JPH0440569U - - Google Patents
Info
- Publication number
- JPH0440569U JPH0440569U JP8301190U JP8301190U JPH0440569U JP H0440569 U JPH0440569 U JP H0440569U JP 8301190 U JP8301190 U JP 8301190U JP 8301190 U JP8301190 U JP 8301190U JP H0440569 U JPH0440569 U JP H0440569U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounting surface
- printed circuit
- component mounting
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 2
- 230000005496 eutectics Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例によるプリント基
板冷却装置を示す斜視図、第２図は第１図の動作
を説明する説明図、第３図は従来のプリント基板
冷却装置を示す斜視図である。
図中、１は自動はんだ付装置、２ははんだ槽、
３はセンサー、４はセンサーフレーム、５はプリ
ント基板、６はエアーレギユレータ、７は電磁バ
ルブ、８はエアーバルブ、９，１０はエアーナイ
フ、１１はアーム、１２は搬送レール、１３は高
さ調整ネジ、１４は制御盤（シーケンサ）である
。なお、図中同一符号は同一又は相当部分を示す
。
FIG. 1 is a perspective view showing a printed circuit board cooling device according to an embodiment of the invention, FIG. 2 is an explanatory diagram explaining the operation of FIG. 1, and FIG. 3 is a perspective view showing a conventional printed circuit board cooling device. be. In the figure, 1 is an automatic soldering device, 2 is a soldering bath,
3 is a sensor, 4 is a sensor frame, 5 is a printed circuit board, 6 is an air regulator, 7 is an electromagnetic valve, 8 is an air valve, 9 and 10 are air knives, 11 is an arm, 12 is a transport rail, 13 is a height The adjustment screw 14 is a control panel (sequencer). Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
付けにおいて、部品実装面に表面実装部品が既に
はんだ付されている場合に、部品実装面の温度を
はんだの共晶点以下とし、部品実装面の表面実装
部品のはんだを溶かさないことを特徴とするプリ
ント基板冷却装置。 When soldering a printed circuit board using an automatic soldering machine, if a surface mount component is already soldered on the component mounting surface, the temperature of the component mounting surface is set to be below the eutectic point of the solder, and the surface mount component on the component mounting surface is A printed circuit board cooling device that does not melt solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083011U JP2506695Y2 (en) | 1990-08-04 | 1990-08-04 | Printed circuit board cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990083011U JP2506695Y2 (en) | 1990-08-04 | 1990-08-04 | Printed circuit board cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0440569U true JPH0440569U (en) | 1992-04-07 |
| JP2506695Y2 JP2506695Y2 (en) | 1996-08-14 |
Family
ID=31630323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990083011U Expired - Lifetime JP2506695Y2 (en) | 1990-08-04 | 1990-08-04 | Printed circuit board cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506695Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63149070A (en) * | 1986-12-11 | 1988-06-21 | Toshiba Corp | Soldering device |
| JPS63268563A (en) * | 1977-12-02 | 1988-11-07 | クーパー インダストリーズ，インコーポレーテッド | Device for matrix-binding printed wiring circuit board by solder |
| JPH01181966A (en) * | 1988-01-13 | 1989-07-19 | Matsushita Electric Ind Co Ltd | Substrate heating device |
-
1990
- 1990-08-04 JP JP1990083011U patent/JP2506695Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63268563A (en) * | 1977-12-02 | 1988-11-07 | クーパー インダストリーズ，インコーポレーテッド | Device for matrix-binding printed wiring circuit board by solder |
| JPS63149070A (en) * | 1986-12-11 | 1988-06-21 | Toshiba Corp | Soldering device |
| JPH01181966A (en) * | 1988-01-13 | 1989-07-19 | Matsushita Electric Ind Co Ltd | Substrate heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2506695Y2 (en) | 1996-08-14 |
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