JPH0440520U - - Google Patents
Info
- Publication number
- JPH0440520U JPH0440520U JP8304490U JP8304490U JPH0440520U JP H0440520 U JPH0440520 U JP H0440520U JP 8304490 U JP8304490 U JP 8304490U JP 8304490 U JP8304490 U JP 8304490U JP H0440520 U JPH0440520 U JP H0440520U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- tip
- lead frame
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は、本考案の一実施例を示すリードフレ
ームの平面図、第２図及び第３図は、同リードフ
レームでセラミツク素体を挟持した状態の例を示
す側面図、第４図は、他の実施例を示すリードフ
レームの平面図、第５図は、同リードフレームを
用いてチツプ形電子部品を構成した例を示す外装
樹脂を透視した斜視図、第６図は、従来のリード
線の集合体を示す平面図、第７図は、同リード線
の集合体を用いて製造されたラジアルリード形電
子部品を示す外装被覆を透視して示した正面図で
ある。
１……連結帯、２，３……リード、６，７……
リードの先端部、８……セラミツク素体。
FIG. 1 is a plan view of a lead frame showing an embodiment of the present invention, FIGS. 2 and 3 are side views showing an example of a state in which a ceramic body is held between the lead frame, and FIG. , a plan view of a lead frame showing another embodiment, FIG. 5 is a perspective view of an example of a chip-shaped electronic component constructed using the same lead frame, seen through the exterior resin, and FIG. 6 is a plan view of a conventional lead frame. FIG. 7 is a plan view showing the wire assembly, and is a front view seen through the exterior covering of a radial lead type electronic component manufactured using the lead wire assembly. 1... Connecting band, 2, 3... Lead, 6, 7...
Lead tip, 8... Ceramic body.
Claims (1)
ド２，３を具備する平板状のリードフレームであ
つて、 該一対のリード２，３は先端側で互いに内側に
屈曲され、 該リード２，３の先端部６，７は同心状に位置
する円形あるいは楕円形であり、 一方のリード２の先端部６が他方のリード３の
先端部７を取り囲んでいることを特徴とするリー
ドフレーム。[Claims for Utility Model Registration] A flat lead frame comprising a plurality of pairs of leads 2 and 3 led out from a connecting band 1 at equal intervals, the pair of leads 2 and 3 being inside each other on the tip side. The tips 6 and 7 of the leads 2 and 3 are circular or elliptical and are located concentrically, and the tip 6 of one lead 2 surrounds the tip 7 of the other lead 3. A lead frame featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8304490U JPH0440520U (en) | 1990-08-04 | 1990-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8304490U JPH0440520U (en) | 1990-08-04 | 1990-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440520U true JPH0440520U (en) | 1992-04-07 |
Family
ID=31630386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8304490U Pending JPH0440520U (en) | 1990-08-04 | 1990-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440520U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136461A1 (en) * | 2007-04-27 | 2008-11-13 | Nec Corporation | Wide band capacity element |
-
1990
- 1990-08-04 JP JP8304490U patent/JPH0440520U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136461A1 (en) * | 2007-04-27 | 2008-11-13 | Nec Corporation | Wide band capacity element |
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