JPH04365552A - Correcting device for lapping surface plate and carrier for correction - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a modification device and a modification carrier for modifying the polishing surface of a lapping surface plate for polishing an object to be polished, such as a wafer.

0002

2. Description of the Related Art Conventionally, when the polishing surface of a lapping surface plate for polishing an object to be polished such as a wafer is locally worn out, a method shown in FIGS. 7 and 8 is used to correct the polishing surface uniformly. Such correction carriers 31 and 32 were used.

That is, these correction carriers 31,
32 has an outer diameter larger than the width of the polishing surface 33a of the lapping surface plate 33, and holes 31a and 32a having a diameter narrower than the width of the polishing surface 33a are formed in the center thereof, By polishing the correction carriers 31 and 32, the polishing surface 33a of the lapping surface plate 33 itself is polished.

0004

However, according to the conventional correction carriers 31 and 32, since the holes 31a and 32a formed in the center thereof are narrower than the width of the lap surface plate 33, the width of the lap surface plate 33 is There was a problem in that the polished surface 33a of No. 33 was corrected as a surface with undulations, as shown in FIG. In addition, in FIG. 9, b indicates the rotation axis of the lap surface plate 33.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a lapping surface plate repairing device and a repair carrier capable of solving the above-mentioned problems.

[0006]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the lapping surface plate repairing device of the present invention is a repairing device for modifying the polishing surface of a lapping surface plate that polishes an object by lapping. , consisting of a carrier in which a plurality of workpiece insertion holes are formed, and a pseudo workpiece that is inserted into the workpiece insertion hole at a location corresponding to the convex part of the polishing surface of the lapping surface plate to be corrected. It is something.

Further, in order to solve the above-mentioned problems, a carrier for repairing a lapping surface plate according to the present invention is a carrier for repairing a polishing surface of a lapping surface plate for polishing an object to be polished by lapping. The outer diameter of the carrier itself is made wider than the width of the polishing surface of the lapping surface plate, and a hole portion having a diameter wider than the width of the polishing surface of the lapping surface plate is formed in the center thereof.

[0008]

[Operation] According to the configuration of the above-mentioned lapping surface plate correction device, the lapping is fixed because the pseudo workpiece is inserted into the carrier and polished according to the shape of the polished surface to be corrected, that is, according to the convex part. The polished surface of the disc can be made uniform and flat without waviness.

Furthermore, according to the configuration of the carrier for repairing the lapping surface plate, the hole portion having a diameter wider than the width of the polishing surface is formed in the carrier for polishing the polishing surface of the lapping surface plate. By performing polishing using a correction carrier, the polishing surface can be polished to a uniform flat state without waviness.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS A lapping surface plate correction apparatus according to a first embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

As shown in FIGS. 1 and 2, this modification device is a modification device for modifying the polishing surface of a lapping surface plate for polishing a workpiece by lapping polishing.
A disc-shaped carrier 1 in which nine workpiece insertion holes 1a are uniformly distributed throughout, and the workpiece is inserted at a location corresponding to the convex portion of the polishing surface of the lapping surface plate to be corrected. It consists of a disc-shaped pseudo workpiece 2 made of cast iron that is inserted into a hole 1a.

When polishing the lapping surface plate for correction, for example, as shown in FIG. 3(a), the lapping surface plate 3
When the central part of the polishing surface 3a is concave, that is, the inner and outer circumferential parts are convex parts 3b, as shown in FIG. 3(b), the workpiece insertion hole of the carrier 1 The pseudo workpieces 2 are inserted into the workpiece insertion holes 1a corresponding to the convex portions 3b of the workpieces 1a, that is, the 12 workpiece insertion holes 1a on the peripheral edge, and polishing is performed.

Further, as shown in FIG. 4(a), when the inner and outer peripheral portions of the polishing surface 3a of the lapping surface plate 3 are concave, that is, the central portion is a convex portion 3c, as shown in FIG. 4(b
), in the workpiece insertion hole 1a of the workpiece insertion hole 1a at a location corresponding to the convex portion 3c,
That is, polishing is performed by inserting many pseudo-workpieces 2 into the workpiece insertion holes 1a at the center and inserting the pseudo-workpieces 2 at appropriate intervals into the workpiece insertion holes 1a at the periphery.

In this way, the pseudo workpiece is inserted into the carrier and polished according to the shape of the polishing surface of the lapping surface plate to be corrected, that is, according to the convex portion, so that the lapping surface plate can be polished. It is possible to make the polished surface uniform and flat without waviness, and since only the areas corresponding to the convex parts are polished, correction work can be done in a shorter time than when polishing the entire polished surface, for example. .

Next, a carrier for repairing a lapping surface plate according to a second embodiment of the present invention will be explained based on FIGS. 5 and 6. This correction carrier 11 is a correction carrier for correcting the polishing surface 12a of the lapping surface plate 12 that polishes the workpiece by lapping, and the outer diameter of the carrier 11 itself is adjusted to the polishing surface 12a of the lapping surface plate 12. 12a, and a hole 11a having a diameter wider than the width of the polishing surface of the lapping surface plate 12 is formed in the center thereof.

Therefore, when polishing the lapping surface plate 12, as shown in FIG. When inserted and polished, the polished surface will be polished to a uniform flat state without waviness as in conventional methods.

Furthermore, the thickness of the correction carrier 11 is as follows:
The thickness is 1/15 or more of the outer diameter of the carrier 11 itself. This is to increase the rigidity of the carrier 11 itself.

Note that in FIGS. 3, 4, and 6, a indicates the rotation axis of the lap surface plate.

[0019]

[Effects of the Invention] As described above, according to the configuration of the lapping surface plate repairing device of the present invention, the pseudo workpiece is inserted into the carrier according to the shape of the polishing surface to be repaired, that is, according to the convex portion. Since the polishing is performed, the polishing surface of the lapping surface plate can be made uniform and flat without any undulations. Moreover, since only the parts corresponding to the convex parts are polished, for example, when polishing the entire polishing surface Corrections can be made in a shorter time.

Further, according to the structure of the carrier for repairing the lapping surface plate of the present invention, the hole portion wider than the width of the polishing surface is formed in the carrier for polishing the polishing surface of the lapping surface plate, so that this modification can be performed easily. By performing polishing using a carrier, the polishing surface can be polished to a uniform flat state without waviness as in the conventional method.

[Brief explanation of drawings]

FIG. 1 is a plan view of a carrier in a first embodiment of the present invention.

FIG. 2 is a side view of a pseudo workpiece in the first embodiment.

[Fig. 3] This explains the correction work in the first embodiment, in which (a) is a sectional view of the main part showing the state of the polishing surface of the lapping surface plate, and (b) shows the place where the pseudo workpiece is inserted. FIG. 3 is a plan view of the carrier.

[Fig. 4] This explains the correction work in the first embodiment, in which (a) is a sectional view of the main part showing the condition of the polishing surface of the lapping surface plate, and (b) shows the place where the pseudo workpiece is inserted. FIG. 3 is a plan view of the carrier.

FIG. 5 is a plan view of a correction carrier in a second embodiment of the present invention.

FIG. 6 is a sectional view of a main part showing a correction work in the second embodiment.

FIG. 7 is a plan view of a correction carrier in a conventional example.

FIG. 8 is a plan view of a correction carrier in a conventional example.

FIG. 9 is a sectional view of a main part showing a polishing state of a lapping surface plate when a correction work is performed in a conventional example.

[Explanation of symbols]

1 Carrier 1a Workpiece insertion hole 2
Pseudo workpiece 3 Lapping surface plate 3a Polishing surfaces 3b, 3c Convex portion 11 Correction carrier 11a
Hole 12 Lap surface plate 12a Polished surface

Claims (2)

[Claims] 1. A correction device for correcting the polishing surface of a lapping surface plate for polishing an object to be polished by lapping, the device comprising: a carrier in which a plurality of workpiece insertion holes are formed; and a lapping surface plate to be corrected. A lapping surface plate repairing device comprising a pseudo workpiece inserted into the workpiece insertion hole at a location corresponding to the convex portion of the polishing surface. 2. A modification carrier for modifying the polishing surface of a lapping surface plate for polishing a workpiece by lapping, the carrier itself having an outer diameter wider than the width of the polishing surface of the lapping surface plate. A carrier for repairing a lapping surface plate, characterized in that a hole portion having a diameter wider than the width of the polishing surface of the lapping surface plate is formed in the center thereof.