JPH0440573U - - Google Patents
Info
- Publication number
- JPH0440573U JPH0440573U JP8146890U JP8146890U JPH0440573U JP H0440573 U JPH0440573 U JP H0440573U JP 8146890 U JP8146890 U JP 8146890U JP 8146890 U JP8146890 U JP 8146890U JP H0440573 U JPH0440573 U JP H0440573U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- board
- notch
- moisture
- harness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004382 potting Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例を示す構成図、第２図
は従来の防湿型筺体の断面図である。
図中、１は筺体、２は基板、３はハーネス、６
はポツテイング材、７は切欠き、８は突部である
。
FIG. 1 is a configuration diagram showing an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional moisture-proof type housing. In the figure, 1 is the housing, 2 is the board, 3 is the harness, and 6
7 is a potting material, 7 is a notch, and 8 is a protrusion.
Claims (1)
した回路基板２を収容し、更に該筺体内にポツテ
イング材６を充填して該基板の周囲を覆う防湿型
筺体において、 前記基板のハーネス接続端とは逆側に切欠き７
を形成し、 且つ前記筺体の内壁には該切欠きに係合する突
部８を形成してなることを特徴とする防湿型筺体
。[Claims for Utility Model Registration] A moisture-proof type in which a circuit board 2 with a harness 3 connected to one end is housed inside a box-shaped casing 1, and a potting material 6 is filled inside the casing to cover the periphery of the board. In the housing, a notch 7 is provided on the opposite side of the board from the harness connection end.
A moisture-proof casing, characterized in that a protrusion 8 is formed on an inner wall of the casing to engage with the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990081468U JP2519160Y2 (en) | 1990-07-31 | 1990-07-31 | Moisture-proof housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990081468U JP2519160Y2 (en) | 1990-07-31 | 1990-07-31 | Moisture-proof housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0440573U true JPH0440573U (en) | 1992-04-07 |
| JP2519160Y2 JP2519160Y2 (en) | 1996-12-04 |
Family
ID=31627440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990081468U Expired - Lifetime JP2519160Y2 (en) | 1990-07-31 | 1990-07-31 | Moisture-proof housing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519160Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012508374A (en) * | 2008-11-10 | 2012-04-05 | イートン コーポレーション | Pressure sensing module with integrated seal plate and method of assembling a pressure sensing module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318069A (en) * | 1986-07-09 | 1988-01-25 | Matsushita Electric Ind Co Ltd | Sputtering method |
-
1990
- 1990-07-31 JP JP1990081468U patent/JP2519160Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6318069A (en) * | 1986-07-09 | 1988-01-25 | Matsushita Electric Ind Co Ltd | Sputtering method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012508374A (en) * | 2008-11-10 | 2012-04-05 | イートン コーポレーション | Pressure sensing module with integrated seal plate and method of assembling a pressure sensing module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519160Y2 (en) | 1996-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |