JPH0440501U - - Google Patents

Info

Publication number
JPH0440501U
JPH0440501U JP8173590U JP8173590U JPH0440501U JP H0440501 U JPH0440501 U JP H0440501U JP 8173590 U JP8173590 U JP 8173590U JP 8173590 U JP8173590 U JP 8173590U JP H0440501 U JPH0440501 U JP H0440501U
Authority
JP
Japan
Prior art keywords
ceramic substrate
plastic case
bonded
variable resistor
buffering agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8173590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8173590U priority Critical patent/JPH0440501U/ja
Publication of JPH0440501U publication Critical patent/JPH0440501U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図乃至第2図は本考案による一実施例を示
し、第1図A,Bはそれぞれチツプ型可変抵抗器
の平面図、正面図、第2図は、プラスチツクケー
スと本考案による接着剤及びセラミツク基板の接
着状態での拡大説明図である。 1……プラスチツクケース、2……セラミツク
基板、3……導電パターン部、4……緩衝剤入り
接着剤。
1 and 2 show an embodiment according to the present invention, FIGS. 1A and 2B are a plan view and a front view of a chip-type variable resistor, respectively, and FIG. 2 shows a plastic case and an adhesive according to the present invention. and FIG. 6 is an enlarged explanatory view of the ceramic substrate in a bonded state. DESCRIPTION OF SYMBOLS 1... Plastic case, 2... Ceramic substrate, 3... Conductive pattern part, 4... Adhesive containing buffering agent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミツク基板2とプラスチツクケース1とが
接合される構造の可変抵抗器において、前記セラ
ミツク基板2とプラスチツクケース1とが緩衝剤
入りのエポキシ接着剤4により接合されたことを
特徴とする可変抵抗器。
1. A variable resistor having a structure in which a ceramic substrate 2 and a plastic case 1 are bonded, characterized in that the ceramic substrate 2 and the plastic case 1 are bonded by an epoxy adhesive 4 containing a buffering agent.
JP8173590U 1990-08-02 1990-08-02 Pending JPH0440501U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8173590U JPH0440501U (en) 1990-08-02 1990-08-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8173590U JPH0440501U (en) 1990-08-02 1990-08-02

Publications (1)

Publication Number Publication Date
JPH0440501U true JPH0440501U (en) 1992-04-07

Family

ID=31627936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8173590U Pending JPH0440501U (en) 1990-08-02 1990-08-02

Country Status (1)

Country Link
JP (1) JPH0440501U (en)

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