JPH0437039A - Solid-state image sensing device - Google Patents

Abstract

PURPOSE:To obtain a solid-state image sensing device capable of miniaturization wherein hindrance to miniaturization is eliminated, by bump-connecting a lead with at least one row out of bonding pad rows, and wire-bonding at least one of the other raws. CONSTITUTION:In a solid-state image sensing device 17, a solid state image sensing element chip 51 is stacked on a ceramic base 53 having a pad 52 composed of a plurality of rows; a lead 55 composed of a copper foil or the like is connected, via a bump 54, with one row out of the pad 52 composed of a plurality of rows; said lead 55 is stretched toward the back direction via the side surface of a base 53, in order to directly constitute an I/O terminal for the outside. On the other hand, the other rows of the pad 52 of the chip 51 are connected with a conducting pattern on the base 53 by using, e.g. bonding wires 56. Thereby superflous ceramic bases and conducting patterns are unnecessitated, and only the necessary and minimum size is required, so that the solid-state image sensing device can be miniaturized.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a solid-state imaging device that is miniaturized.

[Prior Art] In recent years, various types of endoscopes, television cameras, surveillance cameras, etc. that use solid-state imaging devices such as charge coupled devices (CCDs) as imaging means have been proposed and used. In this conventional solid-state imaging device, as seen in, for example, Japanese Patent Laid-Open Publication No. 63-66964, the external input/output terminals of the solid-state imaging device are first connected to a ceramic-based conductive pattern via a bonding wire or the like. Furthermore, external input/output terminals are connected to this ceramic-based electric pattern, which is a bottleneck in downsizing solid-state imaging devices.

By the way, in an endoscope in which this solid-state imaging device is incorporated into the distal end of the insertion section, it is desirable that the insertion section be thin in diameter since it is necessary to insert the insertion section into the patient's body cavity. is required to be downsized.

[Problems to be Solved by the Invention] As described above, conventional solid-state imaging devices have limitations in miniaturization, and it has been difficult to achieve further miniaturization.

The present invention has been made in view of these circumstances, and it is an object of the present invention to provide a solid-state imaging device that can be miniaturized by eliminating bottlenecks in achieving miniaturization.

[Means for Solving the Problems] In order to achieve the above object, a solid-state imaging device according to the present invention has the following features:
In a solid-state image sensor chip having a plurality of rows of bonding pads, at least one of the bonding pad rows is bump-connected to a lead, and at least one other row is wire-bonded.

[Example code] Hereinafter, the present invention will be described in detail with reference to the drawings.

Figures 1 to 3 relate to the first embodiment of the present invention.
2 is a cross-sectional view showing the solid-state imaging device, FIG. 2 is a cross-sectional view showing the distal end side of an endoscope insertion section as an example, and FIG. 3 is an explanatory view showing the entire endoscope system.

As shown in FIG. 3, the endoscope 1 includes an elongated and flexible insertion section 2 and a large-diameter operation section 3 connected to the rear end of the insertion section 2. As shown in FIG. A flexible universal cord 4 extends laterally from the operating section 3, and a connector 5 is provided at the end of the universal cord 4.

This connector 5 is connected to a light source device 6.

A signal cord 7 extends from the connector 5, and a connector 8 is provided at the end of the signal cord 7. This connector 8 is adapted to be connected to a video processor 9. The video processor 9 includes a monitor 1
0, a VTR deck 11, a video printer 12, a video disc 13, etc. are connected thereto.

The insertion section 2 includes, in order from the distal end side, a hard distal end section 2a;
It consists of a bendable bending portion 2b and a visible tube 2c that is visible.

As shown in FIG. 2, the tip portion 2a has a tip component 14, and a tip cover 15 is attached to the tip component 14.
is installed. The tip constituent member 14 and the tip cover 15 are provided with an illumination window, an observation window, an air/water supply port, and a forceps channel port.

A light distribution lens (not shown) is mounted inside the illumination window, and a light guide (not shown) made of a fiber bundle is connected to the rear end of the light distribution lens. This light guide is inserted through the insertion section 2, the aft section 3, and the universal cord 4, and is connected to the connector 5. Illumination light emitted from the light source tube in the light source device 6 is made to enter the incident end of this light guide.

Furthermore, an imaging section 18 having an objective optical system 16 and a solid-state imaging device 17 is provided inside the Wt observation window.

A signal line 2 connected to the solid-state imaging device 17 via a circuit board 21 having a peripheral IC chip 19 on the connected side.
2 is inserted through the insertion section 2, the operating section 3, the universal cord 4, the connector 5, and the signal cord 7, and is connected to the connector 8. The solid-state imaging device 17 is driven by a video processor 9 connected via the connector 8, and the output signal of the solid-state imaging device 17 is subjected to video signal processing by the video processor 9. ing. A video signal from this video processor 9 is input to the monitor 10, VTR deck 11, video printer 12, video disc 13, etc.

Further, an air/water supply tube (not shown) is connected to the air/water supply port. This air/water supply tube is inserted through the insertion section 2, the operating section 3, and the universal cord 4, and is connected to the connector 5. Further, a forceps channel tube 24 is connected to the forceps channel opening via a channel connecting vibe 23. The forceps channel tube 24 is inserted through the insertion section 2 and connected to a forceps insertion port (not shown) provided in the operating section 3.

The curved portion 2b has a large number of approximately cylindrical joint pieces 25, 26.
．． ... are rotatably connected by a joint shaft 27 to form a refined curved tube, and the outer periphery of this curved tube is covered with curved rubber 28. Further, a visible tube 2c is connected to the rear end of the rearmost joint piece.

For example, four angle wires 29 for bending operation are inserted into the insertion section 2, and the tips of the angle wires 29 are fixed to the most advanced g-piece 25 by wires and guides 30. . Furthermore, wire receivers 31 are provided at predetermined intervals on the inner periphery of the joint pieces after the second joint piece 26 from the distal end side, and the angle wire 29 is inserted into the wire receivers 31. The angle wire 29 is pushed and pulled by an angle operation knob provided on the operation section 3, thereby bending the bending section 2b in the vertical/horizontal direction.

Next, the imaging section 18 will be explained in detail.

A first lens frame 32 is fixed to an observation through hole formed in the tip constituent member 14 and the tip cover 15 with an imaging unit fixing screw 33. The first lens frame 32
A front objective lens 35 constituting the objective optical system 16 is attached to the lens. A second lens frame 36 is fixed inside the first lens frame 32, and another lens system of the objective optical system 16 is attached to this second lens frame 36. An element frame 37 is connected to the rear end of the second lens frame 36, and the solid-state imaging device 17 is fixed to this element frame 37. The external input/output terminal 38 of this solid-state imaging device 17 includes
A circuit board 21 on which electronic components are mounted is connected.

A signal line 22 is connected to the substrate 21 via a cable fixing member 41. This signal line 22 is a coaxial cable, and a cable core wire 22a is connected to the board 21, and a shield line 22b is electrically connected to a shield member 42 that covers the solid-state imaging device 17 and the circuit board 21 using a conductive adhesive. It is connected. The cable core wire 22a and the shield wire 22b are each covered with an insulating tube 22C1 and a covering tube 22d.

Further, the outer periphery of the shield member 42 and the connecting portion of the signal line 22 are covered with an insulating heat shrink tube 43.

Next, the configuration of the solid-state imaging device 17 will be explained using FIG. 1.

The solid-state imaging device f17 has multiple rows of bonding pads 5.
2 is superposed on the ceramic base 53 to form the plurality of rows of bonding pads 5.
A lead 55 made of copper foil or the like is connected to one row of the ceramic base 53 through a knob 54, and the lead 55 is connected to the back side of the ceramic base 53 through the side of the ceramic base 53 in order to directly use the lead 55 as an external input/output terminal (38). It is being extended. On the other hand, the bonding pads 52 in the other rows of the solid-state image sensor chip 51 are connected to conductive patterns on the ceramic base 53 by, for example, bonding wires 56. Then, the solid-state image sensor chip 51 and the ceramic base 5 in this state are
A transparent sealing resin 57 is applied to the front or side surfaces of the external input/output terminals 38 to seal the entire ceramic base 53 except for the protruding rear side of the lead 55 as the external input/output terminal 38. A cover glass 58 is bonded to the front surface of the ceramic base 53.A glue portion 59 is connected to and protrudes rearward as an external input/output terminal 38 to the R4 electrical pattern formed on the back surface of the ceramic base 53. An IC chip 61 is connected via a connector 60. A part of the back surface of the ceramic base 53 and the IC chip 61 are sealed with a sealing resin 62, and the sealing resin 62, the back surface of the ceramic base 53, and the external lead 5
A part of the lead 55 and a part of the lead 55 are sealed with an adhesive 63.

In this way, among the input/output signal lines for the solid-state image sensor chip 51, the signal lines that receive signals from the integrated IC chip 61 are connected to the bonding wires 56,
It reaches the IC chip 61 via the conductive pattern of the ceramic base 53 and the bumps 60, and is input/output through the external lead 59. On the other hand, lines that do not undergo signal processing in the IC chip 61 are directly input through the lead 55 of the solid-state image sensor chip 51. It is designed to be output. With this configuration, an extra ceramic base and a conductive pattern are not required, and the size of the solid-state imaging device 17 is reduced to the minimum necessary size.
can be made smaller.

FIG. 4 is an explanatory diagram showing a modification of the first embodiment. In this modification, a connecting portion 55a is provided on the tip side of a lead 55 made of metal foil that extends directly from a solid-state image sensor chip 51 via a bump, and the entire lead 55 is connected. If the plurality of leads 55 extending from the element chip 51 are scattered with foil,
Since it is difficult to connect to the circuit board 66, etc., the leads 55 are made so that they do not come apart so that the connection to the connection side is easy.0 After connecting to the circuit board 66, etc., the leads 55 Then, the connecting portion 55a is trimmed and removed using a YAG laser or the like.

5 to 7 are cross-sectional views showing other modifications of the solid-state imaging device.

In this modification, when the leads connected to the front surface of the solid-state image sensor chip are extended from the side toward the back surface, an insulating member is placed between the element chip and the leads to prevent the leads and the element chip from coming into contact and conducting. This is an alternative to intervening.

In the modification shown in FIGS. 5 and 6, a convex portion 67 is formed on the side of the solid-state image sensor chip 51 so that the contact area with the lead 55 is reduced.

By reducing the contact surface with the lead 55 in this way, the same effect as that of the insulating member can be obtained. In addition, the convex portion 67
Since the element chip 51 and the lead 55 are in contact with each other,
Even if conduction occurs here, the distance from the element chip to the circuit can be maintained to a certain extent and the same effect as with an insulating part can be achieved.

In the modification shown in FIG. 7, the lead 55 portion located on the side of the solid-state image sensor chip 51 is coated with a resin insulating material 68 such as epoxy or polyind in advance, and this is also an insulating material. It has the same effect.

[Effects of the Invention] As explained above, according to the present invention, there is an effect that the size of the solid-state imaging device can be reduced by reducing the required minimum size of silver.

[Brief explanation of drawings]

Figures 1 to 3 relate to the first embodiment of the present invention.
The figure is a sectional view showing a solid-state imaging device, FIG. 2 is a sectional view showing the distal end side of an endoscope insertion section as an example, FIG. An explanatory diagram showing a modification of the first embodiment, and FIGS. 5 to 7 are cross-sectional views showing other modifications of the solid-state imaging device. 17... Solid-state imaging device 53... Ceramic base 52... Bonding pad 56... Bonding wire 51... Element chip 55... Lead @Jf! f Figure 4

Claims (1)

[Claims] A solid-state imaging device comprising a plurality of rows of bonding pads on a solid-state imaging device chip, characterized in that a lead is bump-connected to at least one of the bonding pad rows, and at least one other row is wire-bonded.