JPH04361173A - Ic socket - Google Patents
Ic socketInfo
- Publication number
- JPH04361173A JPH04361173A JP3136100A JP13610091A JPH04361173A JP H04361173 A JPH04361173 A JP H04361173A JP 3136100 A JP3136100 A JP 3136100A JP 13610091 A JP13610091 A JP 13610091A JP H04361173 A JPH04361173 A JP H04361173A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- burn
- board
- notch
- lead pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
- H05K3/308—Adaptations of leads
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明はバーンインボード用Ｉ
Ｃソケットに関するものである。[Industrial Application Field] This invention is for burn-in board I
It concerns the C socket.
【０００２】0002
【従来の技術】図３，図４は従来の異なるＩＣソケット
を示す図であり、図において１はフレーム、２Ａはスト
レート形状のリードピン、２Ｂはスルーホール形状のリ
ードピンである。2. Description of the Related Art FIGS. 3 and 4 are diagrams showing different conventional IC sockets. In the figures, 1 is a frame, 2A is a straight lead pin, and 2B is a through-hole lead pin.
【０００３】次に動作について説明する。フレーム１に
実装されたストレート形状のリードピン２Ａ、あるいは
スルーホール形状のリードピン２Ｂをバーンインボード
（図示せず）に実装し、半田付け、またはスズメッキ線
等を空中配線して使用する。Next, the operation will be explained. The straight-shaped lead pins 2A or through-hole-shaped lead pins 2B mounted on the frame 1 are mounted on a burn-in board (not shown), and used by soldering or wiring with tin-plated wires or the like in the air.
【０００４】0004
【発明が解決しようとする課題】従来のＩＣソケットは
以上のように構成されているので、高密度実装を行った
際には空中配線が難しく、効率が落ちるうえに信頼性が
得にくいという問題点があった。[Problems to be Solved by the Invention] Conventional IC sockets are configured as described above, so when high-density mounting is performed, aerial wiring is difficult, efficiency is reduced, and reliability is difficult to obtain. There was a point.
【０００５】この発明は上記のような問題点を解消する
為になされたもので、高密度実装を行った際にも空中配
線が容易となってバーンインボード製作作業の効率が上
がるうえにハンダ付け箇所の信頼性も向上するＩＣソケ
ットを得ることを目的とする。[0005] This invention was made in order to solve the above-mentioned problems. Even when performing high-density mounting, aerial wiring becomes easier, increasing the efficiency of burn-in board production work, and reducing the need for soldering. The purpose is to obtain an IC socket that also improves the reliability of the parts.
【０００６】[0006]
【課題を解決するための手段】この発明に係るＩＣソケ
ットは、配線実装用リードピンの先端部分に切り欠きを
設けたものである。[Means for Solving the Problems] An IC socket according to the present invention has a notch provided at the tip of a lead pin for wiring mounting.
【０００７】[0007]
【作用】この発明におけるＩＣソケットは、リードピン
の先端に切り欠きを設けたので容易に空中配線をするこ
とが出来る。[Operation] Since the IC socket of the present invention has a notch at the tip of the lead pin, aerial wiring can be easily performed.
【０００８】[0008]
【実施例】以下、この発明の一実施例を図１について説
明する。図１において、ＩＣソケットのフレーム１に実
装されたリードピン２は、先端部分に切り欠き３がほど
こされて鉤状に構成されている。このようにＩＣソケッ
トのフレーム１に実装されたリードピン２の先端部分に
切り欠き３を設けて鉤状に構成しておくと、バーンイン
ボードに高密度実装した場合でも、容易に空中配線する
ことが出来る。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, a lead pin 2 mounted on a frame 1 of an IC socket has a hook-shaped structure with a notch 3 at its tip. By providing a hook-shaped notch 3 at the tip of the lead pin 2 mounted on the frame 1 of the IC socket in this way, it is possible to easily perform aerial wiring even when high-density mounting is performed on a burn-in board. I can do it.
【０００９】なお、上記実施例ではＩＣソケットのフレ
ーム１に実装されたリードピン２に切り欠き３を設けて
鉤状に構成したものを示したが、図２に示すようにＵ字
型の切り欠き３Ａを設けてＵ字状リードピンのように構
成しても同様の効果が得られる。In the above embodiment, the lead pin 2 mounted on the frame 1 of the IC socket is provided with a notch 3 to form a hook shape, but as shown in FIG. Similar effects can be obtained by providing 3A and configuring it like a U-shaped lead pin.
【００１０】0010
【発明の効果】以上のように、この発明によればバーン
インボード用ＩＣソケットのリードピンの先端部分に切
り欠きを設けることにより、空中配線等の作業効率と半
田付け部分の信頼性が向上するという効果が得られる。[Effects of the Invention] As described above, according to the present invention, by providing a notch at the tip of the lead pin of an IC socket for a burn-in board, work efficiency such as aerial wiring and reliability of the soldering part are improved. Effects can be obtained.
【図１】この発明の一実施例によるＩＣソケットを示す
図である。FIG. 1 is a diagram showing an IC socket according to an embodiment of the present invention.
【図２】この発明の他の実施例によるＩＣソケットを示
す図である。FIG. 2 is a diagram showing an IC socket according to another embodiment of the invention.
【図３】従来のＩＣソケットを示す図である。FIG. 3 is a diagram showing a conventional IC socket.
【図４】従来の異なるＩＣソケットを示す図である。FIG. 4 is a diagram showing different conventional IC sockets.
１ フレーム ２ リードピン ３ 切り欠き 1 Frame 2 Lead pin 3 Notch
Claims (1)
いて、配線実装用リードピンの先端部分に切り欠きを設
けたことを特徴とするＩＣソケット。1. An IC socket for a burn-in board, characterized in that a notch is provided at the tip of a lead pin for wiring mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3136100A JPH04361173A (en) | 1991-06-07 | 1991-06-07 | Ic socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3136100A JPH04361173A (en) | 1991-06-07 | 1991-06-07 | Ic socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04361173A true JPH04361173A (en) | 1992-12-14 |
Family
ID=15167276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3136100A Pending JPH04361173A (en) | 1991-06-07 | 1991-06-07 | Ic socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04361173A (en) |
-
1991
- 1991-06-07 JP JP3136100A patent/JPH04361173A/en active Pending
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