JPH0436247U - - Google Patents

Info

Publication number
JPH0436247U
JPH0436247U JP1990078399U JP7839990U JPH0436247U JP H0436247 U JPH0436247 U JP H0436247U JP 1990078399 U JP1990078399 U JP 1990078399U JP 7839990 U JP7839990 U JP 7839990U JP H0436247 U JPH0436247 U JP H0436247U
Authority
JP
Japan
Prior art keywords
copper
clad
pattern
kovar
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990078399U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990078399U priority Critical patent/JPH0436247U/ja
Publication of JPH0436247U publication Critical patent/JPH0436247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図はこの考案の一実施例を示す図
、第３図、第４図は従来の高熱伝導性気密パツケ
ージの例を示す図であり、図において、１はコバ
ールフレーム、２はコバールリード、３は貫通孔
、４はハーメチツクガラス、５はベース、６はろ
う材、７，２４はネジ止め穴、８は高熱伝導性セ
ラミツク基板、９は半導体チツプ、１０は銅張り
回路パターン、１１は銅張り部品取付けパターン
、１２，１３は銅張りパターン、１３，１４は半
田、１５はボンデイングワイヤ、１６はカバー、
２０は高熱伝導性セラミツクスベース、２１は銅
張りフレーム取付けパターン、２２はネジ止め用
突起部、２５はろう材又は半田である。なお、図
中同一符号は同一又は相当部分を示す。 1 and 2 are views showing an embodiment of this invention, and FIGS. 3 and 4 are views showing an example of a conventional highly thermally conductive airtight package. In the figures, 1 is a Kovar frame, 2 is Kovar lead, 3 is a through hole, 4 is hermetic glass, 5 is a base, 6 is a brazing material, 7 and 24 are screw holes, 8 is a highly thermally conductive ceramic substrate, 9 is a semiconductor chip, and 10 is copper clad. circuit pattern, 11 is a copper-clad component mounting pattern, 12 and 13 are copper-clad patterns, 13 and 14 are solder, 15 is a bonding wire, 16 is a cover,
20 is a highly thermally conductive ceramic base, 21 is a copper-clad frame mounting pattern, 22 is a projection for screwing, and 25 is a brazing material or solder. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方の面に、全面又は数ブロツクに分割して全
面に渡る銅張りパターンを有し、他方の面に銅張
り回路パターンと銅張り部品取付けパターンと、
この銅張り回路パターン及び銅張り部品取付けパ
ターンを囲う銅張りフレーム取付けパターンとを
有する高熱伝導性セラミツクベースと、この高熱
伝導性セラミツクベースの前記の銅張りフレーム
取付けパターンに取付けられ、前記の銅張り回路
パターン及び銅張り部品取付けパターンを囲うコ
バールフレームと、前記の高熱伝導性セラミツク
ベースと平行に、前記のコバールフレームを貫通
するガラスハーメチツクシールされたコバールリ
ードで構成されていることを特徴とする高熱伝導
性気密パツケージ。 One side has a copper-clad pattern covering the entire surface or divided into several blocks, and the other side has a copper-clad circuit pattern and a copper-clad parts mounting pattern;
a highly thermally conductive ceramic base having a copper-clad frame mounting pattern surrounding the copper-clad circuit pattern and the copper-clad component mounting pattern; It is characterized by comprising a Kovar frame that surrounds the circuit pattern and the copper-clad parts mounting pattern, and a glass hermetic-sealed Kovar lead that penetrates the Kovar frame in parallel with the high thermal conductive ceramic base. High thermal conductivity airtight package.
JP1990078399U 1990-07-24 1990-07-24 Pending JPH0436247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990078399U JPH0436247U (en) 1990-07-24 1990-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990078399U JPH0436247U (en) 1990-07-24 1990-07-24

Publications (1)

Publication Number Publication Date
JPH0436247U true JPH0436247U (en) 1992-03-26

Family

ID=31621641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990078399U Pending JPH0436247U (en) 1990-07-24 1990-07-24

Country Status (1)

Country Link
JP (1) JPH0436247U (en)

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