JPH0437689A - Molecular beam epitaxy equipment - Google Patents

Molecular beam epitaxy equipment

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Publication number
JPH0437689A
JPH0437689A JP13820090A JP13820090A JPH0437689A JP H0437689 A JPH0437689 A JP H0437689A JP 13820090 A JP13820090 A JP 13820090A JP 13820090 A JP13820090 A JP 13820090A JP H0437689 A JPH0437689 A JP H0437689A
Authority
JP
Japan
Prior art keywords
raw material
molecular beam
vessel
crucible
beam source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13820090A
Other languages
Japanese (ja)
Inventor
Shigeo Goshima
五島 滋雄
Tomonori Tagami
知紀 田上
Yoko Uchida
陽子 内田
Masahiko Kawada
河田 雅彦
Yoshihisa Fujisaki
芳久 藤崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13820090A priority Critical patent/JPH0437689A/en
Publication of JPH0437689A publication Critical patent/JPH0437689A/en
Pending legal-status Critical Current

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  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

PURPOSE:To raise mechanical reliability and to improve degassing at a time for loading by combining a raw material loading device provided with a raw material vessel made of shape memory alloy with both a base plate heating mechanism and a molecular beam source cell. CONSTITUTION:In a state wherein a gate valve 5 is closed and a load lock part is regulated to the atmospheric pressure, Ga 9 being the raw material of GaAs-based material is loaded into a vessel 7 made of shape memory alloy from an introducer 11. Then, after the load lock chamber is vacuumized, the vessel 7 is heated at 40 deg.C by an ionization vacuum meter probe 10 or a heater positioned in the same position and the raw material Ga 9 is melted. Then the gate valve 5 is opened and the vessel 7 is transferred just above a crucible provided to a Ga molecular beam source by a magnet. At this time, the crucible 12 is heated at about 900 deg.C. The vessel 7 receives thermal radiation emitted from the crucible and is heated at about >=80 deg.C. The raw material 9 is allowed to thoroughly fall into the crucible because the vessel 7 made of Ti/Ni alloy is deformed to a previously memorized shape by this heating.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、分子線エピタキシー装置の原料ロードロック
機構に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a raw material load lock mechanism for a molecular beam epitaxy apparatus.

〔従来の技術〕[Conventional technology]

従来、分子線エピタキシー装置(以下、 M B Eと
略す)の原料ロードロック装置は、ジャーナル・オブ・
バキュームサイエンス・アンド・テクノロジーB6.(
198’8年)第1657頁から第1661頁(J、V
ac、Sci、Technol、 B 6 (1988
)PP1657−1661)において論じられている。
Conventionally, the raw material load lock device for molecular beam epitaxy equipment (hereinafter abbreviated as MBE) was described in the Journal of
Vacuum Science and Technology B6. (
198'8) pages 1657 to 1661 (J, V
ac, Sci, Technol, B6 (1988
) discussed in PP 1657-1661).

従来は、第2図に示すように、補填すべき原料を装填し
た容器7を、真空の外部に設けた磁石4を回転すること
によって傾け、分子線源セル3内に設けたるつぼの中に
原料を落とし込むことにより原料を補填していた。
Conventionally, as shown in FIG. 2, a container 7 loaded with raw materials to be supplemented is tilted by rotating a magnet 4 provided outside the vacuum, and placed in a crucible provided within a molecular beam source cell 3. Raw materials were supplemented by dropping raw materials into them.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来技術は、ロー1ヘロソク部に設けた原料容器7
から原料(Ga)をるつは3内に落とし込む際に、真空
外部より原料容器を回転駆動するため、回転駆動部の機
械的故障が発生し易く、信頼性が低いという問題点があ
った。また、回転駆動方式では、正確な回転角度の制御
が困難であった。
In the above conventional technology, the raw material container 7 provided in the row 1 row section
When the raw material (Ga) is dropped into the crucible 3, the raw material container is rotated from outside the vacuum, so mechanical failure of the rotary drive unit is likely to occur, resulting in low reliability. Furthermore, with the rotational drive method, it is difficult to accurately control the rotation angle.

本発明は、機械的信頼性の高い原料ロードロックを設け
た分子線エピタキシー装置を提供することを目的として
おり、さらに、装填時に、脱ガスの少ないロードロック
装置を提供することを目的とする。
The present invention aims to provide a molecular beam epitaxy apparatus equipped with a raw material load lock having high mechanical reliability, and further aims to provide a load lock apparatus that causes less outgassing during loading.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、本発明においては、分子線
エピタキシー装置に設けた原料ロードロック機構内の、
原料容器又は、その一部に形状記憶合金を用いることに
より、分子線源るつぼに、ロードロックにより原料を落
とし込む際、外部からの機械的駆動力を用いることなく
、分子線源の輻射熱のみを利用して原料容器を駆動する
ものである。
In order to achieve the above object, in the present invention, in the raw material load lock mechanism provided in the molecular beam epitaxy apparatus,
By using a shape memory alloy for the raw material container or a part of it, when dropping the raw material into the molecular beam source crucible using a load lock, only the radiant heat of the molecular beam source can be used without using external mechanical driving force. This is to drive the raw material container.

さらに、真空容器内での脱カスを抑えるために成長室と
は分離されたロードロック室内で、必要箇所のみを加熱
し、或いは原料を溶融し、予め十分に脱ガスした後、成
長室に補給したい原料を輸送するようにしたものである
Furthermore, in order to suppress de-slag in the vacuum container, we heat only the necessary parts in a load-lock chamber separated from the growth chamber, or melt the raw materials and fully degas them before supplying them to the growth chamber. It is designed to transport the desired raw materials.

〔作用〕[Effect]

本発明によるMBEの原料ロードロック機構では、第3
図に示す様に、原料装填容器が室温では(a)の形状を
しており、分子線源セル上に移送した時、分子線源から
の輻射熱によって(b)の形状となる形状記憶合金を容
器の材料に選んであり、(b)に示す如く、真空外部か
らの操作をすることなく、るっぽ12に原料を落とし込
むことができる。
In the MBE raw material load lock mechanism according to the present invention, the third
As shown in the figure, the raw material loading container has the shape (a) at room temperature, and when transferred onto the molecular beam source cell, the shape memory alloy changes to the shape (b) due to radiant heat from the molecular beam source. As shown in (b), raw materials can be dropped into the Lupo 12 without any operation from outside the vacuum.

〔実施例〕〔Example〕

以下、本発明の実施例を図を用いて説明する。 Embodiments of the present invention will be described below with reference to the drawings.

実施例1 第1の実施例について第1図〜第3図を用いて説明する
。まず第2図に示す如く、成長室1.液体窒素シュラウ
ド22分子線源セル3から成る通常のM B E装置に
取り付けた。磁石4.グー1−バルブ5.原料導入ポー
ト6、原料容器7から成る原料ロードロック機構におい
て、原料容8:;7にT i / N i合金を用いた
Example 1 A first example will be described using FIGS. 1 to 3. First, as shown in FIG. 2, a growth chamber 1. A conventional MBE apparatus consisting of a liquid nitrogen shroud 22 and a molecular beam source cell 3 was installed. Magnet 4. Goo 1-Valve 5. In a raw material load lock mechanism consisting of a raw material introduction port 6 and a raw material container 7, a Ti/Ni alloy was used for the raw material container 8:;7.

第1図りこ原料ロードロック部の詳細図を示す。The first diagram shows a detailed view of the raw material load lock section.

第2図に示したゲートバルブ5を閉してロートロック部
を大気圧にした状態で、原料墓入器11よりG aAS
系材料の原料であるGa9を形状記憶合金製原料容器7
に装填する。次にロー1〜ロツク室を真空引きした後、
電離真空計測定子1o又は同位置に設置したヒータによ
り40°Cまて容器7を加熱し原料(Ga)9を溶融す
る。この時容器7は、図に示す形状を保持している。
With the gate valve 5 shown in FIG. 2 closed and the rotor lock section set to atmospheric pressure, GaAS is
Ga9, which is the raw material for the based material, is stored in a shape memory alloy raw material container 7.
to be loaded. Next, after evacuating the lock chambers from Row 1 to
The container 7 is heated to 40° C. using the ionization vacuum gauge probe 1o or a heater installed at the same position, and the raw material (Ga) 9 is melted. At this time, the container 7 maintains the shape shown in the figure.

この後、ゲートバルブ5を開き、磁石により、容器7を
Ga分子線源に設けたるつぼ(第3図(b)12)の真
上まで移送する。この時るつぼ12は900°Cに加熱
されている。容器7は12からの熱輻射を受け、80℃
以」−に加熱される。
Thereafter, the gate valve 5 is opened, and the container 7 is moved by a magnet to a position directly above the crucible (12 in FIG. 3(b)) provided in the Ga molecular beam source. At this time, the crucible 12 is heated to 900°C. Container 7 receives heat radiation from 12 and reaches 80°C.
It is heated to

T ]/ N i合金製容器7は、この加熱により予め
記憶していた形状(第3図(b))に変形するため、原
料9はすべてるつは12の中へ落とし込まれる。
T]/Ni alloy container 7 is deformed into a pre-memorized shape (FIG. 3(b)) by this heating, so that all the raw materials 9 are dropped into the melter 12.

本実施例によれば、るつぼ12への原料装填の際、原料
容器は外部から力を加えることなく、・++′dS射熱
のみて変形するための、機械的な故障、リークを起すこ
となく、精憧1な位置制御の]・に原料を補填できる。
According to this embodiment, when loading raw materials into the crucible 12, the raw material container is deformed only by . With precise position control, raw materials can be replenished.

実施例2 第2の実施例についでiト1図を用いてj12明する。Example 2 The second embodiment will be explained in detail using Figures 1 and 1.

L!料容8:(7を分子線源、セル上部に移送する方式
は、第1の実施例と同し2である。第4 rニア+には
、原料容器を分子線源セル−に部に移送した直後を(2
1)に、5分後の形状を(b)に示す。
L! Material volume 8: (The method for transferring 7 to the molecular beam source and the upper part of the cell is the same as in the first embodiment. In the 4th r near +, the raw material container is placed in the molecular beam source cell -. Immediately after transferring (2
1), and the shape after 5 minutes is shown in (b).

本実施例では、原料容器7にはバイI]IJティノクボ
ロンナイ1へライトを用いた。同容器は、2つの部品か
ら成り、2つの部品は蝶っがい14て止められている。
In this example, the raw material container 7 was made of BaiIJ Tinokuboronai 1 Herite. The container consists of two parts, and the two parts are held together by hinges 14.

さらに、T i / N 〕合金製ハネ13が2つの部
品上に固定しである。
Additionally, T i /N ] alloy springs 13 are fixed on the two parts.

室温では、バネ13は図(a)に示す通り伸び切ってお
り、Ga9は容器内に保持されている。
At room temperature, the spring 13 is fully extended as shown in Figure (a), and Ga9 is held within the container.

分子線源からの輻射熱により約100′Cまで加熱され
たバネ13は縮み、これによって図(b)に示す通り、
容器の底部が開いて原料9が分子線源に落とし込まれる
The spring 13, heated to about 100'C by the radiant heat from the molecular beam source, contracts, as shown in Figure (b).
The bottom of the container opens and raw material 9 is dropped into the molecular beam source.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、形状記憶合金を一部に用いた原料容器
は、外部より駆動することなく、原料を分子線セルに落
とし込むことができるので、駆動部の故障、真空リーク
を防止する効果がある。
According to the present invention, the raw material container partially using a shape memory alloy can drop the raw material into the molecular beam cell without being driven from the outside, so it is effective in preventing drive unit failure and vacuum leaks. be.

また、外部からの駆動を必要としないため、ロートロッ
ク室の体積を小さくすることができる。
Furthermore, since no external drive is required, the volume of the rotorlock chamber can be reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第1の実施例のロードロック部の縦断
面図、第2図は従来例の原料ロードロック機構を示す概
略縦断面図、第3図は本発明の第1の実施例の原料容器
部の断面図、第4図は本発明の第2の実施例の原料容器
部の断面図である。 1・成長室、2・液体窒素シュラウド、3・分子線源セ
ル、4 磁石、5 ゲートバルブ、6− D丁!料導入
ポート、7・原料容器、9 原料、10・・ヒータ又は
真空計測定子、11・原料導入器、12・るつぼ、13
・ハネ、14 ・蝶つがい。
FIG. 1 is a vertical cross-sectional view of a load lock section according to a first embodiment of the present invention, FIG. 2 is a schematic vertical cross-sectional view showing a conventional raw material load lock mechanism, and FIG. FIG. 4 is a sectional view of a raw material container according to a second embodiment of the present invention. 1. Growth chamber, 2. Liquid nitrogen shroud, 3. Molecular beam source cell, 4. Magnet, 5. Gate valve, 6-D! Raw material introduction port, 7. Raw material container, 9 Raw material, 10. Heater or vacuum gauge probe, 11. Raw material introduction device, 12. Crucible, 13.
- Hane, 14 - Hinge.

Claims (1)

【特許請求の範囲】 1、基板加熱機構と分子線源セルと原料ロードロック機
構より成る分子線エピタキシー装置において、上記原料
ロードロック装置に少なくとも一部が形状記憶合金の原
料容器を設けたことを特徴とする分子線エピタキシー装
置。 2、上記加熱機構は、原料の融点以上に加熱する加熱機
能を有し、かつ分子線源セル上部の分子線源により輻射
加熱温度より低い温度に制御する機能を有することを特
徴とした請求項1記載の分子線エピタキシー装置。 3、上記加熱機構が、原料と対向する位置に設けられた
、真空測定子より成ることを特徴とする請求項1もしく
は請求項2に記載の分子線エピタキシー装置。 4、上記原料ロードロック機構に設けた、形状記憶合金
容器の相転移温度が、原料融点より高く、かつ分子線源
からの輻射温度より低いことを特徴とする請求項1記載
の分子線エピタキシー装置。 5、上記相転移温度がGa融点より高いことを特徴とす
る請求項4に記載の分子線エピタキシー装置。
[Scope of Claims] 1. A molecular beam epitaxy device comprising a substrate heating mechanism, a molecular beam source cell, and a raw material load-lock mechanism, wherein the raw material load-lock device is provided with a raw material container at least partially made of a shape memory alloy. Features of molecular beam epitaxy equipment. 2. Claim characterized in that the heating mechanism has a heating function of heating the raw material above its melting point, and also has a function of controlling the temperature to be lower than the radiation heating temperature by the molecular beam source in the upper part of the molecular beam source cell. 1. The molecular beam epitaxy apparatus according to 1. 3. The molecular beam epitaxy apparatus according to claim 1 or 2, wherein the heating mechanism comprises a vacuum probe provided at a position facing the raw material. 4. The molecular beam epitaxy apparatus according to claim 1, wherein the phase transition temperature of the shape memory alloy container provided in the raw material load-lock mechanism is higher than the melting point of the raw material and lower than the radiation temperature from the molecular beam source. . 5. The molecular beam epitaxy apparatus according to claim 4, wherein the phase transition temperature is higher than the Ga melting point.
JP13820090A 1990-05-30 1990-05-30 Molecular beam epitaxy equipment Pending JPH0437689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13820090A JPH0437689A (en) 1990-05-30 1990-05-30 Molecular beam epitaxy equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13820090A JPH0437689A (en) 1990-05-30 1990-05-30 Molecular beam epitaxy equipment

Publications (1)

Publication Number Publication Date
JPH0437689A true JPH0437689A (en) 1992-02-07

Family

ID=15216424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13820090A Pending JPH0437689A (en) 1990-05-30 1990-05-30 Molecular beam epitaxy equipment

Country Status (1)

Country Link
JP (1) JPH0437689A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551405B1 (en) * 2000-09-22 2003-04-22 The Board Of Trustees Of The University Of Arkansas Tool and method for in situ vapor phase deposition source material reloading and maintenance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551405B1 (en) * 2000-09-22 2003-04-22 The Board Of Trustees Of The University Of Arkansas Tool and method for in situ vapor phase deposition source material reloading and maintenance

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