JPH04361502A - Chip type coil - Google Patents

Abstract

PURPOSE:To accomplish both simplification of mounting on a printed substrate and high density mounting by a method wherein a core wire is exposed at both ends of a self-fusing wire, one of two exposed end parts is arranged on the upper surface side, and the other end part is arranged on the lower surface side. CONSTITUTION:First, a chip type coil 1, consisting of a flat coil molded body, is obtained by annularly winding a self-fusing conductor in plurality of layers in such a manner that each conductor is closely fixed with each other. This coil 1 has flat upper and lower surfaces, the lower surface becomes the side where a printed substrate will be fixed, and the upper surface becomes the flat surface on the opposite side. At this point, the insulating film and the adhered film, in the suitable length l1 on both end sections of the start-of-winding part and the finishing end of winding of the self-fusing conductor of the chip type coil 1, are removed and the core wire is exposed. The exposed end section la on one side is arranged on the side of the inner circumference of the lower surface, and other exposed end section 1b is arranged on the side of the outer circumference of the upper surface. As a result, the mounting process to the printed substrate and the like can be reduced sharply, and a high density mounting can be made possible.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type coil, and is particularly suitable for use in a flat brushless DC motor.

0002

2. Description of the Related Art Conventionally, a self-welding conducting wire shown in FIG. 2 has been used as a conducting wire for forming a chip-type coil. Figure 2
In the self-fusing conducting wire 2, an insulating film 4 such as enamel is applied to the surface of a core wire 3 made of copper or the like, and an adhesive film 5 is further applied thereon.
It has been subjected to The chip-type coil is a flat coil molded body formed by winding the single self-welding conducting wire 2 in a ring shape and in multiple layers in close contact with each other.

[0003] Conventionally, in flat type brushless DC motors, etc., a plurality of such chip-type coils are fixed at predetermined positions on a printed circuit board, and the tip core wires of the ends of their lead wires are exposed and After manually soldering the circuit pattern, or manually connecting the lead wires to the terminal pins provided on the printed circuit board, etc.,
It was soldering.

[0004] In addition, as disclosed in Japanese Patent Publication No. 1-20522, both exposed portions of the self-bonding conductive wire of a chip-type coil are positioned and fixed on a predetermined land portion of a printed circuit board and soldered. method was used.

[0005]

[Problems to be Solved by the Invention] As described above, with conventional chip-type coils, the lead wires had to be routed and soldered manually, which significantly reduced work efficiency, and when terminal pins were used, However, there was a problem in that a jig was required to tie the lead wires.

Furthermore, a large space is required to route the lead wires of the plurality of chip-type coils, which poses a problem that becomes an obstacle to miniaturizing the motor. Furthermore, even if manual soldering is not required, there is a problem in that there is a limit to achieving higher density mounting because the land area on the printed circuit board cannot be reduced.

The present invention has been made to solve the above-mentioned problems, and aims to provide a chip-type coil that can be easily mounted on a printed circuit board and that can achieve high-density packaging. shall be.

[0008]

[Means for Solving the Problems] In the chip-type coil of the present invention, the core wire is exposed at both ends or near both ends of the self-fusion conductive wire, and one of the exposed ends is placed on the upper surface side and the other is placed on the lower surface side. This is what was placed.

[0009]

[Operation] In the chip-type coil according to the present invention, one of the exposed ends can be soldered to a circuit pattern land portion of a printed circuit board, and the other end can be soldered to an electrode portion of a chip component.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of a chip-type coil according to an embodiment of the present invention. In FIG. 1, 1 is a chip-type coil consisting of a flat coil molded body formed by winding self-fusing conductive wires in close contact with each other in an annular shape and in multiple layers, and has a lower surface and an upper surface that are flat surfaces of the coil molded body. The lower surface is the printed circuit board fixing surface, and the upper surface is the opposite flat surface. As the self-fusing conductive wire used in the chip-type coil 1, one having the configuration shown in FIG. 2 is used.

In this embodiment, the insulating film 4 and adhesive film 5 of an appropriate length l1 are removed from both end portions of the self-fusing conducting wire 2 of the chip-type coil 1 at the beginning and end of the winding to expose the core wire 3. , this one exposed end 1a is connected to a chip type coil 1
The exposed end portion 1b is arranged on the inner peripheral side of the lower surface, and the other exposed end portion 1b is similarly arranged on the outer peripheral side of the upper surface.

FIG. 3 is an explanatory diagram for mounting the chip-type coil having the configuration shown in FIG. 1 on a printed circuit board. In FIG. 3, 6 is a printed circuit board, 6a is a predetermined circuit pattern land portion of the printed circuit board 6, 6c is also a land portion, and 7
Reference numerals denote chip parts such as resistors and capacitors constituting the circuit of the printed circuit board 6, 7b is one of the chip parts, and 7c is the other electrode part.

The chip-type coil 1 is placed on a printed circuit board 6 with its lower surface facing down, and is placed on a predetermined circuit pattern land portion 6.
a and one exposed end 1a are soldered, and the other exposed end 1b and one electrode portion 7b of the chip component 7 are soldered. Further, the other electrode portion 7c of the chip component 7 is soldered to a predetermined land portion 6c of the printed circuit board 6.

FIG. 4 shows a cross section after mounting, and the same parts as in FIG. 3 are given the same reference numerals. 8 is solder used for soldering, and the exposed end portion 1a and the circuit pattern land portion 6a
, are arranged so that the exposed end portion 1b and the electrode portion 7b are fixed together.

As described above, the chip type coil 1, the printed circuit board 6, and the chip component 7 are mechanically and electrically connected and fixed. Note that if sufficient mechanical bonding strength cannot be obtained, methods such as bonding with an adhesive or screwing are used for reinforcement.

FIG. 5 shows a second embodiment of the present invention, in which the same or corresponding parts as in FIG. 1 are given the same reference numerals. In FIG. 5, at the exposed ends 1a and 1b, the core wire 3 is exposed by a length l1 from a position separated by a length l2 from the tips of the starting and ending parts of the chip-type coil 1 toward the intermediate side. The positions of both exposed ends 1a and 1b in the chip-type coil 1 are the same as in the case of FIG. In this way, the starting and ending parts of the chip-type coil 1 have a length l2
It can be reliably positioned on the printed circuit board even if it comes loose within the range of .

[0017]

[Effects of the Invention] As described above, according to the present invention, one of the exposed ends of the coil is arranged on the lower surface side and the other on the upper surface side, so that the lead wire can be drawn out as in the conventional case. This eliminates the hassle of wiring, incorrect wiring, etc.
It is possible to significantly reduce the mounting process to a printed circuit board, etc., and it is also possible to automatically mount the coil along with the chip components to the printed circuit board, etc.

Furthermore, the number of soldering lands for chip-type coils and chip components to the printed circuit board is halved, and the area occupied by the land portions of the printed circuit board can be further reduced, allowing for high-density mounting of printed circuit boards, etc. It has the effect of making it possible.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a chip-type coil according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a self-fusing conducting wire.

FIG. 3 is an explanatory diagram for mounting the chip-type coil according to the above embodiment on a printed circuit board.

FIG. 4 is a sectional view after mounting according to the above embodiment.

FIG. 5 is a perspective view of a chip-type coil according to another embodiment of the present invention.

[Explanation of symbols]

1 Chip type coil 1a, 1b exposed end 2 Self-fusing conductor wire 3 Core wire 4 Insulating film 5 Adhesive film

Claims (1)

[Claims] Claim 1: A flat coil molded body having an upper surface and a lower surface formed by winding a single self-bonding conductive wire having an insulating film and an adhesive film on the outside of the core wire in close contact with each other in an annular shape and in multiple layers. , a chip-type coil having exposed ends with the core wire exposed at the beginning and end of the winding, characterized in that one of the exposed ends is arranged on the lower surface side and the other on the upper surface side. Chip type coil.