JPH04372199A - Fixture for electronic part - Google Patents

Abstract

PURPOSE:To push an electronic part against a member to be mounted by optimum pushing force when the electronic part is installed to the member to be mounted. CONSTITUTION:A suction nozzle 40 is brought down with the lowering of a holding member 41, and an electronic part 94 is placed onto a printed board 96. The holding member 41 is further lowered from the state, and brought down to the suction nozzle 40 while compress-ing a compression coil spring. A dog 102 by the lovyering reflects light emitted from a photoelectric switch 112, the start of the relative displacement of the holding member 41 and the suction nozzle 40 is detected, the quantity of the holding member 41 brought down after the start of relative displacement is detected is determined in quantity, where pushing force against the printed board 96 of the electronic part 94 by the suction nozzle 40 reaches optimum magnitude, on the basis of the spring characteristics of the compression coil spring, and a servo motor 26 for elevating and lowering the nozzle is driven for bringing down the holding member 41 only by the quantity.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to control of a pressing force for pressing an electronic component against a member to be mounted.

0002

2. Description of the Related Art Some devices include a suction nozzle for mounting electronic components onto a member to be mounted, such as a printed circuit board. This mounting device generally includes a suction nozzle that suctions electronic components by vacuum, a holding member that is movably supported in the axial direction by the device body and holds the suction nozzle relatively movable in the axial direction, and a suction nozzle. The holding member is configured to include a spring that urges the distal end portion of the holding member to a protruding position where it protrudes longest from the holding member, and a moving device that moves the holding member in the axial direction. In this device, the holding member is moved toward the mounting target member, and the suction nozzle is moved toward the mounting target member, and the holding member is further reduced from the state where the electronic component is in contact with the mounting target member. The electronic component is mounted on the mounting target member by being brought close to the mounting target member. Movement of the holding member after the electronic component comes into contact with the mounting target member is allowed by the holding member compressing the spring and moving relative to the suction nozzle, and the holding member is moved in this way. As a result, the electronic component can be reliably mounted on the mounting target member even if there is variation in the distance between the electronic component and the mounting target member when the holding member starts moving.

0003

[Problems to be Solved by the Invention] When mounting an electronic component on a member to be mounted in this manner, it is desirable that the pressing force for pressing the electronic component against the member to be mounted is of a magnitude suitable for mounting. Conventionally, there was variation in the pressing force, which could lead to a decrease in the mounting accuracy of electronic components and damage to the electronic components. An object of the invention is to provide an electronic component mounting device that can press and mount an electronic component onto a member to be mounted by pressing it with an optimal pressing force. An object of the invention is to provide an electronic component mounting apparatus that can press an electronic component onto a mounting target member with an optimal pressing force even when there are a plurality of suction nozzles.

0004

[Means for Solving the Problems] In order to solve the above-mentioned problems, the invention of claim 1 provides the above-mentioned (a) suction nozzle, (b)
) a holding member, (c) a spring, and (d) a moving device; (e) holding the holding member while being moved by the moving device in a direction approaching the member to which the electronic component is mounted; (f) a detection means for detecting the start of relative movement between the member and the suction nozzle; and (f) a drive amount of the holding member by the moving device after the detection means detects the start of the movement based on the spring characteristics of the spring. The gist of the present invention is to provide a movement amount command means for determining an amount such that the pressing force of the suction nozzle against the member to be mounted with the electronic component becomes a predetermined magnitude, and instructing the movement device. The invention of claim 2 provides an electronic component mounting device including a plurality of suction nozzles,
The movement amount command means has a spring characteristic storage means that stores measured data of the spring characteristics of the spring corresponding to each of the suction nozzles, and data of the optimum pressing force for applying the electronic component to the member to be mounted. The present invention is characterized in that it includes an optimum pressing force storage means, and determines the amount of drive of the holding member based on data in both storage means.

[0005]

[Operation] In the electronic component mounting apparatus according to the invention of claim 1, after the holding member and the suction nozzle start relative movement, the moving device mounts the holding member by the amount determined and commanded by the movement amount command means. The electronic component is brought close to the target member and pressed against the target member with a predetermined pressing force. After the holding member and the suction nozzle start relative movement, as the holding member is brought closer to the mounting target member, the amount of compression of the spring increases, and the pressing force that presses the electronic component against the mounting target member increases. . The degree of this increase varies depending on the spring constant of the spring, and the pressing force varies depending on the set load of the spring and the amount of movement of the holding member after the electronic component contacts the member to be mounted. Therefore, by detecting the start of the relative movement between the holding member and the suction nozzle, and determining the subsequent drive amount of the holding member based on the spring characteristics, the electronic component can be pressed against the mounting target member with an optimal pressing force. , it is possible to press the electronic component onto the mounting target member with an optimal pressing force, regardless of differences in the thickness of the electronic component or errors in the height position of the suction nozzle. In the electronic component mounting apparatus according to the invention of claim 2, a plurality of suction nozzles are selectively used for mounting electronic components, and for each suction nozzle used, actual measurement data of the spring characteristics of the spring and the suction nozzle are The drive amount of the holding member after the relative movement starts is determined based on the data of the optimum pressing force of the electronic component to be attached to the member to be mounted. Spring characteristics naturally vary depending on the specifications of the spring, and even springs with the same specifications vary and are not necessarily constant. However, the data on spring characteristics is based on each spring of multiple suction nozzles. This is data obtained through actual measurements, and no matter which suction nozzle is selected, the electronic component can be pressed against the mounting target member with an appropriate pressing force.

[0006]

As described above, according to the electronic component mounting apparatus according to the invention of claim 1, it is possible to always press the electronic component against the mounting target member with an appropriate pressing force, and the electronic component can be mounted accurately and reliably. Can be installed. According to the electronic component mounting apparatus according to the invention of claim 2, even when a plurality of suction nozzles are selectively used to mount an electronic component on a mounting target member, the spring characteristics of the spring corresponding to each suction nozzle can be changed. Electronic components can always be mounted accurately and reliably without being affected by variations.

[0007]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In FIG. 1, 10 is the main body of the apparatus. A nut 14 and a spline member 16 are rotatably supported concentrically and spaced apart from each other in the vertical direction in a through hole 12 that vertically passes through the device main body 10 . A male threaded portion 20 of the hollow rod 18 is screwed into the spline member 16, and a spline portion 22 formed below the male threaded portion 20 of the hollow rod 18 is fitted into the spline member 16. These nut 14 and spline member 16 are a ball nut and a ball spline member that hold a large number of balls to eliminate backlash and reduce friction. A gear 24 is fixed to the upper end of the nut 14 protruding from the device body 10, and is meshed with a gear 28 fixed to the output shaft of a servo motor 26 for nozzle elevation. The hollow rod 18 is raised and lowered by being rotated by. Nut 14, male thread 20, gears 24, 2
8 and the nozzle lifting/lowering servo motor 26 constitute a moving device. Note that the rotation angle of the nozzle elevating servo motor 26 is detected by an encoder 30. A gear 32 is fixed to the lower end of the spline member 16 protruding from the device body 10, and is meshed with a gear fixed to the output shaft of a servo motor for rotating the nozzle (not shown). By rotating 16,
Hollow rod 18 is rotated about its axis.

A chuck adapter 36 and a chuck 38 are attached to the lower end of the hollow rod 18, and these three members constitute a holding member 41 of the suction nozzle 40. As shown in FIGS. 2 and 3, the chuck adapter 36 is made up of ears 44 and 46 extending radially outward at two diametrically spaced locations on one end of a cylindrical portion 42. A slit 48 is formed in the lug 46 and extends in the axial direction of the cylindrical portion 42 and opens to the inner circumferential surface of the cylindrical portion 42 . The inner peripheral surface of the cylindrical portion 42 has a stepped shape, and is fitted into the lower end of the hollow rod 18 at the large diameter hole 50 on the side where the ears 44 and 46 are provided.
A screw (not shown) is screwed into the lug 46, thereby contracting the slit 48, reducing the diameter of the large diameter hole 50, and attaching it to the hollow rod 18 in a manner that cannot be removed.

Further, as shown in FIGS. 2 and 4, the chuck 38 has a cylindrical portion 52 similar to the chuck adapter 36.
and a pair of ear pieces 54 and 56 provided at one end thereof, and one ear piece 56 has a slit 58 formed therein. The chuck 38 has ears 54 and 5 of the cylindrical portion 52.
The cylindrical portion 42 of the chuck adapter 36 is fitted into the small diameter hole 60 formed on the side where the ear piece 56 is provided.
It is attached to the chuck adapter 36 by threading a screw (not shown) therein. The lower end of the inner peripheral surface of the cylindrical portion 52 is a large-diameter hole 62, and pins 64 project into the large-diameter hole 62 at two locations separated in the diametrical direction of the peripheral wall of the large-diameter hole 62. It is fitted in the correct direction.

As shown in FIG. 2, the suction nozzle 40 includes a sleeve 70 and a suction tube 72 fitted into the sleeve 70. The sleeve 70 has a stepped shape, and a compression coil spring 76 (hereinafter abbreviated as spring 76) is fitted into the small diameter portion 74, and the small diameter portion 74 and the large diameter portion 7 are connected to each other.
One end is supported by a shoulder surface 80 between 8 and 8. Further, as shown in FIGS. 2 and 6, an engagement portion 82 having a substantially rectangular shape is formed at the end of the large diameter portion 78 of the sleeve 70 opposite to the small diameter portion 74. Ear portions 84 are formed at both longitudinal ends of 82, and
Each ear portion 84 has an inclined surface 8 as shown in FIG.
6 is formed. These inclined surfaces 86 are connected to the sleeve 70.
are inclined with respect to a plane parallel to the axis of the plane, and are located on the same plane. Further, a fitting part 88 having a circular cross section is provided on the lower surface of the engaging part 82, and a light emitting plate 90 is fitted and fixed to the outer circumferential surface of the fitting part 88, while a suction tube 72 is fitted to the inner circumferential surface of the fitting part 88, and a light emitting plate 90 is fitted and fixed to the inner circumferential surface of the fitting part 88. It penetrates the plate 90 and projects downward. The light emitting plate 90 receives ultraviolet rays and emits visible rays when the suction nozzle 40 detects the holding posture of the electronic component.

When attaching the suction nozzle 40 to the holding member 41, the small diameter portion 74 of the sleeve 70 is attached to the chuck adapter while the pair of ears 84 of the engaging portion 82 and the pin 64 of the chuck 38 are out of phase. It fits into the small diameter hole 92 provided at the lower end of the cylindrical portion 42 of No. 36. sleeve 70
is fitted while further compressing the spring 76 from the state in which the other end of the spring 76 is in contact with the cylindrical portion 42 of the chuck adapter 36, and after the engaging portion 82 reaches a position beyond the pin 64, the ear portion 84 and the pin 64 are rotated to a position where the phases match. If the force applied to the sleeve 70 is released in this state, the sleeve 70 will be moved by the spring 70.
6 and is moved in the direction of coming out of the chuck 38, and the inclined surface 86 engages with the pin 64,
It is attached to the chuck 38 so that it can move relative to the chuck 38 in the axial direction, but cannot come off, and cannot rotate relative to the chuck 38 due to the engagement between the inclined surface 86 and the pin 64. Since the inclined surfaces 86 are inclined in the same direction, the torque applied to the sleeve 70 is balanced based on the effect of the inclined surfaces, and the sleeve 70 does not rotate. Chuck 3 like this
The suction nozzle 40 attached to the electronic component 8 vacuum suctions the electronic component 94 and mounts it on a printed circuit board 96 as a member to be mounted. In addition, when removing the suction nozzle 40 from the holding member 41, the sleeve 70 is moved toward the hollow rod 18 while compressing the spring 76, and after releasing the engagement between the inclined surface 86 and the pin 64, the sleeve 70 is rotated. It is sufficient to remove them from the chuck adapter 36 with their phases shifted.

The hollow rod 18 has, as shown in FIG.
A pipe 100 is fitted onto the inner circumferential surface of the pipe 100 so as to be relatively movable in the axial direction. Due to its own weight, the pipe 100 is in contact with the upper surface of the sleeve 70 of the suction nozzle 40 held by the holding member 41, as shown in FIG. pipe 10
0 is made to protrude from the hollow rod 18, and a dog 102 is fixed thereto. Also, hollow rod 1
A cylindrical frame 106 is attached to the upper end of the frame 8 so as to be relatively rotatable but immovable in the axial direction. A nipple 108 is attached to the upper part of the frame 106 and is connected to a vacuum source (not shown) so that vacuum is supplied to the suction nozzle 40. Furthermore, an elongated hole 110 extending in the axial direction is formed in the upper part of the frame 106, and a photoelectric switch 112 is disposed therein. The photoelectric switch 112 is supported by the frame 106 via a position adjustment device (not shown), and is provided at a position upwardly removed from the dog 102 when the electronic component 94 is not attached. This photoelectric switch 112 is a reflective type, and has a light emitter and a light receiver, and when the light emitted by the light emitter is reflected and received, it emits an ON signal, and when the light is not reflected and is not received, it emits an OFF signal. emanate. Therefore, when the suction nozzle 40 protrudes the longest from the holding member 41, there is nothing to reflect the light emitted by the photoelectric switch 112, and the light is not received, so an OFF signal is issued. For example, light is reflected by the dog 102 and an ON signal is generated, whereby the start of relative movement between the suction nozzle 40 and the holding member 41 is detected. In this embodiment, the pipe 100, the dog 102, and the photoelectric switch 112 constitute a detection means for detecting the start of relative movement between the holding member 41 and the suction nozzle 40.

The present electronic component mounting apparatus is controlled by a control device 120 shown in FIG. The control device 120 is a CP
The main body is a computer 130 having a U122, a ROM 124, a RAM 126, and a bus 128 connecting them. An input interface 130 is connected to the bus 128, and an encoder 30 and a photoelectric switch 11 are connected to the bus 128.
Two detection signals are input. bus 12
8 is also connected to an output interface 134 and a nozzle lifting servo motor 26 via a motor drive circuit 136. The spring characteristics of the spring 76 of the suction nozzle 40 are stored in the RAM 126. The spring characteristics refer to the set load and spring constant of the spring 76, and these not only vary depending on the specifications of the spring 76, but also vary even between springs 76 with the same specifications, and all The spring characteristics of the spring 76 of the suction nozzle 40 have been investigated in advance, and the spring characteristics corresponding to the suction nozzle 40 currently used are stored in the RAM 126. On the other hand, R
The OM 124 stores the optimal pressing force to the printed circuit board 96 for each type of electronic component 94, and also stores various programs necessary for mounting the electronic component 94 onto the printed circuit board 96.

When mounting the electronic component 94 on the printed circuit board 96 using the electronic component mounting apparatus configured as described above, after the suction nozzle 40 has sucked the electronic component 94 at the electronic component supply position, the electronic component 94 is attached to the printed circuit board 96. While being moved to the electronic component mounting position, the holding member 41 is lowered, the suction nozzle 40 is lowered together with the holding member 41, and the electronic component 94 is brought into contact with the printed circuit board 96. The holding member 41 is further lowered a short distance from this state, but this lowering is caused by the holding member 41 being moved by the spring 7.
6 is allowed by moving it relative to the suction nozzle 40 while compressing it. When the holding member 41 and the suction nozzle 40 move relative to each other in this way, the frame 106 provided at the upper end of the holding member 41 and the sleeve 7 of the suction nozzle 40
The pipe 100 placed on the dog 102 moves relative to the pipe 100 placed on the dog 102.
reflects the light emitted by the light emitter of the photoelectric switch 112, the signal emitted by the photoelectric switch 112 changes from an OFF signal to an ON signal, and the start of relative movement is detected. In response to this detection, the control device 120 controls the holding member 41 and the suction nozzle 4.
0 starts relative movement, calculate how much the holding member 41 must be lowered for the suction nozzle 40 to press the electronic component 94 against the printed circuit board 96 with the optimum pressing force, and calculate the amount necessary for the lowering. Servo motor 2 for nozzle elevation
Calculate the rotation angle of 6.

The amount by which the holding member 41 is lowered is calculated based on the spring characteristics of the spring 76 stored in the RAM 126 and the optimum pressing force of the electronic component 94 that is currently mounted. The force that presses the electronic component 94 against the printed circuit board 96 is due to the set load F0 of the spring 76 and the suction nozzle 4.
The increase in force F1 from the start of relative movement with respect to the holding member 41 until it is detected, and the increase F2 in force from the time the relative movement is detected until the holding member 41 is stopped. It is Japanese. The increase F1 is the spring constant of the spring 76 and the fall L1 (can be regarded as a constant value)
The increment F2 is the value obtained by multiplying the spring constant by the required fall amount Lx, and the set load and spring constant of the spring 76 of the suction nozzle 40 used for suction are read out from the RAM 126. , the optimum pressing force of the electronic component 94 to the printed circuit board 96 is ROM
124, and the lowering amount Lx is calculated so that the sum of F0, F1, and F2 becomes the optimal pressing force. Further, the rotation angle of the servo motor 26 with respect to this lowering amount Lx is calculated. Then, the nozzle lifting motor 26 is driven until the rotation angle of the servo motor 26 detected by the encoder 30 reaches the calculated value, and the holding member 41 is lowered by the calculated amount. , the printed circuit board 96 can always be pressed with the optimum pressing force without being affected by differences in the thickness of the electronic components 94, errors in the height position of the suction nozzle 40, differences in the specifications of the spring 76, and variations in spring characteristics. It happens.

As is clear from the above description, in this embodiment, the portion of the RAM 126 that stores the measured data of the spring characteristics of the spring 76 constitutes a spring characteristics storage means, and the data of the optimum pressing force of the ROM 124 is stored as a spring characteristics storage means. The part that stores the optimum pressing force constitutes an optimum pressing force storage means, and these two storage means, the holding member 41 of the ROM 124, and the suction nozzle 40
A part that stores a program for calculating the drive amount of the holding member 41 after the relative movement of the holding member 41 and the CP
The U122 and the portion of the RAM 126 that executes the program based on the data in both storage means constitute a movement amount command means.

Another mode of holding the suction nozzle by the holding member is shown in FIGS. 8 to 10. In this embodiment, a chuck adapter 142 similar to the chuck adapter 36 is attached to the lower end of the hollow rod 140, and a chuck 144 is attached to the chuck adapter 142.
The chuck 144 constitutes a holding member 145. The main body 146 of the chuck 144 has a cylindrical shape and is fitted into the cylindrical portion 147 of the chuck adapter 142, and a slit 151 formed in one of the pair of lug pieces 148, 149 is narrowed by a screw. It is attached to the chuck adapter 142. A pair of notches 150 extending in the axial direction are formed in the main body 146, and each notch 1
A pawl 152 is housed within 50. The upper ends of these claws 152 and the lower ends thereof are connected to pins 154 and 15, respectively.
6, and is rotatably attached to the main body 146 by the pin 154 being rotatably fitted to the main body 146. Additionally, a spring ring 158 is fitted between the claws 152 and the main body 146.
As a result, the lower end portion is biased in the closing direction toward the main body 146, and the closed position of the claw 152 is defined by the stopper protrusion 160 coming into contact with the main body 146. Further, as shown in FIG. 10, one claw 152 is biased by a spring 164 disposed inside the main body 146 in a direction in which the other claw 152 comes into close contact with the main body 146, and the other claw 152 is biased in a direction parallel to the rotation axis. Warming is prevented. As shown in FIG. 8, the lower end portions of these claws 152 include an inclined surface 166 that slopes toward the main body 146 side as it goes downward;
An inclined surface 168 is formed that moves away from the surface.

The suction nozzle 170 has a sleeve 172 and a suction tube 174. A tapered surface 176 is formed at the tip of the sleeve 172, and the diameter gradually decreases toward the tip.
A pair of engagement pieces 178 extending radially outward are provided at the lower part of the sleeve 172 at two diametrically apart locations and receive one end of a compression coil spring 180 fitted into the sleeve 172 .

When attaching the suction nozzle 170 to the holding member 145, the sleeve 172 is attached to the chuck adapter 1 with the engagement piece 178 parallel to the axis of rotation of the claw 152.
42. At this time, the engaging piece 178 engages with the inclined surface 168 of the pawl 152 to rotate it in the opening direction, and compresses the compression coil spring 180. When the engagement piece 178 passes over the protrusion defined by the inclined surfaces 166 and 168 of the pawl 152, the pawl 152 returns to the closed position defined by the contact of the stopper protrusion 160 with the main body 146. If the force applied to the sleeve 172 is released in this state,
The sleeve 172 is biased by the compression coil spring 180 and moves in the direction of coming out of the chuck adapter 142, and the engagement piece 178 is in the closed position on the inclined surface 1 of the claw 152.
66, the suction nozzle 170 is held by the holding member 145 so that it cannot come out and cannot rotate.

These holding members 145 and suction nozzle 170
This means that when an electronic component is mounted on a printed circuit board, the compression coil spring 180 is compressed and relatively moved, and the amount of descent of the holding member 145 after the relative movement starts is determined in the same way as in the above embodiment. This allows the electronic component to be pressed against the printed circuit board with optimal pressing force.

When removing the suction nozzle 170, the suction nozzle 170 can be pulled out from the holding member 145. The claw 152 is opened by the engaging piece 178 against the urging force of the spring 180 due to the effect of the slope of the inclined surface 166, and the suction nozzle 170 is separated from the holding member 145.

Still another aspect of holding the suction nozzle by the holding member is shown in FIGS. 11 to 15. The suction nozzle 190 of this embodiment is directly attached to and removed from a hollow rod 192 as a holding member. This hollow rod 192 has a stepped cylindrical shape, and a pipe 193 is fitted inside thereof so as to be movable in the axial direction. Block 196 is fixed. As shown in FIG. 12, the mounting block 196 has a rectangular cross-sectional shape, and leaf springs 198 are fixed to two mutually parallel sides of the mounting block 196 so as to extend downward. As shown in FIGS. 11 and 14, the lower part of the leaf spring 198 is widened, bent in a direction approaching the hollow rod 192, and then bent outward to form a dogleg-shaped gripping part. It is said to be 200. Also,
A spring receiver 202 is fitted into the small diameter portion 194 of the hollow rod 192 so as to be movable in the axial direction, and a compression coil spring 204 is disposed between the spring receiver 202 and the mounting block 196.
is urged downward by. The spring receiver 202 has a rectangular shape as shown in FIG. 13, and has tabs 208 protruding from both longitudinally separated ends of two parallel sides. The hollow rod 1
92 is prevented from escaping.

As shown in FIG. 11, the suction nozzle 190 has a cylindrical sleeve 210 with a bottom. At the open end of the sleeve 210, as shown in FIGS. 11 and 15, two protrusions 212 having a triangular cross section and projecting outward are formed at two diametrically spaced apart locations. An inclined surface 216 having the same inclination as that of the grip part 200 of the leaf spring 198 is formed on the outer surface of these protrusions 212 . Furthermore, a cylindrical fitting part 218 is protruded from the lower surface of the sleeve 210, and a suction tube 220 is fitted and fixed to the inner circumferential surface of the fitting part 218, while a light emitting plate 222 is fitted and fixed to the outer circumferential surface of the fitting part 218. There is.

This suction nozzle 190 is connected to a hollow rod 192.
When holding the sleeve 210 in the holding member 1 with the protrusion 212 and the leaf spring 198 out of phase by 90 degrees,
It fits into the small diameter portion 194 of 92. At this time, the sleeve 21
0 comes into contact with the pipe 193 and pushes it up, and also comes into contact with the spring receiver 202 and pushes up the compression coil spring 20.
Compress 4. After the protrusion 212 passes the grip part 200, it is rotated to a position where the protrusion 212 and the leaf spring 198 are in phase. If the force applied to the sleeve 210 is released in this state, the sleeve 210 will be biased by the compression coil spring 204, and the inclined surface 216 will be pushed against the leaf spring 19.
8, and the suction nozzle 190 is attached to the holding member 192 so as to be immovable in the axial direction and immovable in relative rotation.

When the electronic component is mounted on the printed circuit board, the hollow rod 192 is compressed by the compression coil spring 20.
4 is compressed and moved relative to the suction nozzle 190, and the electronic component is pressed against the printed circuit board with an optimal pressing force.

When removing the suction nozzle 190 from the hollow rod 192 , the sleeve 210 is moved in a direction to fit more deeply into the hollow rod 192 while compressing the compression coil spring 204 , so that the slope 216 and the gripping part 200 are connected to each other. After disengaging, rotate it 90 degrees and pull it out from the hollow rod 192.

The suction nozzle 190 may be attached to and detached from the hollow rod 192 in the following manner. sleeve 2
An inclined surface 230 is formed at the tip of the protrusion 212 of No. 10, and the inclined surface 230 is inclined toward the center toward the tip.
0 to the hollow rod 192, the sleeve 210 is fitted onto the hollow rod 192 with the two protrusions 212 and the leaf springs 198 aligned in phase. On this occasion,
The protrusion 212 is provided at the protruding end of the gripping part 200 of the leaf spring 198 and is guided by a guide part 232 bent away from the hollow rod 192 so that the pair of leaf springs 1
98, the gap between the gripping parts 200 is expanded by the effect of the slope of the sloped surface 230, and the compression coil spring 204 is compressed and fitted. When the protrusion 212 exceeds the gripping part 200, the leaf spring 198 returns to its original position, the gripping part 200 engages with the protrusion 212, and the suction nozzle 19
Prevent 0 from leaving. Further, when removing the suction nozzle 190 from the hollow rod 192, the suction nozzle 190 may be pulled out from the hollow rod 192. Due to the effect of the slope of the slope 216, the distance between the gripping parts 200 is expanded,
The suction nozzle 190 separates from the hollow rod 192.

In each of the above embodiments, the spring constants and set loads of the compression coil springs 76, 180, 204 were measured, and the data of the actual measurements were stored in the RAM 126, but the design values were stored in the RAM 126. Based on this, the drive amount after the relative movement of the holding members 41, 145 and the hollow rod 192 starts may be calculated.

Furthermore, in each of the above embodiments, the holding member 41
, 145, hollow rod 192 and suction nozzle 40, 170
, 190 is detected by a non-contact detection means composed of a dog 102, a reflective photoelectric switch 112, etc., but it is detected by using a transmission photoelectric switch. Further, in addition to the non-contact detection means, detection may be performed using a detection means having a contact point that is in contact when the electronic component is not attached, but becomes non-contact when the relative movement starts.

Furthermore, the present invention provides an electronic component mounting device having a plurality of suction nozzles, in which a plurality of holding members holding the suction nozzles are respectively moved by dedicated moving devices, and a plurality of holding members sequentially moving parts. The present invention can also be applied to an electronic component mounting device that is moved to a mounting position and moved by a common moving device provided at that position.

In addition, the present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art without departing from the scope of the claims.

[Brief explanation of drawings]

FIG. 1 is a front view (partially in section) showing an electronic component mounting apparatus that is an embodiment of the present invention.

FIG. 2 is a front sectional view showing a state in which a suction nozzle of the electronic component mounting apparatus is held by a holding member.

FIG. 3 is a plan view showing the chuck adapter of the holding member.

FIG. 4 is a plan view of the chuck attached to the chuck adapter.

FIG. 5 is a front view showing a sleeve constituting the suction nozzle.

FIG. 6 is a bottom view of the sleeve.

FIG. 7 is a diagram showing the configuration of a control device that controls the electronic component mounting device.

FIG. 8 is a front view (
(partial cross section).

FIG. 9 is a sectional view taken along line IX-IX in FIG. 8;

10 is a side view of the suction nozzle and holding member shown in FIG. 8. FIG.

FIG. 11 is a front sectional view showing a state in which a suction nozzle of an electronic component mounting apparatus according to still another embodiment of the present invention is held by a holding member.

FIG. 12 is a sectional view taken along line XII-XII in FIG. 11;

FIG. 13 is a sectional view taken along line XIII-XIII in FIG. 11;

14 is a side view showing a leaf spring for holding the suction nozzle shown in FIG. 11 on a hollow rod.

15 is a bottom view showing a sleeve constituting the suction nozzle shown in FIG. 11. FIG.

[Explanation of symbols]

10　Device body 14 Ball nut 20 Male thread part 26 Servo motor for nozzle elevation 40 Suction nozzle 41 Holding member 76 Compression coil spring 94 Electronic parts 96 Printed circuit board 100 pipe 102 Dog 112 Photoelectric switch 120 Control device 145 Holding member 170 Suction nozzle 180 Compression coil spring 190 Suction nozzle 192 Hollow rod 193 pipe 204 Compression coil spring

Claims (2)

[Claims] 1. A suction nozzle that suctions an electronic component by vacuum; a holding member that is movably supported in the axial direction by an apparatus main body and holds the suction nozzle so as to be relatively movable in the axial direction; and the suction nozzle. In the electronic component mounting apparatus, the electronic component mounting device includes a spring that urges a spring to a protruding position in which a tip portion thereof protrudes longest from the holding member, and a moving device that moves the holding member in an axial direction. a detection means for detecting the start of relative movement between the holding member and the suction nozzle while the holding member is being moved in a direction approaching the member to which the electronic component is mounted;
The amount of drive of the holding member by the moving device after the detecting means detects the start of movement is determined based on the spring characteristics of the spring, and the pressing force of the suction nozzle against the member to which the electronic component is mounted. An electronic component mounting device comprising a movement amount command means for determining a predetermined amount and instructing a movement device. 2. Spring characteristic storage means including a plurality of said suction nozzles, wherein said movement amount command means stores actual measurement data of spring characteristics of a spring corresponding to each of said suction nozzles; 2. The electronic component according to claim 1, further comprising an optimum pressing force storage means storing data on an optimum pressing force applied to the member to be mounted, and determining the amount of drive of the holding member based on data in both storage means. Mounting device.