JPH0438307Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Field of Application) The present invention relates to a semiconductor direct current test device, and more specifically, to an improvement in test speed.

(Prior Art) This is a type of semiconductor direct current testing device that is configured to have a 1:1 correspondence between each pin of a test head and a direct current signal generation/measuring device in order to increase the testing speed.

FIG. 3 is a block diagram showing an example of such a conventional device. In FIG. 3, reference numeral 1 denotes an apparatus main body, 2 a test head on which a semiconductor device 3 to be tested is mounted, and 4 a cable connecting the apparatus main body 1 and the test head 2. In FIG.

Inside the device main body 1, a plurality of DC signal generation and measurement devices 5, a matrix relay 6, and a multiplexer 7 are provided. DC signal generation measuring instrument 5
is configured so that it can measure DC voltage when it generates DC current, and it can measure DC current when it generates DC voltage. Matrix relay 6 is used to switch and connect each DC signal generating and measuring device 5 to a predetermined input terminal of multiplexer 7 . A multiplexer 7 is used to selectively connect each DC signal generator 5 to a desired test head 2 via a matrix relay 6.

With this configuration, each pin of each test head 2 is connected to a predetermined DC signal generator/measuring device 5 at the same time according to the switching of the multiplexer 7, and the DC signal generator/measuring device and the test head are connected to each other at the same time. Compared to a structure in which tests are performed while switching connections to pins, it can be faster.

(Problems to be Solved by the Invention) However, according to such a conventional configuration, since the matrix relay 6 and the cable 4 are interposed between the DC signal generator and measuring instrument 5 and the test head 2, The test speed is limited by the operation time of the matrix relay 6 and the signal settling time when measuring a minute current due to the capacitance of the cable 4 added to the semiconductor device 3 to be tested.

The present invention has been devised in view of these problems, and its purpose is to realize a semiconductor DC test device that can perform DC tests on semiconductor devices at high speed.

(Means for Solving the Problems) The present invention to solve these problems consists of a test head on which a semiconductor device under test is mounted, and a plurality of DC signals provided respectively corresponding to each pin of the test head. The present invention is characterized by comprising: a generator/measuring device; and a plurality of series circuits in which semiconductor switches and mechanical switches are connected in series to connect corresponding pins of these test heads and the DC signal generator/measuring device. .

(Example) Hereinafter, an example of the present invention will be described in detail using the drawings.

FIG. 1 is a block diagram showing an embodiment of the present invention, and the same parts as in FIG. 3 are given the same reference numerals. In FIG. 1, the test head 2 is provided with a plurality of DC signal generators 5 corresponding to each pin. The sense terminal S and force terminal F of these DC signal generation and measuring instrument 5 are as follows.
As shown in FIG.
and a mechanical switch 9 to the corresponding pins of the test head 2 through a series circuit. The apparatus body 1 includes a plurality of other measuring instruments 10, a controller 11 that controls each DC signal generating measuring instrument 5 provided in the test head 2, and a controller 11 for controlling each of the DC signal generating and measuring instruments 5 provided in the test head 2.
A power supply section 12 for supplying power to each of the DC signal generating and measuring instruments 5 provided therein is provided.

In such a configuration, each DC signal generating and measuring device 5 provided in the test head 2 is controlled by a controller 11 provided in the main body 1 of the apparatus. That is, for measurements that do not require insulation properties when the switch is turned off, the mechanical switch 9 is turned on and the semiconductor switch 8 is turned on.
For measurements requiring insulation properties when the switch is turned off, the semiconductor switch 8 is turned on and the mechanical switch 9 is turned on and off.

With this configuration, the cable 4, multiplexer 7, and matrix relay 6 that exist between each pin of the conventional test head 2 and each terminal of the DC signal generator/measuring device 5 are no longer necessary, and the semiconductor device 3 under test is Since the capacitance added to the sensor is significantly reduced, the signal settling time when measuring small currents can be shortened, and the test speed can be increased.

Furthermore, since the matrix relay 6 is not required, it is possible to eliminate the increase in operating time caused by conventional control of the matrix relay 6.

(Effects of the Invention) As described above, according to the present invention, it is possible to realize a semiconductor DC test device that can perform DC tests of semiconductor devices at high speed, and the practical effects are great.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing an embodiment of the present invention.
FIG. 2 is a circuit diagram of the main part of FIG. 1, and FIG. 3 is a block diagram showing an example of a conventional semiconductor DC test device. 1...Device main body, 2...Test head, 3...
Semiconductor device to be tested, 5... DC signal generation measuring instrument, 8... Semiconductor switch, 9... Mechanical switch.

Claims (1)

[Claim for Utility Model Registration] A test head on which a semiconductor device to be tested is mounted, a plurality of DC signal generation and measurement instruments provided to correspond to each pin of the test head, and a DC signal generation device with corresponding pins of these test heads. A semiconductor direct current test device comprising: a plurality of series circuits in which a semiconductor switch and a mechanical switch are connected in series to connect a measuring device.