).
Contrary to the above, as it exits outwards,
The brush (12) further scrapes out the abrasive debris accumulated in the outer area, and the plate (13) collects the scraped abrasive debris together with the abrasive cloths (8) and (9). Brush (12) further outward.
, when the plate (13) exceeds the outer periphery of the polishing cloths (8) and (9), the plate (13) discharges the polishing debris to the outside of the polishing cloths (8) and (9). cloth(
8) The cleanliness of (9) is achieved.

その後、再び基板(A)かワークキャリアー(6)に保
持され、上下の定盤(2)(3)か研磨加工に適した高
さに昇降作動されて研磨加工が再開される。
Thereafter, the substrate (A) is held by the work carrier (6) again, and the upper and lower surface plates (2) and (3) are moved up and down to a height suitable for polishing, and the polishing process is restarted.

なお、この研磨布(8)(9)の清浄は、研磨布の性質
、溜まった研磨屑の量等に応して、ブラシ(12) 、
プレート(13)を複数回往復作動させるようにしても
よいし、また進出作動時にのみ、あるいは退出作動時に
のみ研磨布(8)(9)の清浄を行うように制御される
ものとなされていてもよい。
The cleaning of the polishing cloths (8) and (9) depends on the properties of the polishing cloth, the amount of accumulated polishing debris, etc., using the brush (12),
The plate (13) may be reciprocated multiple times, and the polishing cloths (8) and (9) may be controlled to be cleaned only during the advancing operation or only during the retracting operation. Good too.

また、ブラシ(12)とプレート(13)とを、第4図
に示されるように、一体的に組み合わされたプレート付
きブラシ(20)とし、これを進退作動装置(14)に
取り付けると共に、回動作動装置(I7)により回動し
うるような構成が採用されてもよい。
In addition, the brush (12) and the plate (13) are integrally combined as a brush (20) with a plate, as shown in FIG. A configuration that can be rotated by an operating device (I7) may be adopted.

また、ブラシ(12)とプレート(13)とは、上記の
ように隣接状態に配置されたものでなくとも、1800
位相を異ならせた位置等に配置されるものとなされてい
てもよい。
Moreover, even if the brush (12) and the plate (13) are not arranged adjacently as described above, the brush (12) and the plate (13) are
They may be arranged at positions with different phases.

一方、第5図に示される実施例装置は、ブラシ(12)
 、プレート(13)が研磨布(8)(9)の半径線全
長に亘って配置されるような長さを有するものに形成さ
れると共に、該プレート付きブラシ(20)を定盤(2
)(3)閣内の位置と定盤(2)(3)間外の位置との
2位置間で位置変更せしめる位置変更装置(21)が備
えられたものである。かかる装置では、ブラシ(12)
で掻き出された研摩屑が、プレート(13)に伴われ、
プレート(13)の上下両縁部に沿って一側方へと移行
され、該側部から研磨布(8)(9)外に排出される。
On the other hand, the embodiment device shown in FIG.
, the plate (13) is formed to have a length such that it is disposed over the entire radius of the polishing cloths (8) and (9), and the brush (20) with the plate is placed on the surface plate (2).
) (3) A position change device (21) is provided for changing the position between two positions: a position inside the cabinet and a position outside the surface plate (2) and (3). In such a device, the brush (12)
The abrasive debris scraped out is carried by the plate (13),
It is transferred to one side along both the upper and lower edges of the plate (13), and is discharged from the side to the outside of the polishing cloths (8) and (9).

なお、この場合、プレート付きブラシ(20)は、定盤
(2)(3)の半径線方向に対して所定の角度に傾斜さ
れた状態で位置変更装置(21)に固着状態に取り付け
られていてもよいし、要すれば前記実施例と同様に回動
制御しつるよ−うになされていてもよい。
In this case, the plated brush (20) is fixedly attached to the position changing device (21) while being inclined at a predetermined angle with respect to the radial direction of the surface plates (2) and (3). Alternatively, if necessary, the rotation may be controlled in the same manner as in the above embodiment.

なお、かかる2位置変更型の構成では、プレート(13
)は水平断面形状においてブラシ(12)側に凸のへの
字状のものが採用されてもよい。
In addition, in such a two-position change type configuration, the plate (13
) may have a horizontal cross-sectional shape that is convex toward the brush (12).

その場合、ブラシによって掻き出された研摩屑はプレー
ト(13)によってその両側部から同時に研磨布外に除
去される。
In this case, the abrasive debris scraped out by the brush is simultaneously removed from both sides of the polishing cloth by the plate (13).

発明の効果 上述の次第でこの発明の研磨装置における研磨布の清浄
装置は、研磨布の取着された定盤が自軸回りで回転駆動
可能に支持されると共に、掻出し用ブラシと除去用プレ
ートとが同定盤の側方位置に待機状態に配置され、かつ
研磨布の清浄時に該プレートとブラシとを、前記待機位
置から研磨布上の位置に、研磨布の周方向において相前
後して配置される態様において移行させる駆動手段が具
備されたものであるから、定盤が回転駆動された状態で
ブラシとプレートとが側方待機位置から研磨布上に移行
されると、研磨布の研摩屑はブラシの作用によって掻き
出され、掻き出されて研磨布面に存する研摩屑は、プレ
ートの作用によって除去される。従って、研磨布の表面
層に溜まった研摩屑の掻出しを効果的に実施することが
できると共に、掻き出した研摩屑を残すことなく除去す
ることができ、研磨布の清浄を能率的に実施することが
できる。
Effects of the Invention As described above, in the polishing cloth cleaning device in the polishing apparatus of the present invention, the surface plate to which the polishing cloth is attached is supported so as to be rotatable around its own axis, and the scraping brush and the removing brush are provided. A plate is arranged in a standby state at a side position of the polishing plate, and when cleaning the polishing cloth, the plate and the brush are moved from the standby position to a position on the polishing cloth one after another in the circumferential direction of the polishing cloth. Since the brush and the plate are provided with a driving means for moving the brush and the plate in the manner in which they are arranged, when the brush and plate are moved from the side standby position onto the polishing cloth while the surface plate is rotationally driven, the polishing of the polishing cloth is The debris is scraped out by the action of the brush, and the scraped polishing debris remaining on the surface of the polishing cloth is removed by the action of the plate. Therefore, it is possible to effectively scrape out the abrasive debris accumulated on the surface layer of the abrasive cloth, and also to remove the scraped abrasive debris without leaving any residue behind, making it possible to efficiently clean the abrasive cloth. be able to.

しかも、前記プレートは、従来のような研摩屑の掻出し
を行うものではなく、ブラシで掻き出した研摩屑を除去
するものとして機能するものであるから、該プレートと
研磨布との接触圧力は小さくてよく、そのため、研磨布
に傷をつけるというようなこともない。
Moreover, the plate does not scrape out abrasive debris as in the conventional case, but functions to remove abrasive debris scraped out by a brush, so the contact pressure between the plate and the polishing cloth is small. Therefore, there is no possibility of damaging the polishing cloth.

更に、プレートは、研摩屑を側部側に除去する態様にお
いて定盤の半径線方向に対し所定の角度に傾斜されてい
るから、研摩屑は、該プレートの側方に次々に払い除け
られ、該プレートに伴われる研摩屑の量が一定以上に増
加してしまうことがなく、そのため、プレートによる研
摩屑の除去効果を清浄中常時適正に保つことかできる。
Further, since the plate is inclined at a predetermined angle with respect to the radial direction of the surface plate in such a manner that the abrasive debris is removed to the side, the abrasive debris is successively removed to the side of the plate, The amount of abrasive debris accompanying the plate does not increase beyond a certain level, so that the removal effect of the abrasive debris by the plate can be maintained at an appropriate level at all times during cleaning.

【図面の簡単な説明】[Brief explanation of drawings]

第1図ないし第5図はこの発明の実施例を示すもので、
第1図(イ)は一実施例装置の垂直断面図、同図(ロ)
は同図(イ)の1−1線矢視図、第2図(イ)は清浄装
置の進出作動途中の状態を示す垂直断面図、同図(ロ)
は同図(イ)の■−■線矢視図、同図(ハ)はプレート
による研摩屑の除去作用の状態を示す斜視図、第3図(
イ)は清浄装置の退出作動途中の状態を示す垂直断面図
、同図(ロ)は同図(イ)の■−■線矢視図、第4図は
他の実施例に係るものでプレートを一帯的に取着したプ
レート付きブラシの斜視図、第5図(イ)は更に他の実
施例に係る装置の垂直断面図、同図(ロ)は同図(イ)
のV−V線矢視図である。 第6図は従来の研磨装置の斜視図、第7図及び第8図は
それぞれ研磨布の清浄のため、従来より行われていた方
法を示す斜視図である。 (1)・・・研磨装置、(2)(3)・・・研磨用定盤
、(7)・・・研磨布清浄装置、(8)(9)・・・研
磨布、(12)・・・掻出し用ブラシ、(13)・・・
研磨屑除去用プレート、(14)  (15)・・・進
退作動装置(駆動手段)、(21)・・・位置変更装置
(駆動手段)。 以上 (ロ) 第3図 第4図
1 to 5 show embodiments of this invention,
Figure 1 (a) is a vertical sectional view of an embodiment of the device, and the same figure (b)
Figure 2 (a) is a vertical cross-sectional view showing the state in which the purifier is in the middle of advancing operation, and figure (b) is a view taken along the line 1-1 in the same figure (a).
is a view taken along the line ■-■ in Figure (A), Figure (C) is a perspective view showing the state of the removal action of polishing debris by the plate, and Figure 3 (
A) is a vertical sectional view showing a state in which the purifier is in the middle of an evacuation operation, FIG. 4 is a view taken along the line ■-■ in FIG. FIG. 5(a) is a vertical cross-sectional view of a device according to another embodiment, and FIG.
It is a VV line arrow view of. FIG. 6 is a perspective view of a conventional polishing apparatus, and FIGS. 7 and 8 are perspective views each showing a conventional method for cleaning a polishing cloth. (1)...polishing device, (2)(3)...polishing surface plate, (7)...polishing cloth cleaning device, (8)(9)...polishing cloth, (12)... ...Brush for scraping, (13)...
Plate for removing polishing debris, (14) (15) Advance/retreat actuator (drive means), (21) Position change device (drive means). Above (b) Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 研磨布が取着された研磨用定盤が備えられ、ワークを該
研磨布に押当て状態に保持して該ワークの研磨を行う研
磨装置における研磨布の清浄装置であって、 前記定盤が自軸回りで回転駆動可能に支持されると共に
、研磨布の研磨屑を掻き出す掻出し用ブラシと、研磨布
面に掻き出された研磨屑を側部側に除去するように定盤
の半径線方向に対し所定の角度に傾斜された研磨屑除去
用プレートとが同定盤の側方位置に待機状態に配置され
、かつ研磨布の清浄時に該プレートと前記ブラシとを、
前記待機位置から研磨布上の位置に、研磨布の周方向に
おいて相前後して配置される態様において移行させる駆
動手段が具備されてなることを特徴とする研磨装置にお
ける研磨布の清浄装置。
[Scope of Claims] A polishing cloth cleaning device in a polishing apparatus, which is equipped with a polishing surface plate to which a polishing cloth is attached, and polishes the workpiece by holding the workpiece pressed against the polishing cloth. The surface plate is supported so as to be rotatable around its own axis, and a scraping brush for scraping out polishing debris from the polishing cloth and a scraping brush for scraping polishing debris scraped off the surface of the polishing cloth are removed from the side. A polishing debris removal plate inclined at a predetermined angle with respect to the radial direction of the polishing plate is placed in a standby state at a side position of the polishing plate, and when cleaning the polishing cloth, the plate and the brush are removed.
A cleaning device for a polishing cloth in a polishing apparatus, characterized in that the cleaning device for a polishing cloth in a polishing apparatus is provided with driving means for moving from the standby position to a position on the polishing cloth in a manner that they are arranged one after the other in the circumferential direction of the polishing cloth.
JP2141860A 1990-05-30 1990-05-30 Cleaning device for abrasive cloth in polishing device Pending JPH0435871A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2141860A JPH0435871A (en) 1990-05-30 1990-05-30 Cleaning device for abrasive cloth in polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2141860A JPH0435871A (en) 1990-05-30 1990-05-30 Cleaning device for abrasive cloth in polishing device

Publications (1)

Publication Number Publication Date
JPH0435871A true JPH0435871A (en) 1992-02-06

Family

ID=15301851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2141860A Pending JPH0435871A (en) 1990-05-30 1990-05-30 Cleaning device for abrasive cloth in polishing device

Country Status (1)

Country Link
JP (1) JPH0435871A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961377A (en) * 1997-01-17 1999-10-05 Samsung Electronics Co., Ltd. Chemical mechanical polishing systems including brushes and related methods
US6022266A (en) * 1998-10-09 2000-02-08 International Business Machines Corporation In-situ pad conditioning process for CMP

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961377A (en) * 1997-01-17 1999-10-05 Samsung Electronics Co., Ltd. Chemical mechanical polishing systems including brushes and related methods
US6022266A (en) * 1998-10-09 2000-02-08 International Business Machines Corporation In-situ pad conditioning process for CMP

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