JPH0438108U - - Google Patents
Info
- Publication number
- JPH0438108U JPH0438108U JP7947190U JP7947190U JPH0438108U JP H0438108 U JPH0438108 U JP H0438108U JP 7947190 U JP7947190 U JP 7947190U JP 7947190 U JP7947190 U JP 7947190U JP H0438108 U JPH0438108 U JP H0438108U
- Authority
- JP
- Japan
- Prior art keywords
- resin mold
- thickness
- delay line
- electromagnetic
- delay time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案による電磁遅延線の一実施例の
内部外観図、第２図は同電磁遅延線の平面図、第
３図は同電磁遅延線の側面図である。
図中、１は外部引き出しリード線、２は基板、
３はマイクロストリツプライン、４は電磁遅延線
、５は樹脂である。
FIG. 1 is an internal external view of an embodiment of the electromagnetic delay line according to the present invention, FIG. 2 is a plan view of the electromagnetic delay line, and FIG. 3 is a side view of the electromagnetic delay line. In the figure, 1 is an external lead wire, 2 is a board,
3 is a microstrip line, 4 is an electromagnetic delay line, and 5 is a resin.
Claims (1)
面にマイクロストリツプラインを形成し、裏面に
アースパタンを形成し、樹脂にてモールドしてな
る分布定数型電磁遅延線において、前記樹脂モー
ルドの厚みを増減することで、遅延時間を設定す
るようにしたことを特徴とする電磁遅延線。 (2) 前記樹脂モールドの厚みを薄くして作り、
該樹脂モールド厚みを増加させて遅延時間を設定
する請求項(1)記載の電磁遅延線。 (3) 前記樹脂モールドの厚みを厚くして作り、
該樹脂モールドの厚みを減少させて遅延時間を設
定する請求項(1)記載の電磁遅延線。[Scope of Claim for Utility Model Registration] (1) In a distributed constant electromagnetic delay line formed by forming a microstrip line on the surface of an alumina substrate or a ceramic substrate, forming a ground pattern on the back surface, and molding with resin. . An electromagnetic delay line characterized in that the delay time is set by increasing or decreasing the thickness of the resin mold. (2) The thickness of the resin mold is made thinner,
The electromagnetic delay line according to claim 1, wherein the delay time is set by increasing the thickness of the resin mold. (3) making the resin mold thicker;
2. The electromagnetic delay line according to claim 1, wherein the delay time is set by reducing the thickness of the resin mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7947190U JPH0438108U (en) | 1990-07-25 | 1990-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7947190U JPH0438108U (en) | 1990-07-25 | 1990-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0438108U true JPH0438108U (en) | 1992-03-31 |
Family
ID=31623664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7947190U Pending JPH0438108U (en) | 1990-07-25 | 1990-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438108U (en) |
-
1990
- 1990-07-25 JP JP7947190U patent/JPH0438108U/ja active Pending
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