JPH043723B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the provision of a heat insulating board containing a large amount of cellulose aggregate, which is suitable for use as a wood-like floor material or wall material that has excellent heat and sound insulation properties.

Therefore, the flooring and wall materials that make up the general living space are required to have appropriate hygroscopicity on the one hand,
On the other hand, water resistance is required, as well as good heat insulation and sound insulation properties, and at the same time, appropriate slip properties and appropriate contact resistance are required. Conflicting characteristics were sought at the same time.

Most of the conventional building materials based on wood basically satisfy these characteristics, and have been used for a wide range of purposes such as flooring and wall materials. It is.

However, the use of such wood-based building materials is subject to many restrictions due to the characteristics of the material itself. , or there may be large differences in the characteristics of each material depending on many conditions such as whether the material contains a lot of resin or a material with a little resin, and which part of the material, that is, whether it is a straight part or not. It has the following.

For this reason, changes in dryness and humidity during use tend to cause the board to warp, twist, etc., and it is necessary to assemble and use the board by taking these quirks into consideration. It was assumed that the material would be highly susceptible to decay and would not be able to withstand use in humid areas. In addition, the abrasion resistance is generally low, and the surface is easily abraded and soiled, and the water resistance is also generally poor.

The wood-like heat insulating board according to the present invention was developed especially in view of the disadvantages of conventional wood materials, and in view of the recent shortage of wood resources. Cellulose-based materials such as Bakasu are made into fine powder regardless of their material quality, and this fine powder aggregate is neutralized and hardened to make it fit well with the molded resin material and to improve the bone structure. This eliminates the inconveniences in molding caused by the mixing of materials, and makes it possible to mold and provide resin insulation boards containing a large amount of cellulose materials, which was previously considered difficult.

In order to achieve specific effects on the various properties, the wood-like heat insulating board according to the present invention, in particular, has the main structure of the wood-like heat insulating board that contains crushed chips, pulp, rice husks, and other appropriate cellulosic materials. Moisture content is 15 ^O / _w
The processed material is dried within a temperature range of 100°C to 250°C to induce collapse of the fiber structure, and the processed material is impregnated with a urea resin solution. The aggregate is dried, crushed, and molded into a neutralized fine aggregate with a pH of 6 to 7. The aggregate is placed in a molded resin material at 20 to 70 ^O / _wt , and then placed on a foam-molded substrate. The following specific examples and equivalent other examples accompanying these examples are planned by attaching a resin-molded sheet mixed with 10 to 70 ^O / _wt . .

Hereinafter, an example of a typical method for forming a wood-like heat insulating board according to the present invention will be described. First, the aggregate 1 is prepared by preparing a cellulose material such as crushed chip wood, pulp material, or rice husk, and It is pre-processed by drying, especially heat drying, so that the moisture content of the material is within 15 ^O / _wt , which is the air-dried moisture content. As the moisture content in the material decreases to less than 15 ^O / _wt , the drying process rapidly induces destruction of the fiber structure that makes up the material.
The composition of the cellulose in not only rough bundles or lumps of cellulose but also pulp material and rice husk is destroyed, and the cellulose is separated.

By applying an emulsion-type urea-based resin adhesive to the material that has dried and whose structure has disintegrated, and leaving it for 20 to 30 minutes,
This urea-based resin adhesive liquid is sufficiently impregnated into the material, and the pH value of the material is usually about 5.

In addition, ammonia chloride or hydrochloric acid is separately added to this resin adhesive liquid as a hardening agent, and the material
Attempts were made to further adjust the pH value toward neutrality as necessary.

Thus, the material impregnated with urea-based resin liquid is
In the next step, it is heat-dried at a temperature of 100 to 250℃ and crushed into powder, with a moisture content of 3 to 5 ^O / _wt and as low as 0 ^O. /
It is made into a fine powder with a particle size of about 100 to 150 mesh while making it close to _{the wt} .

During such heat drying and crushing, the material itself
The pH is within the range of 6 to 7, and is generally adjusted to be neutral.

The neutralization treatment of the acidic material at such a starting point is
This is largely due to the action of the urea-based resin adhesive that is interposed during the process, and in simple heating and drying treatments of cellulose-based materials that do not plan on adding urea-based resin adhesives, Compared to the pH of the starting material, which is PH5, the final point material, which is made into a dry fine powder, has a pH of 2 to 3, and on the contrary, the pH value tends to be acidic. On the other hand, by interposing a urea-based resin adhesive, the PH5 material is neutralized while gradually releasing the acetic acid contained in the material as wood acid gas as it is heated and dried. The pH of the material is adjusted to within the neutralization range of 6 to 7.

In the aggregate 1 thus provided, most of the moisture contained in the aggregate 1 is evaporated by the heating and drying treatment performed during the molding of the aggregate 1, and it is difficult to perform resin molding using the molded aggregate. There is no generation of water vapor, which is considered a harmful effect, and there is no room for foaming, cavities, rough skin, etc. to occur in the molded product. Furthermore, the removal of this water content also had a significant effect on the volatilization of wood acid contained in wood flour, and wood acid contained in wood flour usually reacts with H ₂ O groups. This was effectively suppressed by allowing it to dissipate and volatilize for the first time. Therefore, it is possible to eliminate the wood acid produced in the process of heat crushing and curing by impregnating the thermosetting resin material, adjust the pH to 6 to 7 by neutralization, and suppress the generation of residual wood acid gas from the aggregate. This makes it even more effective.

The effective elimination and prevention of wood acid gas generation in the aggregate 1 has an extremely important meaning in subsequent resin molding. That is, when wood acid gas is generated during resin molding, the cylinder screw of the injection machine used for resin molding or the inner wall surface of the molding die is oxidized and corroded, drastically reducing its durability and reducing molding efficiency. In particular, this caused problems with molding defects due to uneven injection pressure.

In addition, unlike ordinary pure wood flour, Aggregate 1 is impregnated with or adhered to a hardening resin, so the surface resistance value is extremely reduced, making it difficult to use as an aggregate. The extrusion and injection pressure when mixed into a resin material and molded is almost similar to that of general resins. On the other hand, in the past, when wood flour was mixed in, the wood flour slid into contact with the inner peripheral surfaces of cylinders, dies, etc., creating considerable frictional resistance.
This causes scratches, abrasion, or damage on the inner peripheral surfaces of cylinders, dies, etc. during extrusion and injection.

Furthermore, the use of such aggregate 1 ensures good compatibility with the mixed resin material, ensures uniform mixing of the aggregate, and eliminates as much as possible the voids that occur on the peripheral surface of the aggregate in the molded product. This makes it possible to provide molded products with the desired quality.

For the aggregate 1 prepared in this way, the foamed resin material 2, such as urethane resin or polystyrene resin, has particularly excellent foaming properties, and the aggregate 1 is
Mixed within the range of 70 ^O / _wt , foaming agent,
A stabilizer such as lead, a deterioration inhibitor, a coloring agent, etc. are added and foam molding is performed to form the substrate a of the heat insulating board.

Next, aggregate 1 is mixed with resin material 3 such as vinyl chloride, especially soft vinyl chloride, in a range of 10 to 70 ^O / _wt , and stabilizers, deterioration inhibitors, colorants, etc. are added to the resin material 3. This is a molded sheet to constitute the top sheet b of the heat insulating board.

In addition, in the molding of the substrate a, in addition to the usual injection molding, a method of secondary foaming a plate-shaped molded product by hot pressing or the like, a molding method of roll molding or splitting an extruded tube, etc. are planned. In b, roll forming and split-open forming of an extruded tube-like product are planned.

A heat insulating board is formed by attaching sheet b to side A of the substrate constructed in this manner and attaching it together with an adhesive, or by heating and welding it together with sheet b attached. This is how it was done.

Furthermore, if necessary, a veneer c was attached and integrated on the surface of the sheet b using a similar adhesion or welding method.

The wood-like heat insulating board according to the present invention has the above-mentioned advantages in molding by having the aggregate 1 with special properties, and the molded heat insulating board has the following characteristics. was recognized.

That is, (1) It was confirmed that the mixed aggregate 1 and the foamed voids 4 exhibited effective heat insulation and sound insulation functions.

(2) It has good abrasion resistance, particularly low friction fatigue when used as flooring and wall materials, and is considered to have good durability.

Amount of wear of this case (PVC): 35.9 / Amount of wear of regular PVC: 46.6 (However, load 1Kg, rotation speed 70rpm, worn wheel cs
-17mg/1000 revolutions in calibrase) (3) It is water resistant and has moderate hygroscopicity, absorbs sweat from the skin that comes in contact with it, has a good adhesion to the skin, and is soft to the touch. brought about.

Water absorption rate of this case (PVC): 0.44/Water absorption rate of regular PVC: 0.09 (However, water absorption rate of 25% according to JIS K7209 water absorption test method)
℃, water absorption rate per unit area for 24 hours) (4) By incorporating Aggregate 1, there is less molding distortion, and there is less expansion and contraction after molding, making it possible to lay flooring and walls with high precision. In addition, the mixed aggregate has good heat retention properties, giving it a warm feel to the touch.

(5) Since Aggregate 1 is exposed on the surface of flooring and wall materials, a suitable amount of frictional resistance is brought to the contact surface, effectively reducing the possibility of unexpected slip accidents when walking etc. lost.

(6) Due to the presence of aggregate 1, it blends well with the mixed pigment, making it possible to create vivid colors on a wood-like surface, and since aggregate 1 is exposed on the surface, and print on the surface of sheet b,
When forming a decorative film by blowing with a gun, etc., it strongly adheres to the aggregate 1, and the printed surface,
Peeling, cracking, etc. of the paint film surface was reliably prevented.

(7) Providing a flooring or wall material that has a large amount of aggregate 1, has processing characteristics similar to wood, is suitable for installation processing or surface sanding processing, and has a natural feel and appearance similar to wood. was made possible.

(8) Since aggregate 1 was exposed on the surface, it was expected that the adhesive would spread well when attaching sheet b or decorative veneer c, and a reliable adhesive effect would be achieved.

(9) Since the aggregate 1 is exposed on the surface, the flooring material to be laid adheres to the 5 surfaces of the slab and does not slip, and the adhesion of the installation surfaces of the flooring materials to each other is good, Misalignment of the material was effectively prevented.

(10) Since it has a large amount of aggregate 1, it can be treated in the same way as ordinary wood, such as sawing and nailing.

(11) It has excellent water resistance and rot resistance, so even when it is installed directly on the slab without using a waterproof sheet, it does not bring moisture onto the flooring surface, and at the same time has appropriate breathability. This effectively prevents over-moisture on the slab surface during long-term installation.

The method for forming a wood heat insulating board according to the present invention is suitable for inexpensive mass production of flooring and walling materials having good durability and weather resistance as having the various properties described above.

[Brief explanation of drawings]

FIG. 1 is an enlarged sectional view of the main part of the board a, FIG. 2 is an enlarged sectional view of the main part of the sheet b, FIG. 3 is a sectional view of the heat insulating plate, FIG. 4 is a perspective view of the same, and FIG. The figure is a sectional view showing an example of laying. In addition, in the figure, 1... aggregate, 2, 3... resin material, 4... void, 5... slab are shown.

Claims (1)

[Claims] 1. For crushed chips, pulp, rice husks, and other appropriate cellulose-based materials, the water content of the material is
15 ^O / _wt or less to induce collapse of the fiber structure, and the processed material is impregnated with a urea-based resin liquid, and then the processed material is heated at 100°C to 250°C. Dry and crush in a temperature ^range _of The aggregate is 10~70 ^O / _w
1. A method for forming a wood-like heat insulating board, characterized in that a resin-molded sheet containing _T is attached. 2. 100 to 150 meshes of the above aggregate, and the moisture content
5 ^O / _wt or less, the method for forming a wood-like heat insulating board according to claim 1.