JPH0440262A - How to apply adhesive - Google Patents

How to apply adhesive

Info

Publication number
JPH0440262A
JPH0440262A JP2118892A JP11889290A JPH0440262A JP H0440262 A JPH0440262 A JP H0440262A JP 2118892 A JP2118892 A JP 2118892A JP 11889290 A JP11889290 A JP 11889290A JP H0440262 A JPH0440262 A JP H0440262A
Authority
JP
Japan
Prior art keywords
adhesive
nozzle
printed circuit
circuit board
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2118892A
Other languages
Japanese (ja)
Inventor
Kazuo Minamino
南野　和男
Fumio Yukimoto
二三夫 雪本
Tadashi Aikawa
相川　忠
Minoru Kuriyama
実 栗山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2118892A priority Critical patent/JPH0440262A/en
Publication of JPH0440262A publication Critical patent/JPH0440262A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To perfectly eliminate soldering inferiority or the positional shift of a part by preventing the stringing of an adhesive by applying the adhesive to a printed circuit board from a dispenser and subsequently blowing air thereto. CONSTITUTION:After an adhesive is applied to a printed circuit board 7 by an adhesive coating nozzle 10, the nozzle 10 rises and a limit switch 2 is operated and, thereafter, a timer 6 is operated to open a valve 4 for a definite time. During this period, air is sent to an air nozzle 9 from a speed controller 3 and blown out of the air nozzle 9 to blow off the stringing part of the adhesive of the adhesive coating nozzle 10. By this coating method, the stringing of the adhesive is prevented and soldering inferiority can be prevented. Since an adhesive having weak adhesive strength can be used, the positional shift of a part is prevented and the quality and yield of the printed circuit board are enhanced.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は電子機器を用いるプリント基板製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed circuit board manufacturing method using electronic equipment.

従来の技術 従来の電子部品のプリント基板への実装方法は、プリン
ト基板表面へ部品固定用の接着剤を塗布後、電子部品を
マウントヘットにより基板面に実装し、続いて硬化炉へ
挿入して接着剤を硬化することで、部品を基板面に仮固
定し、その後、半田付装置により部品をプリント基板に
半田付けする。Conventional technology The conventional method for mounting electronic components on a printed circuit board is to apply adhesive for fixing the components to the surface of the printed circuit board, then mount the electronic component on the board surface using a mount head, and then insert it into a curing furnace. The components are temporarily fixed to the board surface by curing the adhesive, and then the components are soldered to the printed circuit board using a soldering device.

プリント基板表面への接着剤の塗布方法は、第３図に示
すように、コントローラ１２とシリンジ１１と塗布ノズ
ル１３により構成されたディスペンス装置をもちいてい
る。The method for applying adhesive to the surface of a printed circuit board uses a dispensing device comprising a controller 12, a syringe 11, and an application nozzle 13, as shown in FIG.

発明が解決しようとする課題 しかしながら、このようなディスペンサー塗布方法にお
いて、接着剤塗布は、接着剤の選択か難しく接着力を重
要視すれば糸引きが発生し、接着力の弱いものは部品の
ズレ、ハズレか出やすく、この様な接着剤の目的に合い
反する状態である。Problems to be Solved by the Invention However, in such a dispenser application method, it is difficult to select the adhesive when applying the adhesive, and if adhesive strength is emphasized, stringing may occur, and those with weak adhesive strength may cause parts to shift. , it is easy to lose the adhesive, which is contrary to the purpose of such an adhesive.

この様な塗布方法による接着剤の糸引き現象は、接着剤
の塗布後、ノズルか上昇する時にノスルと接着剤との糸
引き状態となり、次のポイントへの塗布移動にはノズル
かＸ−Ｙテーブル１５の移動方法かとられる、そのため
糸引き状態で移動すると、接着剤がプリント基板の端子
等に付着し塗布された状態となる。そのため半田付は不
良を引き起こす原因となる。The stringing phenomenon of the adhesive caused by this application method is that when the nozzle rises after applying the adhesive, the nozzle and the adhesive become stringy, and when moving to the next point, the nozzle or X-Y Depending on the method of moving the table 15, if the table 15 is moved in a stringy state, the adhesive will adhere to and be coated on the terminals of the printed circuit board. Therefore, soldering causes defects.

また、糸引き状態での塗布では塗布量のバラツキや、形
状の安定が望めなく、硬化後の接着力、位置のズレの要
因となっている。In addition, when applied in a stringy state, the coating amount varies and the shape cannot be stabilized, which causes adhesive strength and positional deviation after curing.

課題を解決するための手段 本発明の接着剤の塗布方法は、ディスペンサー塗布方法
において、接着剤の塗布後、エアーフロー用ノズルによ
り接着剤の糸引きを吹き飛ばすものである。Means for Solving the Problems The adhesive application method of the present invention is a dispenser application method in which, after application of the adhesive, an air flow nozzle is used to blow off any stringy adhesive.

作用 本発明の接着剤の塗布方法は、接着剤ノズルから接着剤
をプリント基板へ塗布後、接着剤ノズルが上昇しだすと
エアーノズルからブローすることにより、糸引きをプリ
ント基板上の接着剤に吸収され糸引き現象を遮断する、
それにより次のポイントへの移動塗布において、糸引き
が無いため、半田付は不良を起こすことが全くなくなる
。又、接着剤の分量や形状が安定するため部品のズレや
ハズレがなくなる、接着剤の選定においても容易に選定
が行える。Function: The adhesive application method of the present invention is such that after applying adhesive from an adhesive nozzle to a printed circuit board, when the adhesive nozzle begins to rise, air is blown from an air nozzle to absorb the stringiness into the adhesive on the printed circuit board. to block the stringy phenomenon,
As a result, there is no stringing when moving the coating to the next point, so there is no possibility of soldering defects. Furthermore, since the amount and shape of the adhesive is stable, there is no possibility of parts shifting or missing, and the selection of adhesive can be made easily.

実施例 以下、本発明の一実施例の接着剤の塗布方法について、
図面を参照して説明する。Example Hereinafter, a method of applying an adhesive according to an example of the present invention will be described.
This will be explained with reference to the drawings.

第１図は、一実施例の接着剤の塗布方法を実施するため
の装置の構成図、第２図はそのノズル部分の拡大図であ
る。FIG. 1 is a block diagram of an apparatus for carrying out an adhesive application method according to an embodiment, and FIG. 2 is an enlarged view of the nozzle portion thereof.

接着剤の塗布装置１は次のものから構成されている。２
はリミットスイッチ、３はエアーの流量を調節するスピ
ードコントローラー　４はエアーを制御するバルブであ
り、調整用減圧弁５および、タイマー６により制御され
る。７は接着剤を塗布されるプリント基板である。The adhesive applicator 1 is composed of the following components. 2
3 is a limit switch, 3 is a speed controller that adjusts the flow rate of air, and 4 is a valve that controls air, which is controlled by an adjustment pressure reducing valve 5 and a timer 6. 7 is a printed circuit board to which adhesive is applied.

第２図において、８はプリント基板７とエアーノズル９
との間隔を一定に保つためにプリント基板７を上から押
さえるものであり９はスピードコントローラ３から送ら
れるエアーをプリント基板７および接着塗布ノズル１０
に向かって二′ｒ−を吹き出すエアーノズルである。In FIG. 2, 8 is the printed circuit board 7 and the air nozzle 9.
9 is used to hold down the printed circuit board 7 from above in order to maintain a constant distance between the printed circuit board 7 and the adhesive application nozzle 10.
It is an air nozzle that blows out 2'r- toward the target.

上記の構成の接着剤の塗布装置について以下その動作を
説明する。The operation of the adhesive applicator having the above configuration will be described below.

接着剤塗布ノズル１０より接着剤がプリント基板７に塗
布された後、ノズルが上昇し、リミットスイッチ２が動
作し、その後タイマー６が動作しバルブ４を一定時間開
ける、この間、スピードコントローラ３からエアーノズ
ル９ヘエアーが送り出され、エアーノズル９からエアー
が吹き出され、接着塗布ノズル１０の接着剤の糸引きを
吹き飛ばす。After the adhesive is applied to the printed circuit board 7 by the adhesive application nozzle 10, the nozzle rises, the limit switch 2 operates, and then the timer 6 operates and the valve 4 is opened for a certain period of time. During this time, air is supplied from the speed controller 3. Air is sent to the nozzle 9, and the air is blown out from the air nozzle 9 to blow away the stringy adhesive from the adhesive application nozzle 10.

以上のように、本実施例によれば、接着剤の糸引きを防
止し、半田付は不良を防止することかできる。また接着
力の弱い接着剤を使用出来るため、部品の位置ずれを防
止し、プリント基板の品質向上１歩留まり向上に役立つ
ものである。As described above, according to this embodiment, it is possible to prevent the adhesive from becoming stringy and to prevent soldering defects. Furthermore, since adhesives with weak adhesive strength can be used, it is possible to prevent parts from shifting, which is useful for improving the quality and yield of printed circuit boards.

なお、エアーノズルが１個のものについて説明したが、
エアーノズルは複数個あっても同様に動作し、同し効果
が得られる。In addition, although we have explained the case with one air nozzle,
Even if there are multiple air nozzles, they operate in the same way and the same effect can be obtained.

発明の効果 以上のように、本発明の接着剤の塗布方法は、ディスペ
ンサー装置からプリント基板に接着剤を塗布後にエアー
ブローすることにより、接着剤の糸引きを防止する。そ
れにより半田付は不良や部品の位置ずれ等が全（無くな
り半田付けの品質向上１歩留まり向上、又、作業性の向
上に大いに役立つものである。Effects of the Invention As described above, the adhesive application method of the present invention prevents the adhesive from becoming stringy by air blowing after applying the adhesive from the dispenser device to the printed circuit board. As a result, defects in soldering, misalignment of parts, etc. are completely eliminated, which greatly contributes to improving the quality of soldering, increasing yield, and improving work efficiency.

特に本発明は、接着剤の選定が容易に行えるため実用上
きわめて有利である。In particular, the present invention is extremely advantageous in practice because adhesives can be easily selected.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例による接着剤の塗布方法に用
いる塗布装置の概略構成図、第２図はその塗布ノズル部
の詳細図、第３図は従来の接着剤の塗布方法の概略構成
図。 ２・・・・・・リミットスイッチ、３・・・・・・スピ
ードコントローラー　４・・・・・・バルブ、５・・・
・・・減圧弁、６・・・・・タイマー　７・・・・・・
プリント基板、８・・・・・・レベル、９・・・・・エ
アーノズル、１０・・・・・・塗布ノズル。 代理人の氏名　弁理士　粟野重孝　はか１名Ｚ−一−リ
ミットスイッチ ３−　スピードコンドローラ ４−・−バルブ Ｓ　＝−Ｘ五弁FIG. 1 is a schematic configuration diagram of a coating device used in an adhesive coating method according to an embodiment of the present invention, FIG. 2 is a detailed diagram of its coating nozzle, and FIG. 3 is a schematic diagram of a conventional adhesive coating method. Diagram. 2... Limit switch, 3... Speed controller 4... Valve, 5...
...Reducing valve, 6...Timer 7...
Printed circuit board, 8...level, 9...air nozzle, 10...coating nozzle. Name of agent: Patent attorney Shigetaka Awano 1 person Z-1-Limit switch 3-Speed controller 4--Valve S =-X 5 valves

Claims (1)

【特許請求の範囲】[Claims] ディスペンサーにより、接着剤塗布後、エアーブローす
ることを特徴とする接着剤の塗布方法。An adhesive application method characterized by applying an adhesive with a dispenser and then blowing with air.
JP2118892A 1990-05-08 1990-05-08 How to apply adhesive Pending JPH0440262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2118892A JPH0440262A (en) 1990-05-08 1990-05-08 How to apply adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2118892A JPH0440262A (en) 1990-05-08 1990-05-08 How to apply adhesive

Publications (1)

Publication Number Publication Date
JPH0440262A true JPH0440262A (en) 1992-02-10

Family

ID=14747737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2118892A Pending JPH0440262A (en) 1990-05-08 1990-05-08 How to apply adhesive

Country Status (1)

Country Link
JP (1) JPH0440262A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5652062B2 (en) * 1974-05-01 1981-12-09
JPS603200A (en) * 1983-06-20 1985-01-09 松下電器産業株式会社 Automatic part assembling machine
JPS6049966B2 (en) * 1979-12-07 1985-11-06 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション Magnetic recording reading method
JPS6431948A (en) * 1987-07-28 1989-02-02 Toshiba Tungaloy Co Ltd High strength sintered alloy
JPS6425664U (en) * 1986-10-28 1989-02-13

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5652062B2 (en) * 1974-05-01 1981-12-09
JPS6049966B2 (en) * 1979-12-07 1985-11-06 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション Magnetic recording reading method
JPS603200A (en) * 1983-06-20 1985-01-09 松下電器産業株式会社 Automatic part assembling machine
JPS6425664U (en) * 1986-10-28 1989-02-13
JPS6431948A (en) * 1987-07-28 1989-02-02 Toshiba Tungaloy Co Ltd High strength sintered alloy

Similar Documents

Publication Publication Date Title
JPH0440262A (en) How to apply adhesive
JPH0724390A (en) Device and method for applying liquid
JP3430864B2 (en) Transfer method of conductive ball
JPH06206031A (en) Viscous material coating apparatus and method
JPS6231839B2 (en)
JP2674582B2 (en) Flux coating device and coating method
KR100225892B1 (en) Soldering solvent application method
JPH06296074A (en) Wave soldering device
JP3906873B2 (en) Bump formation method
JP2000114702A (en) Method for fluxing
JPH10146558A (en) Adhesive coating method and coating device
JP2527452B2 (en) Soldering equipment
JPH10290066A (en) Part mounting method and equipment
JPH08153956A (en) Method and device for supplying solder to printed board
EP0525718A1 (en) Automatic soldering apparatus for printed wiring boards
JP2000022319A (en) Cream solder coater
JPH01162566A (en) Foaming flux coating device
JPH03101863A (en) Device for applying viscous material
JPH04130696A (en) Method of supplying cream solder to pattern mask
JPS63126668A (en) Solder paste coating device
JP2661549B2 (en) Electronic component mounting method
JP3062122B2 (en) Solder leveling device for printed wiring boards
JPH02237196A (en) Solder coating apparatus
JPH08222842A (en) Flux applicator
JPH0715130A (en) Soldering method