JPH04367293A - Manufacture of circuit board - Google Patents

Abstract

PURPOSE:To manufacture a circuit board having prescribed circuit patterns at low cost. CONSTITUTION:A conductive foil 1 is provided by a pattern punching machine and striplike parts 21 which are extendedly provided in the longitudinal direction of the foil 1, circuit pattern parts 22 arranged at each prescribed interval along the extendedly provided direction of the parts 21 and connection pattern parts 23 to connect the pattern parts 22 with the parts 21 are made to remain. Then, a bonding agent is applied on the punched foil 1 by a bonding agent coating machine, a substrate material 2 is bonded on this foil 1, the foil 1 and the material 2 are sent to a pressure bonding roller and the material 2 is made to pressure-bond to the foil 1. Then, holes are bored in the pressure-bonded material 2 by a perforator, the pattern parts 23 are removed and the pattern parts 22 are insulated. Then, electronic components 10 are respectively installed on the pattern parts 22 by a component installer.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing flexible circuit boards on which various electronic circuits are formed.

0002

2. Description of the Related Art Conventionally, a method using a press as shown in FIG. 3 has been commonly used as a method for producing flexible substrates. In FIG. 3, a flexible substrate material 31 made of polyester, polyimide, etc. and a conductive foil 32 made of copper, aluminum, iron, etc. are both in sheet form and wound into a roll.

An adhesive 34 is applied to the substrate material 31 by a coating machine 33, and a conductive foil 32 is adhered thereon. The substrate material 31 to which the conductive foil 32 is adhered is moved to a press roller 35 having a press blade for forming a circuit pattern on the outer peripheral surface.
sent to. The conductor foil 32 is separated into a predetermined circuit pattern portion 36 and an extra portion 37 by a press roller 35. The separated excess portion 37 is peeled off from the substrate material 31 and rolled up.

[0004] The conductive foil of the circuit pattern portion 36 is pressed onto the substrate material 31 by a pressing roller 38 . Next, a hole punching/outline cutting machine 39 performs hole punching and cutting the outer shape, and separates the sheets one by one. Through the steps described above, the circuit board 40 is obtained.

[0005] The above-mentioned method can produce a board at a high speed, and excess conductive foil not used for circuit patterns can be easily recovered, so manufacturing costs can be reduced in mass production. Ru.

[0006]

However, in the above-described method of manufacturing a circuit board by pressing, in order to further reduce manufacturing costs, the substrate material 31 and the conductive foil 32 must be made thinner. If a thin material is used, there is a problem that when the circuit pattern is pressed by the press roller 35, the substrate material 31 is cut together with the conductor foil 32.

Furthermore, if the conductor foil 32 is made too thin, the excess portion 37 will be removed when the excess portion 37 is peeled off from the substrate material 31.
There was a problem in that the tape 7 was torn and could not be wound. Furthermore, when making the circuit pattern section 36, the shape of the pattern must be such that it can be easily peeled off from the conductive foil 32. However, when the circuit pattern section 36 is used as an antenna, for example, the shape of the pattern makes it difficult to Since the characteristics change, patterns must be created taking into consideration two factors: shape and electrical characteristics, which poses the problem of being extremely difficult to create.

Furthermore, Japanese Patent Application Laid-Open No. 1-228195 discloses that a thin plate of a conductor is punched out to form a circuit pattern, and the circuit pattern formed by the punching is mounted in a molding die.
A method has been disclosed in which a thermoplastic resin is injected into a mold to form a substrate, but this method has problems in that the injection takes time and productivity is poor.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a circuit board that can inexpensively manufacture a circuit board having a predetermined circuit pattern.

0010

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a method for manufacturing a circuit board, in which a long flexible sheet-like conductor foil is punched out, and the conductor foil is A strip portion extending in the longitudinal direction, circuit pattern portions arranged at predetermined intervals along the direction in which the strip portion extends, and a connection pattern portion connecting the circuit pattern portion and the strip portion. and a step of adhering the punched out conductor foil to a long base member made of a substrate material; removing the connection pattern portion from the conductor foil adhered to the base member; A circuit board characterized by comprising the steps of: insulating the circuit pattern portion from the strip portion; and separating the base member to which the strip portion and the conductive foil having the circuit pattern portion are adhered to each board. The gist is the manufacturing method.

[0011]

[Operation and Effects of the Invention] In the present invention, a conductive foil is first punched out and then bonded to a substrate material. Therefore,
When punching out the conductor foil, the substrate material is not punched out together with the conductive foil, and a thin substrate material can be used. As a result, manufacturing costs can be reduced. If paper is used as the substrate material, an extremely inexpensive circuit board can be provided.

[0012] Furthermore, when incorporating a circuit pattern into a flexible thin sheet such as a slip, ticket piece, or card, it is possible to incorporate the paper or card forming the slip without using a special material substrate. A circuit pattern can be directly built into the resin sheet, and a slip or the like can be provided with the functions of an electronic device for calculating and storing data.

Furthermore, since the conductor foil is completely punched out, the circuit pattern can be easily peeled off from the conductor foil. Therefore, it is no longer necessary to make the circuit pattern into a shape that is easy to peel off, and the degree of freedom in shape is increased, making it easier to create the circuit pattern. Further, since the circuit pattern portion of each board is connected to a strip of conductive foil and is continuously transported to each processing position and processed, a large number of circuit boards can be manufactured in a short time.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory diagram showing a manufacturing method according to an embodiment of the present invention. FIG. 2 is an explanatory diagram showing the manufacturing state of the circuit board in each step (a) to (e) of the manufacturing method shown in FIG.

In this embodiment, a thin foil made of a conductor such as copper, aluminum, or iron is used as the conductor foil 1 serving as the circuit pattern. In addition, as the substrate material 2 which becomes the base of the circuit board, for example, polyimide, polyester,
A thin insulating board such as paper is used. Furthermore, the same material as the substrate material 2 is used as the cover material 3 for protecting the circuit pattern and the electronic components attached to the pattern.

In FIG. 1, the pattern punching machine 4 includes:
A conductor foil 1 is punched out. The adhesive applicator 5 applies an adhesive 6 to the conductive foil 1. Pressure roller 7
In this method, a conductive foil 1 and a substrate material 2 are crimped and bonded firmly using an applied adhesive 6.

The hole punching machine 8 is for punching holes in the connection pattern portion and removing the connection pattern portion and the like. The component mounting machine 9 mounts the electronic component 1 using conductive adhesive or the like.
0 on the circuit board. Adhesive applicator 11
1, an adhesive 12 is applied to a substrate material 2 to which a circuit pattern is adhered. The pressure roller 13 is used to press the cover material 3 onto the substrate material 2 to which the conductive foil 1 is adhered. The outline cutting machine 14 cuts the outline of the board to produce the finished product 1.
5.

The manufacturing method of this embodiment will be explained step by step below. First, a conductor foil 1 shown in FIG. 2(a) is punched out using a pattern punching machine 4. At this time, as shown in FIG. 2(b), a strip portion 21 extending in the longitudinal direction of the conductor foil 1 and circuits arranged at predetermined intervals along the direction in which the strip portion 21 extends. The conductor foil 1 is punched out so that the pattern portion 22 and the connection pattern portion 23 connecting the circuit pattern portion 22 and the strip portion 21 remain. next,
An adhesive 6 is applied to the punched conductor foil 1 using an adhesive applicator 5. Next, the substrate material 2 is adhered to the conductive foil 1 coated with the adhesive 6, and is sent to a pressure roller 7 to press the conductive foil 1 and the substrate material 2 together as shown in FIG. 2(c).

Next, holes are made in the crimped substrate using a hole punching machine 8, and as shown in FIG. 24 is removed to insulate each circuit pattern. Next, as shown in FIG. 2(e), the electronic component 10 is mounted on the circuit pattern portion 22 by the component mounting machine 9.

Next, the adhesive 12 is applied to the substrate material 2 on which the electronic component 10 is mounted using the adhesive applicator 11. next,
A cover material 3 is adhered to a substrate material 2 coated with an adhesive 12 and sent to a pressure roller 13 to press the cover material 3 onto the substrate material 2. Next, the outer shape of the board is cut by the outer shape cutting machine 14. As a result, products 15 separated one by one are obtained.

According to this embodiment, the strength of the substrate material 2 may be low, and an inexpensive material such as paper can be used as the substrate material. Therefore, manufacturing costs are reduced. Further, since a product can be manufactured by automatically attaching the electronic component 10 and the cover material 3 without separating the completed board, costs can be further reduced.

[0022] In the above embodiment, the electronic component 10
The connection between the conductor foil 1 and the conductor foil 1 can be made by, for example, soldering such as wire bonding, conductive adhesive, or pressure bonding. Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment in any way, and it goes without saying that it can be implemented in various forms without departing from the spirit of the present invention. For example, from the above-described embodiment, a circuit board having only a circuit pattern may be produced by omitting the step of mounting the electronic component 10 or the step of adhering the cover material 3.

Further, in the above embodiment, the adhesive 6 is applied to the conductor foil 1, but it may be applied to the substrate material 2. Further, in the above-described embodiment, the adhesive 12 is applied to the substrate material 2 to which the conductive foil is adhered, but it may also be applied to the cover material 3.

Furthermore, in the above-described embodiment, the adhesive 12 for bonding the cover material 3 is applied after the electronic component 10 is mounted, but the step of mounting the electronic component 10 and the application of the adhesive 12 are different. The steps may be reversed. In this way, when the electronic component 10 is mounted by the component mounting machine 9, there is no need to use a special adhesive to fix the position of the component.

Furthermore, a paper or resin sheet such as a slip into which a circuit is to be incorporated may be used as the substrate material or cover material, and the circuit may be directly built into the paper or resin sheet. In this way, a thin electronic device having various functions can be provided at low cost.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a manufacturing method according to an embodiment of the present invention.

[Fig. 2] Each step (a) to (e) of the manufacturing method shown in Fig. 1.
) is an explanatory diagram showing the manufacturing state of the circuit board.

FIG. 3 is an explanatory diagram showing a conventional method for creating a flexible substrate.

[Explanation of symbols]

Claims (1)

[Claims] 1. A method for manufacturing a circuit board, comprising: punching out a flexible, elongated sheet-like conductive foil, and forming a strip extending in the longitudinal direction of the conductive foil; a step of leaving circuit pattern portions arranged at predetermined intervals along the direction in which the conductor foil is formed, and a connection pattern portion connecting the circuit pattern portions and the strip portion; a step of adhering the circuit pattern portion to a long base member made of a substrate material; a step of removing the connection pattern portion from the conductive foil adhered to the base member and insulating the circuit pattern portion from the strip portion; A method of manufacturing a circuit board, comprising the step of: separating a base member to which a conductive foil having a circuit pattern part and a conductive foil having a circuit pattern part is adhered, into each board.