JPH0438834B2 - - Google Patents
Info
- Publication number
- JPH0438834B2 JPH0438834B2 JP22834385A JP22834385A JPH0438834B2 JP H0438834 B2 JPH0438834 B2 JP H0438834B2 JP 22834385 A JP22834385 A JP 22834385A JP 22834385 A JP22834385 A JP 22834385A JP H0438834 B2 JPH0438834 B2 JP H0438834B2
- Authority
- JP
- Japan
- Prior art keywords
- tin
- copper
- solution
- ion concentration
- stripping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 78
- 239000010949 copper Substances 0.000 claims description 50
- 239000000243 solution Substances 0.000 claims description 49
- 150000002500 ions Chemical class 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 20
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 description 24
- 238000011084 recovery Methods 0.000 description 24
- 238000005868 electrolysis reaction Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- AUYOHNUMSAGWQZ-UHFFFAOYSA-L dihydroxy(oxo)tin Chemical compound O[Sn](O)=O AUYOHNUMSAGWQZ-UHFFFAOYSA-L 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000003011 anion exchange membrane Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
Description
[産業上の利用分野]
本発明は錫剥離液の処理方法に関し、さらに詳
しくは、銅および銅合金等に被覆されている錫を
溶解後回収し、かつ、この錫回収後の溶液を再生
する錫剥離液の処理方法に関する。
[従来技術]
従来より、銅および銅合金を基材とする錫めつ
きされた材料は、端子或いはコネクター部材とし
て電子機器分野において広く使用されている。
これら錫めつき材料は省力化、コストダウンの
ためフープ状でめつき処理をされた後、端子、コ
ネクター等に打抜きされるのが通常である。
しかし、この打抜き加工により発生するスクラ
ツプは錫を5〜30g/程度も含有されているの
で、銅屑として取扱いが困難で、かつ、用途が限
定されている。
このようにスクラツプを資源として有効に利用
するためには錫めつき層を除去する必要がある。
いままでにも、銅および銅合金の錫層の剥離法
として、熱濃燐酸或いは熱濃塩酸中に浸漬した
り、また、水酸化ナトリウム中で溶解することが
行なわれてきている。
しかしながら、これらの方法はその何れも錫層
が溶解除去された後においてもそのまま浸漬を続
けると、銅および銅合金の基材が侵蝕されるので
基材の回収率が悪く、その剥離液中に基材から溶
出した不純物が混入されるので、剥離液は錫層の
溶解性が低下した時点で廃棄されるのが通常であ
る。
従つて、剥離液に要求される性質としては、錫
層のみを溶解し、剥離液中に銅および銅合金の基
材が露出しても基材の侵蝕されないものが望まし
いのである。
そして、このような特性を具備した錫層の剥離
法として、特開昭58―087275号公報に記載されて
いるように、強酸の稀薄水溶液に銅の塩類を添加
した剥離液に錫層が被覆されている銅合金を浸漬
して、錫と銅の電気化学的序列の差を利用して錫
層を溶解剥離する方法が提案されている。この剥
離液に錫層が被覆されている銅および銅合金を浸
漬すると、
Cu2++Sn→Sn2++Cu
の反応により、錫層は剥離液中に優先的に溶出し
銅は析出することになり、析出した銅は錫に比し
水素過電圧が少ないため有効なカソード点を形成
し、アノード反応である錫の溶解を増々促進す
る。一方、銅および銅合金に被覆されている錫層
が溶解除去された銅および銅合金の基材は稀酸溶
液に接触するが、強力な酸化剤を含有しない稀酸
溶液中の銅および銅合金の侵蝕率は軽微であり、
たとえ、長時間そのまま浸漬されていたとしても
基材の回収効率を上げることが可能である。
従つて、このような剥離液を使用すると基材か
ら不純物の混入量が減少するが、このままの状態
において剥離作業を続行すると、Sn2+が酸化さ
れてメタ錫酸(SnO2XH2O)として沈澱するた
め、いこの時点で廃棄するか、メタ錫酸を回収後
廃棄しているので剥離コストが高く、かつ、回収
した錫の利用についても限定されるという問題が
あつた。
[発明が解決しようとする問題点]
本発明は上記に説明したように、従来における
錫層被覆されている銅および銅合金基材から錫層
を回収する際の種々の問題点に鑑みなされたもの
であり、本発明者が鋭意研究を行ない、検討を加
えた結果、錫層が被覆されている銅および銅合金
基材をCuイオンを含有する硫酸水溶液中に浸漬
して錫層を剥離する際に、剥離液中から錫を効率
よく回収すると共に、剥離液を廃棄することなく
再生して繰返し使用することができる錫剥離液の
処理方法を開発したのである。
[問題点を解決するための手段]
本発明に係る錫剥離液の処理方法の特徴とする
ところは、錫層で被覆されている銅および銅合金
をCuイオンを含有する硫酸水溶液中に浸漬して
錫層を溶解し、この溶液中のCuイオン濃度を4
g/以下、Sn2+イオン濃度を5〜30g/と
して錫を電解回収し、この錫回収後の溶液に硫酸
銅を添加してCuイオン濃度を5〜25g/とす
ることにある。
この錫を電解により回収する際に、陽極を陰イ
オン交換膜で隔離して行なうとよい。
本発明に係る錫剥離液の処理方法について以下
詳細に説明する。
Cuイオンを含有する硫酸水溶液中に錫層が被
覆されている銅および銅合金を浸漬すると、錫が
優先的に溶出して銅は析出するので、剥離作業を
継続して行なうとCuイオン濃度が減少して溶解
能が低下する。
従つて、Cuイオン、例えば、硫酸銅の形で補
給すると溶解能が再び向上するので剥離作業を継
続して行なえるが、これを繰返して行なうと溶液
中に錫の濃度が増加してメタ錫酸が析出するよう
になる。
しかし、溶液中にメタ錫酸が析出しても銅およ
び銅合金に被覆されている錫層の剥離能力はある
が、次第に反応速度が遅くなり、また、剥離液が
混濁して作業性が悪くなるので、通常はこのよう
な状態で剥離液は廃棄されるか、また、錫をメタ
錫惨として回収後廃棄していたので剥離作業全体
における時間が相当かかり、かつ、不経済であ
る。
本発明に係る錫剥離液の処理方法によれば、剥
離液中のCuイオン濃度を4g/以下、Sn2+イ
オン濃度を5〜30g/として電解により回収す
るのであり、この電解回収においては銅の析出が
優先するためCuイオン濃度が4g/を越える
と電解析出物中に銅含有量が増加して錫純度が低
下するようになるので、Cuイオン濃度を4g/
以下とし、次に、Sn2+イオン濃度が5g/
未満では錫回収効率が悪く不経済であり、また、
30g/を越える濃度ではメタ錫酸が生成し易く
なつて効率のよい回収を行なうことができなくな
るので、Sn2+イオン濃度は5〜30g/とする。
さらに、錫を電解回収した後の溶液のCuイオ
ン濃度は5g/未満では錫層の剥離速度が減少
し、また、25g/を越える濃度では過剰のCu
イオンは錫層の剥離率の向上には寄与せず不経済
であるので、Cuイオン濃度は5〜25g/とす
る。
また、本発明の係る錫剥離液の処理方法におい
て、新しい剥離液を製造後、2〜3回は本発明に
係る錫剥離液の処理方法の範囲内のCuイオン、
Sn2+イオンの濃度であれば、陰イオン交換膜を
使用した電解方法と略同様の高い回収率が得られ
るが、剥離液中のSn2+イオンは電解時陽極から
発生する酸素ガスによつて酸化されるため錫回収
率は次第に低下してくる。
そして、剥離液を再生しないで廃棄する方法に
おいて、錫回収に際して隔膜使用の必要性はない
が、剥離液を再生する場合には陽極を陰イオン交
換膜で隔離する電解回収法を行なうことにより回
収効率が向上する。
さらに、剥離液中の空気酸化を防止するため
に、剥離作業中や休止中にN2およびAr等の不活
性ガスを少量吹き込むことで、メタ錫酸の生成を
著しく軽減することができる。
[実施例]
本考案に係る錫剥離液の処理方法について実施
例を説明する。
実施例 1
試験条件
電解条件
陰極電流密度 1.0A/dm2
電解時間 5時間
陽極隔膜 なし
電解液 攪拌
液 温 15〜40℃
第1表に電解回収時の上記電解条件により得ら
れたCuイオン濃度、Sn2+イオン濃度を示す。さ
らに、錫回収率および電析物中のCu含有量を示
す。
[Industrial Application Field] The present invention relates to a method for treating tin stripping solution, and more specifically, it involves recovering tin coated on copper, copper alloy, etc. after dissolving it, and regenerating the solution after recovering the tin. This invention relates to a method for treating tin stripper. [Prior Art] Traditionally, tinned materials based on copper and copper alloys have been widely used as terminals or connector members in the field of electronic equipment. These tin-plated materials are usually plated in a hoop shape and then punched into terminals, connectors, etc. in order to save labor and reduce costs. However, since the scrap generated by this punching process contains about 5 to 30 g of tin, it is difficult to handle it as copper scrap, and its uses are limited. In order to effectively utilize scrap as a resource, it is necessary to remove the tinned layer. Hitherto, the tin layer of copper and copper alloys has been removed by immersion in hot concentrated phosphoric acid or hot concentrated hydrochloric acid, or by dissolution in sodium hydroxide. However, in all of these methods, if the immersion continues even after the tin layer has been dissolved and removed, the base material of copper and copper alloy will be eroded, resulting in a poor recovery rate of the base material. Since impurities eluted from the base material are mixed in, the stripping solution is usually discarded when the solubility of the tin layer decreases. Therefore, as properties required for the stripping solution, it is desirable that the stripping solution dissolves only the tin layer and that even if the copper or copper alloy substrate is exposed in the stripping solution, the substrate will not be corroded. As a method for stripping a tin layer with such characteristics, as described in JP-A-58-087275, the tin layer is coated with a stripping solution prepared by adding copper salts to a dilute aqueous solution of a strong acid. A method has been proposed in which the tin layer is dissolved and peeled off by immersing the copper alloy that has been used in the manufacturing process to take advantage of the difference in electrochemical order between tin and copper. When copper and copper alloys coated with a tin layer are immersed in this stripping solution, the tin layer is preferentially eluted into the stripping solution and copper is precipitated due to the reaction of Cu 2+ + Sn → Sn 2+ + Cu. Since the deposited copper has a lower hydrogen overvoltage than tin, it forms an effective cathode point and further promotes the dissolution of tin, which is an anode reaction. On the other hand, the copper and copper alloy substrates from which the tin layer coated on the copper and copper alloys has been dissolved and removed are brought into contact with the dilute acid solution, but the copper and copper alloys in the dilute acid solutions do not contain strong oxidizing agents. The erosion rate is slight;
Even if the base material is immersed for a long time, it is possible to increase the recovery efficiency of the base material. Therefore, if such a stripping solution is used, the amount of impurities mixed in from the base material will be reduced, but if stripping work is continued in this state, Sn 2+ will be oxidized and metastannic acid (SnO 2 XH 2 O) will be formed. Since the tin precipitates as a metal, it is either discarded at this point or discarded after the metastannic acid has been recovered, resulting in high stripping costs and limited use of the recovered tin. [Problems to be Solved by the Invention] As explained above, the present invention was made in view of the various problems encountered when recovering a tin layer from conventional tin layer-coated copper and copper alloy substrates. As a result of intensive research and consideration by the present inventor, the tin layer is peeled off by immersing the copper and copper alloy substrate coated with the tin layer in a sulfuric acid aqueous solution containing Cu ions. At the same time, they developed a method for processing tin stripping solution that allows for efficient recovery of tin from the stripping solution, as well as recycling and repeated use of the stripping solution without having to be disposed of. [Means for Solving the Problems] The tin stripping solution treatment method according to the present invention is characterized by immersing copper and copper alloys coated with a tin layer in a sulfuric acid aqueous solution containing Cu ions. to dissolve the tin layer and reduce the Cu ion concentration in this solution to 4
The method is to electrolytically recover tin at a Sn 2+ ion concentration of 5 to 30 g/, and then add copper sulfate to the solution after tin recovery to adjust the Cu ion concentration to 5 to 25 g/. When recovering this tin by electrolysis, it is preferable to isolate the anode with an anion exchange membrane. The method for treating a tin stripper according to the present invention will be described in detail below. When copper and copper alloys coated with a tin layer are immersed in an aqueous sulfuric acid solution containing Cu ions, the tin preferentially elutes and the copper precipitates, so if the stripping process is continued, the Cu ion concentration will increase. and the solubility is reduced. Therefore, if Cu ions are replenished in the form of copper sulfate, the solubility will be improved again and stripping work can be continued, but if this is repeated, the concentration of tin in the solution will increase and metatin will be produced. Acid begins to precipitate. However, even if metastannic acid precipitates in the solution, it still has the ability to strip off the tin layer covering copper and copper alloys, but the reaction rate gradually slows down and the stripping solution becomes cloudy, resulting in poor workability. Therefore, the stripping solution is usually discarded in such a state, or the tin is collected as metatin and then discarded, which makes the entire stripping process quite time-consuming and uneconomical. According to the method for treating tin stripping solution according to the present invention, the tin stripping solution is recovered by electrolysis with a Cu ion concentration of 4 g/or less and a Sn 2+ ion concentration of 5 to 30 g/. If the Cu ion concentration exceeds 4 g/, the copper content in the electrolytic deposit will increase and the tin purity will decrease, so the Cu ion concentration should be reduced to 4 g/
below, and then the Sn 2+ ion concentration is 5g/
If it is less than that, the tin recovery efficiency is poor and it is uneconomical.
If the concentration exceeds 30 g/, metastannic acid is likely to be produced and efficient recovery cannot be performed, so the Sn 2+ ion concentration is set at 5 to 30 g/. Furthermore, if the Cu ion concentration of the solution after electrolytic recovery of tin is less than 5 g/, the peeling rate of the tin layer decreases, and if the concentration exceeds 25 g/, excessive Cu
Since ions do not contribute to improving the peeling rate of the tin layer and are uneconomical, the Cu ion concentration is set to 5 to 25 g/. In addition, in the method for treating a tin stripper according to the present invention, after producing a new stripper, Cu ions within the scope of the method for treating a tin stripper according to the present invention are used two to three times.
If the concentration of Sn 2+ ions is high, a high recovery rate similar to that of the electrolysis method using an anion exchange membrane can be obtained, but the Sn 2+ ions in the stripping solution are destroyed by oxygen gas generated from the anode during electrolysis. As the tin is heated and oxidized, the tin recovery rate gradually decreases. When the stripping solution is disposed of without being regenerated, there is no need to use a diaphragm when recovering tin, but when the stripping solution is recycled, it can be recovered by performing an electrolytic recovery method that separates the anode with an anion exchange membrane. Increased efficiency. Furthermore, in order to prevent air oxidation in the stripping solution, the production of metastannic acid can be significantly reduced by blowing a small amount of inert gas such as N 2 or Ar during stripping work or during pauses. [Example] Examples of the method for treating tin stripping liquid according to the present invention will be described. Example 1 Test conditions Electrolysis conditions Cathode current density 1.0A/dm 2 Electrolysis time 5 hours Anode diaphragm None Electrolyte Stirred solution Temperature 15-40℃ Table 1 shows the Cu ion concentration obtained under the above electrolysis conditions during electrolytic recovery, Indicates Sn 2+ ion concentration. Furthermore, the tin recovery rate and the Cu content in the deposits are shown.
【表】
この第1表から明らかなように、本発明に係る
錫剥離液の処理方法において規定している、溶液
中のCuイオン、Snイオン濃度であれば、錫回収
が高く、かつ、電析物中の銅含有量も少ないが、
比較例は錫回収率が低く、電析物中の銅含有量も
多く(No.7〜10)、回収率が高い銅含有量も高い
(No.6)という問題がある。
実施例 2
試験条件
(1) 試験材
錫層で被覆されている銅合金(錫被覆量約
5μ)
(2) 剥離条件
液温 50℃
浸漬時間 5分
このような試験条件における錫電析後における
溶液(再生液)のCuイオン濃度と錫層の溶解能
を第2表に示す。[Table] As is clear from Table 1, if the Cu ion and Sn ion concentrations in the solution are specified in the tin stripping solution treatment method according to the present invention, tin recovery is high and the Although the copper content in the precipitates is also low,
Comparative examples have problems in that the tin recovery rate is low and the copper content in the deposits is high (No. 7 to 10), and the copper content with a high recovery rate is also high (No. 6). Example 2 Test conditions (1) Test material Copper alloy coated with a tin layer (tin coating amount approx.
(5μ) (2) Stripping conditions Liquid temperature: 50°C Immersion time: 5 minutes Table 2 shows the Cu ion concentration of the solution (regenerated solution) and the solubility of the tin layer after tin electrodeposition under these test conditions.
【表】【table】
【表】
この第2表から明らかであるが、本発明に係る
剥離液の処理方法において規定されているCuイ
オン濃度とすることにより、錫回収率は99%以上
であり、この規定範囲以下では回収率が悪く、以
上では回収率はよいが、それ以上の向上はなく、
不経済である。
実施例 3
試験条件
剥離液 Sn2+イオン30g/
電解条件
陰極電流密度 1.0A/dm2
陰極面積 4dm2
陽極隔膜 陰イオン交換膜(例えば、旭ガラス製
セレミオン)
電解液 攪拌
液 温 15〜40℃
この条件で、本発明に係る錫剥離液の処理方法
において隔膜を使用した場合と隔膜を使用しない
場合とにおける電解時間と錫回収率との関係を第
1図に示す。
第1図において、1は本発明に係る新しい剥離
液使用による処理方法の場合であり、2は本発明
に係る錫剥離液の処理方法により錫剥離後の溶液
のCuイオン濃度を繰返し調整した(20回)場合
を示し、3は新しい剥離液使用による隔膜を使用
しない場合の処理方法であり、4は隔膜を使用せ
ず錫剥離後の溶液のCuイオン濃度繰返し調整し
た(20回)場合を示しているが、隔膜を使用する
ことにより、錫回収率が格段に向上することがわ
かる。
[発明の効果]
以上説明したように、本発明に係る錫剥離液の
処理方法は上記の構成であるから、錫が被覆され
ている銅および銅合金から錫を効率的に高い回収
率で回収することができ、さらに、錫回収後の溶
液を廃棄することなく再生して錫を被覆された銅
および銅合金から錫を溶解するために使用するこ
とができるという優れた効果を有するものであ
る。[Table] It is clear from Table 2 that by using the Cu ion concentration specified in the stripping solution treatment method according to the present invention, the tin recovery rate is 99% or more, and below this specified range, the tin recovery rate is The recovery rate is poor, and above that the recovery rate is good, but there is no further improvement.
It is uneconomical. Example 3 Test conditions Stripping solution Sn 2+ ion 30g / Electrolysis conditions Cathode current density 1.0A/dm 2 Cathode area 4 dm 2 Anode diaphragm Anion exchange membrane (e.g. Selemion manufactured by Asahi Glass) Electrolyte Stirring solution Temperature 15-40℃ Under these conditions, FIG. 1 shows the relationship between the electrolysis time and the tin recovery rate when a diaphragm is used and when a diaphragm is not used in the tin stripping solution treatment method according to the present invention. In FIG. 1, 1 is the case where the treatment method using the new stripping solution according to the present invention is used, and 2 is the case where the Cu ion concentration of the solution after tin stripping is repeatedly adjusted by the treatment method using the tin stripping solution according to the present invention ( 3 is a treatment method in which a new stripping solution is used without using a diaphragm, and 4 is a treatment method in which a diaphragm is not used and the Cu ion concentration of the solution after tin stripping is repeatedly adjusted (20 times). It can be seen that the tin recovery rate is significantly improved by using the diaphragm. [Effects of the Invention] As explained above, since the tin stripping solution treatment method according to the present invention has the above configuration, tin can be efficiently recovered from tin-coated copper and copper alloys at a high recovery rate. Furthermore, it has the excellent effect that the solution after tin recovery can be recycled without being discarded and used to dissolve tin from tin-coated copper and copper alloys. .
第1図は電解時間と錫回収率との関係を示す図
である。
FIG. 1 is a diagram showing the relationship between electrolysis time and tin recovery rate.
Claims (1)
イオンを含有する硫酸水溶液に浸漬して錫層を溶
解し、この溶液中のCuイオン濃度を4g/以
下、Sn2+イオン濃度を5〜30g/として錫を
電解回収し、この錫回収後の溶液に硫酸銅を添加
してCuイオン濃度を5〜25g/とすることを
特徴とする錫剥離液の処理方法。1 Copper and copper alloys coated with a tin layer are
The tin layer is dissolved by immersion in a sulfuric acid aqueous solution containing ions, and the tin is electrolytically recovered by setting the Cu ion concentration in this solution to 4 g/or less and the Sn 2+ ion concentration to 5 to 30 g/. A method for treating a tin stripping solution, which comprises adding copper sulfate to the solution to adjust the Cu ion concentration to 5 to 25 g/.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22834385A JPS6289880A (en) | 1985-10-14 | 1985-10-14 | Treatment of tin removing solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22834385A JPS6289880A (en) | 1985-10-14 | 1985-10-14 | Treatment of tin removing solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6289880A JPS6289880A (en) | 1987-04-24 |
| JPH0438834B2 true JPH0438834B2 (en) | 1992-06-25 |
Family
ID=16874973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22834385A Granted JPS6289880A (en) | 1985-10-14 | 1985-10-14 | Treatment of tin removing solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289880A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5481233B2 (en) * | 2010-03-04 | 2014-04-23 | Dowaメタルテック株式会社 | Recycling method of waste liquid containing Sn ion |
| JP2012052205A (en) * | 2010-09-03 | 2012-03-15 | Dowa Metaltech Kk | Method of removing tin or tin alloy layer on surface of copper or copper alloy material |
| CN110129799B (en) * | 2019-04-30 | 2021-06-15 | 广东工业大学 | A kind of recycling method of tin stripping waste liquid based on sulfuric acid-iron salt system |
-
1985
- 1985-10-14 JP JP22834385A patent/JPS6289880A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6289880A (en) | 1987-04-24 |
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