JPH0440277Y2 - - Google Patents
Info
- Publication number
- JPH0440277Y2 JPH0440277Y2 JP1986178957U JP17895786U JPH0440277Y2 JP H0440277 Y2 JPH0440277 Y2 JP H0440277Y2 JP 1986178957 U JP1986178957 U JP 1986178957U JP 17895786 U JP17895786 U JP 17895786U JP H0440277 Y2 JPH0440277 Y2 JP H0440277Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode pad
- connection
- conductive adhesive
- substrate
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
この考案は、電極パツドの構造に係り、導電性
接着剤、異方導電接着剤によつて接続される半導
体チツプ等の電極パツドに関する。[Detailed Description of the Invention] [Industrial Field of Application] This invention relates to the structure of an electrode pad, and relates to electrode pads for semiconductor chips, etc., connected by a conductive adhesive or an anisotropic conductive adhesive.
半導体チツプ、テープキヤリア、リードフレー
ム、FPC（フレキシブル・プリント・サーキツ
ト）、PWB（プリンテツト・ワイヤー・ボード）
液晶パネル、或いは、配線パターンをそなえた基
板等には、電気的な接続のために、電極接続部
（以下電極パツドという）が設けられる。
Semiconductor chips, tape carriers, lead frames, FPCs (flexible printed circuits), PWBs (printed wire boards)
A liquid crystal panel, a substrate provided with a wiring pattern, or the like is provided with an electrode connection portion (hereinafter referred to as an electrode pad) for electrical connection.
近年、このような電極パツドの接続に、異方導
電接着剤を用いるものが提案されている。 In recent years, it has been proposed to use an anisotropic conductive adhesive to connect such electrode pads.
第２図は、異方導電接着剤を用いた従来例を示
すものである。 FIG. 2 shows a conventional example using an anisotropic conductive adhesive.
第２図Ａは、接着前の状態を示し、第２図Ｂは
接着後の状態を示している。図において１１，１
１′は基板であり、１２，１２′はそれぞれこの基
板上に設けられている電極パツドである。この基
板１１，１１′の電極パツド１２，１２′を対向さ
せ、その間に異方導電接着剤２０を挟む（第２図
Ａ）。次に、これを加熱加圧し、両者を接着せし
める（第２図Ｂ）。 FIG. 2A shows the state before adhesion, and FIG. 2B shows the state after adhesion. 11,1 in the figure
1' is a substrate, and 12 and 12' are electrode pads provided on this substrate, respectively. The electrode pads 12 and 12' of the substrates 11 and 11' are opposed to each other, and an anisotropically conductive adhesive 20 is sandwiched between them (FIG. 2A). Next, this is heated and pressurized to bond the two together (FIG. 2B).
異方導電接着剤２０は、例えば粒径のそろつた
導電性粒子２１を熱可塑性絶縁性樹脂２２中に分
散させたものである。 The anisotropic conductive adhesive 20 is, for example, one in which conductive particles 21 of uniform particle size are dispersed in a thermoplastic insulating resin 22.
加熱加圧することにより、絶縁性の樹脂２２は
流動し、電極１２，１２′間の導電性粒子が、両
電極間を短絡する。 By applying heat and pressure, the insulating resin 22 flows, and the conductive particles between the electrodes 12 and 12' short-circuit the two electrodes.
図で横方向には、各導電性粒子は、絶縁性樹脂
２２によつて互いに絶縁せられることとなり、電
極１２，１２′間のみの接続が行われることとな
る。 In the lateral direction in the figure, the conductive particles are insulated from each other by the insulating resin 22, and connection is made only between the electrodes 12 and 12'.
ところが、この場合、第２図Ｂに示すように、
空気層２４ができたり、或いは、導電性粒子２１
と電極パツド１２との間に、絶縁性接着剤が残留
した残留部２３ができ、接続抵抗が高くなつてし
まいまた、電流容量が減少するという問題点が生
ずる。
However, in this case, as shown in Figure 2B,
An air layer 24 is formed, or the conductive particles 21
A residual portion 23 where the insulating adhesive remains is formed between the electrode pad 12 and the electrode pad 12, resulting in an increase in connection resistance and a decrease in current capacity.
また、パツド間の電気特性がバラツクこと、通
電時の発熱や、冷熱試験により電気特性が変化す
ること、等電気的接続の信頼性が低いという問題
点を有している。 Further, there are problems in that the reliability of the electrical connection is low, such as variations in electrical characteristics between the pads, heat generation during energization, and changes in electrical characteristics due to thermal testing.
さらに、熱圧着条件等の接続条件の範囲が狭
く、また膜厚や接着剤の塗布条件範囲が狭いとい
う問題点をも有している。 Furthermore, there are also problems in that the range of connection conditions such as thermocompression bonding conditions is narrow, and the range of film thickness and adhesive application conditions is also narrow.
このような問題点は、半導体チツプの実装等、
多端子で接続面積の小さい部品の接続において、
重大な障害となる。 These problems arise when mounting semiconductor chips, etc.
When connecting components with multiple terminals and a small connection area,
This is a serious obstacle.
この考案は、このような点に鑑みてなされたも
のであり、前述のような空気層のない、また、導
電性粒子のパツドへの接続部における絶縁性樹脂
の残留部のない接続を可能とする電極パツドを提
供することを目的とする。 This idea was made in consideration of these points, and it is possible to make a connection without the above-mentioned air space and without residual insulating resin at the connection part of the conductive particles to the pad. The purpose is to provide an electrode pad that
この考案においては、電極パツド表面に溝を形
成することにより、絶縁性樹脂中の空気のヌケを
良好にし、かつ、絶縁性樹脂の流動を良くして、
完全な接続を実現する。
In this invention, by forming grooves on the surface of the electrode pad, air in the insulating resin is better removed, and the insulating resin flows better.
Achieve complete connectivity.
第１図はこの考案の実施例を示し、第１図Ａ
は、断面図、第１図Ｂは平面図を示す。
Figure 1 shows an embodiment of this invention, and Figure 1A
1B shows a cross-sectional view, and FIG. 1B shows a plan view.
図において、１１は基板であり、基板１１上に
は、配線パターン１３とその先端部に形成された
電極パツド１２が設けられている。そして、電極
パツド１２表面には、溝１０が設けられている。 In the figure, 11 is a substrate, and on the substrate 11, a wiring pattern 13 and an electrode pad 12 formed at the tip thereof are provided. A groove 10 is provided on the surface of the electrode pad 12.
溝１０は、例えば、エツチングにより設ければ
良く、その形状は、第１図に示すような五盤の目
状の外、任意の形状が採用できる。また、溝１０
としては、図示のような断面Ｖ字状に限らず、凹
状にしても良い。これら溝１０の形状、或いは、
本数、レイアウト等は、いずれも、電極パツドの
材質、面積、厚さ、接着剤の種類、塗布厚、粒
度、接続条件等の種々の条件、目的、電気的要求
仕様に応じて設計すれば良い。 The groove 10 may be provided, for example, by etching, and its shape may be any shape other than the five-disk shape shown in FIG. Also, groove 10
The cross section is not limited to a V-shaped cross section as shown in the figure, but may be concave. The shape of these grooves 10, or
The number, layout, etc. can be designed according to various conditions such as electrode pad material, area, thickness, adhesive type, coating thickness, particle size, connection conditions, purpose, and electrical requirement specifications. .
また、前記溝の形成は、上下電極パツドの両方
或いはいずれか一方であつて良い。 Furthermore, the grooves may be formed in either or both of the upper and lower electrode pads.
このように、溝が設けられた電極パツドを用い
ると、絶縁性樹脂中の空気層は、加熱加圧時に前
記溝を介して容易に外に抜けることができ、ま
た、電極パツド−導電粒子間の樹脂も容易に流動
して、そこに残留することもなくなる。
In this way, when an electrode pad provided with a groove is used, the air layer in the insulating resin can easily escape through the groove when heated and pressurized, and the air layer between the electrode pad and the conductive particles can be easily removed. The resin also flows easily and no longer remains there.
したがつて、電極パツドの接続は、完全とな
り、信頼性の高い接続（実装）が実現できる。 Therefore, the connection of the electrode pads is perfect, and highly reliable connection (mounting) can be achieved.
第１図は、この考案の実施例を示す図、第２図
は、従来例を示す図である。
１０……溝、１１……基板、１２……電極パツ
ド部、１３……配線パターン。
FIG. 1 is a diagram showing an embodiment of this invention, and FIG. 2 is a diagram showing a conventional example. 10...Groove, 11...Substrate, 12...Electrode pad portion, 13...Wiring pattern.
Claims (1)
れる半導体チツプ、基板等の電極パツドにおい
て、前記電極パツド部表面に溝を形成したことを
特徴とする電極パツド。 1. An electrode pad for a semiconductor chip, a substrate, etc. that is bonded with a conductive adhesive such as an anisotropic conductive adhesive, characterized in that a groove is formed on the surface of the electrode pad portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986178957U JPH0440277Y2 (en) | 1986-11-20 | 1986-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986178957U JPH0440277Y2 (en) | 1986-11-20 | 1986-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6384941U JPS6384941U (en) | 1988-06-03 |
| JPH0440277Y2 true JPH0440277Y2 (en) | 1992-09-21 |
Family
ID=31121578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986178957U Expired JPH0440277Y2 (en) | 1986-11-20 | 1986-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440277Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000058205A1 (en) * | 1999-03-31 | 2000-10-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4739895B2 (en) * | 2005-09-30 | 2011-08-03 | オプトレックス株式会社 | Semiconductor integrated circuit |
-
1986
- 1986-11-20 JP JP1986178957U patent/JPH0440277Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000058205A1 (en) * | 1999-03-31 | 2000-10-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
| US6601947B1 (en) | 1999-03-31 | 2003-08-05 | Seiko Epson Corporation | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
| CN1298612C (en) * | 1999-03-31 | 2007-02-07 | 精工爱普生株式会社 | Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink-jet head, ink-jet printer, micromachine, liquid crystal panel, and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6384941U (en) | 1988-06-03 |
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