JPH0437262U - - Google Patents
Info
- Publication number
- JPH0437262U JPH0437262U JP8042790U JP8042790U JPH0437262U JP H0437262 U JPH0437262 U JP H0437262U JP 8042790 U JP8042790 U JP 8042790U JP 8042790 U JP8042790 U JP 8042790U JP H0437262 U JPH0437262 U JP H0437262U
- Authority
- JP
- Japan
- Prior art keywords
- article
- electroplating
- electrode
- plating
- holding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案の一実施例による電気メツキ装
置の概略平面図、第２図は第１図を−矢視方
向に見た概略断面図である。 １……電気メツキ装置、２……メツキ液、３…
…メツキ槽、４……電極、５……物品、６……物
品保持装置、６Ａ……フレーム、６Ｂ……チヤツ
ク軸、８……支持棒、９……マスク板。
置の概略平面図、第２図は第１図を−矢視方
向に見た概略断面図である。 １……電気メツキ装置、２……メツキ液、３…
…メツキ槽、４……電極、５……物品、６……物
品保持装置、６Ａ……フレーム、６Ｂ……チヤツ
ク軸、８……支持棒、９……マスク板。
Claims (1)
- 円筒状の物品に対して電気メツキを施す電気メ
ツキ装置において、メツキ液を収容したメツキ槽
と、メツキすべき金属で形成され、前記メツキ液
中に所定長さに渡つて設けられた電極と、前記円
筒状の物品を前記メツキ液に浸漬した状態で前記
電極にほぼ平行に保持し、回転させる物品保持装
置と、前記円筒状の物品の端部近傍で該物品と前
記電極との間に配置したマスク板とを有する電気
メツキ装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8042790U JPH0437262U (ja) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8042790U JPH0437262U (ja) | 1990-07-27 | 1990-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0437262U true JPH0437262U (ja) | 1992-03-30 |
Family
ID=31625478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8042790U Pending JPH0437262U (ja) | 1990-07-27 | 1990-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0437262U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008047509A1 (en) * | 2006-10-19 | 2008-04-24 | Honda Motor Co., Ltd. | Plating apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575457B2 (ja) * | 1977-04-01 | 1982-01-30 |
-
1990
- 1990-07-27 JP JP8042790U patent/JPH0437262U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS575457B2 (ja) * | 1977-04-01 | 1982-01-30 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008047509A1 (en) * | 2006-10-19 | 2008-04-24 | Honda Motor Co., Ltd. | Plating apparatus |
| JP2008101243A (ja) * | 2006-10-19 | 2008-05-01 | Honda Motor Co Ltd | メッキ装置 |
| US7966897B2 (en) | 2006-10-19 | 2011-06-28 | Honda Motor Co., Ltd. | Plating apparatus |