JPH0438559Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an electronic device equipped with a radiation heat shielding structure for a heating element.

[Background of the idea]

1 to 3 show a conventional example, in which FIG. 1 is a plan view of an electronic device incorporating a heating element, FIG. 2 is a front view thereof, and FIG. 3 is a side view thereof.

In the drawing, 1 is a chassis (heat sink),
2 is a printed circuit board mounted horizontally on the bottom plate 1a of the chassis 1 via a spacer 4; 3 is an electronic component mounted on the printed circuit board 2, such as an electrolytic capacitor; 5 is a board bent upward from the bottom plate 1a of the chassis 1; A first power transistor (heating element) mounted on the curved portion 1b, the power transistor 5
is located on the same plane as other electronic components such as the electrolytic capacitor 3, and is dip-soldered to the printed circuit board 2 at the same time with leads 5a. Further, the first power transistor 5 is fixed to the upper bent portion 1b of the chassis 1 with screws 6, washers 7, nuts 8, etc., as shown in FIG. 9 is a second power transistor mounted on the side plate 1c of the chassis 1;
One lead 9a is dip soldered to the printed circuit board 2 at the same time, and the other lead is soldered with a screw 10 and a washer 1.
1. It is fixed to the side plate 1c of the chassis 1 with a nut 12 or the like. Reference numeral 13 denotes a heat radiation hole bored in the surface of the upper bent portion 1b.

In the conventional electronic equipment as described above, the first,
As shown in the wave pattern, the radiant heat from the second power transistors 5 and 9 is transmitted to other electronic components, the first to
In the case of FIG. 3, there is a drawback that the radiation is radiated to the electrolytic capacitor 3. Even if heat radiation holes 13 are provided in the bottom plate 1a of the chassis 1 as shown in FIG. 1 as a measure to prevent this radiant heat, since the bottom plate 1a is arranged horizontally to the printed circuit board 2, air flow is blocked and the heat is radiated. The effect is small. In addition, other parts may have to be removed in order to attach the power transistors 5 and 9, and the effective area of the printed circuit board 2 may become smaller.
Since the pattern surface of the lead 5a is parallel to the heat dissipation holes 13, it is easily destroyed by damage, etc., and furthermore, when installing the first power transistor 5, the length of the lead 5a is limited. Moreover, since the printed circuit board 2 needs to be separated from the chassis 1, it is necessary to provide an upper bent part 1b on the chassis 1 and attach it to that part, which causes various inconveniences such as the troublesome processing of the chassis 1. It was hot.

[Purpose of invention]

The present invention aims to improve the above-mentioned conventional drawbacks, and the purpose of the present invention is to provide a heat generating device that can prevent radiation heat from heat generating elements and that can simultaneously dip-solder heat generating elements and non-heat generating elements. It is an object of the present invention to provide an electronic device equipped with a radiation heat shielding structure for an element.

[Example of idea]

4 to 6 show an embodiment of the present invention, in which FIG. 4 is a plan view of an electronic device incorporating a heating element, FIG. 5 is a front view thereof, and FIG. 6 is a side view thereof. Note that the same parts as in the conventional example shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof will be omitted. In the drawing, 1 is a chassis (heat sink), and 2 is a printed circuit board that is vertically attached to the chassis 1 as shown in FIG. The printed circuit board 14 provided with the notch 19 is a third power transistor, and is mounted on the chassis 1 and near the right side of the printed circuit board 2 as shown in FIG. 6.

Reference numeral 3 denotes an electrolytic capacitor mounted on the opposite side (left side in the drawing) of the printed circuit board 2 to the surface on which the third power transistor 14 is mounted, and the lead 14a of the third power transistor 14 is connected to the notch of the printed circuit board 2. 19 and is routed to a surface opposite to the surface on which the third power transistor 14 is mounted (on the right side in the figure). This lead 14a is formed after dip soldering at the same time as the terminal of the electrolytic capacitor 3. Also, the third power transistor 1
The other end of 4 is fixed to chassis 1 with screws 15, washers 16, nuts 17, etc. as shown in FIG. be installed at the same time. Note that 13 is a heat radiation hole provided in the chassis 1, and 18 is a support that supports both sides of the printed circuit board 2.

With the above configuration, the radiant heat generated from the third power transistor 14 as shown in the waveform in FIG. It can prevent heat from radiating to electronic components.

Moreover, since the third power transistor 14 is mounted on the opposite side to other parts including the electrolytic capacitor 13, the arrangement of other electronic parts is changed in order to attach the third power transistor 14 to the chassis 1. The effective area of the printed circuit board 2 is increased without any influence, which leads to a reduction in the size of the entire device.

Further, since the heat radiation holes provided in the chassis 1 allow ventilation from 13 to directly hit components such as the electrolytic capacitor 3, the heat radiation effect is great.

Furthermore, when the electronic device is incorporated into a set, the flow of air from the outside is improved and the temperature inside the set can be lowered.

Furthermore, there is no need to provide the bent portion 1b above the chassis 1 provided in the conventional example, and the machining of the chassis 1 can also be simplified.

[Effect of idea]

As described above, according to the present invention, it is possible to prevent heat radiating from the heat generating element to the non-heat generating element, and it is possible to dip solder the heat generating element and the non-heat generating element at the same time.

[Brief explanation of the drawing]

1 to 3 show a conventional example, in which FIG. 1 is a plan view of an electronic device incorporating a heating element, FIG. 2 is a front view thereof, and FIG. 3 is a side view thereof. 4 to 6 show the present invention, in which FIG. 4 is a plan view of an electronic device incorporating a heating element, FIG. 5 is a front view thereof, and FIG. 6 is a side view thereof. 1... Chassis (heat sink), 1a... Bottom plate, 1b... Upper bent part, 1c... Side plate, 2...
Printed circuit board, 3... Electrolytic capacitor (electronic component), 5... First power transistor (heating element), 6, 10, 15... Screw, 7, 11, 16
...Washiya, 8, 12, 17...Natsuto, 9
...Second transistor (heating element), 13...
Heat dissipation hole, 14...Third transistor (heating element), 18...Support.

Claims (1)

[Claims for Utility Model Registration] A chassis, a printed circuit board mounted vertically on the chassis, and a non-heat generating element mounted on one surface of the printed circuit board and having lead wires soldered to the other surface. , mounted on the chassis on the other side of the printed circuit board, and a lead wire is routed from the other side to the one side and inserted from the one side to the other side. and a heating element soldered to the heating element, and a notch through which the lead wire is inserted when the lead wire is routed is provided below the vertically arranged printed circuit board. Electronic equipment with heat shielding structure.