JPH0440537U - - Google Patents
Info
- Publication number
- JPH0440537U JPH0440537U JP8154990U JP8154990U JPH0440537U JP H0440537 U JPH0440537 U JP H0440537U JP 8154990 U JP8154990 U JP 8154990U JP 8154990 U JP8154990 U JP 8154990U JP H0440537 U JPH0440537 U JP H0440537U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor device
- groove
- pad portion
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案による半導体装置の一例を示す
平面図、第２図は第１図のＡ−Ａ線上の断面図、
第３図は第１図のＢ−Ｂ線上の断面図、第４図は
本考案の半導体装置の製造中の平面図、第５図は
従来の半導体装置の構成図である。
１１はダイパツド部、１２はダイパツド吊り部
、１５は凹溝、１７はＩＣチツプ、２０は熱可塑
性樹脂、２２はモールドパツケージである。
FIG. 1 is a plan view showing an example of a semiconductor device according to the present invention, FIG. 2 is a cross-sectional view taken along line A-A in FIG. 1,
3 is a sectional view taken along the line B--B in FIG. 1, FIG. 4 is a plan view of the semiconductor device of the present invention during manufacture, and FIG. 5 is a configuration diagram of a conventional semiconductor device. 11 is a die pad part, 12 is a die pad hanging part, 15 is a groove, 17 is an IC chip, 20 is a thermoplastic resin, and 22 is a mold package.
Claims (1)
に配し、樹脂モールドしてなる半導体装置におい
て、 上記ダイパツド部及びダイパツド吊り部の裏面
に凹溝が設けられ、 該凹溝内に熱可塑性樹脂が充填されて成る半導
体装置。[Scope of Claim for Utility Model Registration] A semiconductor device in which a semiconductor element is disposed on a die pad portion of a lead frame and molded with resin, wherein a groove is provided on the back surface of the die pad portion and the die pad hanging portion, and within the groove. A semiconductor device that is filled with thermoplastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8154990U JPH0440537U (en) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8154990U JPH0440537U (en) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440537U true JPH0440537U (en) | 1992-04-07 |
Family
ID=31627600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8154990U Pending JPH0440537U (en) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440537U (en) |
-
1990
- 1990-07-31 JP JP8154990U patent/JPH0440537U/ja active Pending