JPH0441046B2 - - Google Patents
Info
- Publication number
- JPH0441046B2 JPH0441046B2 JP58084347A JP8434783A JPH0441046B2 JP H0441046 B2 JPH0441046 B2 JP H0441046B2 JP 58084347 A JP58084347 A JP 58084347A JP 8434783 A JP8434783 A JP 8434783A JP H0441046 B2 JPH0441046 B2 JP H0441046B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- blended
- glass
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
- B29C70/504—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC] using rollers or pressure bands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/06—Unsaturated polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/10—Copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
Description
〔技術分野〕
本発明は、連続成形工法におけるプリント配線
板用の積層板の製造法に関するものである。
〔背景技術〕
プリント配線板の絶縁基板となる積層板を成形
するにあたつて、近時連続成形工法が注目されて
いる。すなわち従来は長尺を基板に熱硬化性樹脂
ワニスを連続的に含浸せしめてこれを乾燥し、次
でこの樹脂含浸基材を所定寸法に切断したのち、
これを複数枚重ねると共にさらに銅箔などの金属
箔を重ね、この積層物を熱盤間で加熱加圧するこ
とにより、積層板の成形を行なうようにしていた
が、これでは成形がバツチ単位となつて連続的な
成形が行なえず、生産能率が非常に悪いものであ
る。そこで、長尺の基材に熱硬化性樹脂液を含浸
させたのちこの樹脂含浸基材をロール間に通して
複数枚重ねて長尺の積層基材とするとともにこれ
に長尺の金属箔を重ね、これを連続的にキユア炉
に通して加熱することにより熱硬化性樹脂を硬化
させて連続的に生産能率よく積層板の成形を行な
うものである。しかしながらこの連続工法におい
ては樹脂の硬化は従来のようにプレスを伴なわず
キユア炉における加熱によつてなされるため、縮
合系の樹脂など硬化時にガスを発生する樹脂は適
していず、不飽和ポリエステル樹脂やビニルエス
テル樹脂など不飽和樹脂がよく用いられる。そし
て基材としてガラスクロスやガラスペーパーなど
ガラス器材を使用する場合、ガラス基材と不飽和
樹脂との接着性が悪く、基材間に層間剥離が生じ
るという問題があつた。そこで、不飽和樹脂の替
りにガラスとの接着性が良好なエポキシ樹脂を用
いることが検討されるが、エポキシ樹脂は反応速
度が遅くラインスピードを上げることができない
ものであつて連続成形法によるメリツトが生きて
こない問題がある。また速硬化のエポキシ樹脂に
おいては樹脂のポツトライフに問題があると共に
得られる積層板における耐熱性や電気特性など性
能が不十分であるという問題がある。
〔発明の目的〕
本発明は上記の点に鑑みてなされたものであつ
て、不飽和樹脂を使用しつつガラス基材の層間接
着性を向上させることができる積層板の製造法を
提供することを目的とするものである。
〔発明の開示〕
しかして本発明に係る積層板の製造法は、ガラ
ス基材を少なくとも一枚含む複数枚の基材を連続
的に送つて、不飽和樹脂に硬化剤入りのエポキシ
樹脂を配合して調製したブレンド樹脂液をこの各
基材に含浸させ、この複数枚の樹脂含浸基材を重
ねてロール間に通すことにより積層基材を形成
し、次でこの積層基材の各樹脂を硬化させること
を特徴とするもので、以下本発明を詳細に説明す
る。
基材１としては複数枚の長尺のものを用いる
が、複数枚の基材１のうち少なくとも一枚はガラ
スクロスやガラスペーパーなどガラス基材を用い
る。通常は全てガラス基材であるが、紙基材が含
まれてもよいという意味である。この基材１はロ
ール２に巻き取つて使用される。また、基材１に
含浸させる樹脂としては不飽和ポリエステル樹脂
やビニルエステル樹脂などの不飽和樹脂を用いる
が、これに難燃剤や充填剤としてSb2O3、Al2
（OH）3、CaCO3等、改質剤としてポリブタジエ
ン等が配合されてあつてもよい。そしてこの樹脂
にエポキシ樹脂を配合してブレンド樹脂液を調製
するが、このエポキシ樹脂としては特に限定され
るものではないが低分子量で無溶剤液状のものが
好ましい。難燃化を行なうためにはブロム化エポ
キシ樹脂を用いるのがよい。ブレンド樹脂液には
エポキシ樹脂の硬化剤も配合されるが、この硬化
剤としては酸無水物が特に好ましく、芳香族アミ
ンなど一部のアミン類も使用することができる。
例えばヘキサヒドロ無水フタル酸、無水メチルナ
ジツク酸、ジアミノジフエニルスルホン、ジアミ
ノジフエニルメタン、２−メチル−４−メチルイ
ミダゾールなどである。さらにブレンド樹脂液に
はエポキシ樹脂の硬化促進剤も配合されるもの
で、硬化促進剤としてはベンジルジメチルアミン
や２−エチル−４−メチルイミダゾールなど一般
的な第３アミンを用いることができる。ブレンド
樹脂液において不飽和樹脂とエポキシ樹脂との配
合割合は、重量比で不飽和樹脂／エポイキシ樹脂
＝95／５〜10／90が好ましく、特に90／10〜50／
50のものが好ましい。しかして添付図に示すよう
に複数枚の基材１をロール２より連続的に繰り出
して、樹脂含浸槽３内に浸漬させる。樹脂含浸槽
３内には上記したブレンド樹脂液が充満させてあ
る。そしてこのように樹脂含浸槽３内に基材１を
浸漬させて基材１にブレンド樹脂液を含浸させ
る。含浸は樹脂量が50重量％程度になるように行
なうのが好ましい。次でブレンド樹脂液を含浸し
た複数枚の樹脂含浸基材４を重ねてロール５，５
間に通すことにより、余分なブレンド樹脂液をス
クイズしながら樹脂含浸基材４を複数枚圧着さ
せ、このように複数枚の樹脂含浸基材４を積層し
た積層基材６にさらにロール７に巻かれた長尺の
銅箔８を繰り出しつつラミネートロール９，９に
よつて重ねて圧着する。銅箔８のラミネートは、
樹脂含浸基材４をロール５，５に通す際に同時に
銅箔８を通して行なうようにしてもよい。このの
ち、銅箔８をラミネートした積層基材６をキユア
炉１０に導入して積層基材６中の不飽和樹脂とエ
ポキシ樹脂を無圧下で加熱硬化させる。このよう
にキユア炉１０で加熱硬化を行なつたのち、冷却
機１１で冷却してカツター１２で切断を行なうこ
とにより、銅張りの積層板Ａを得るものである。
必要に応じてこの積層板Ａをアフターキユアする
ことも行なわれる。
次に本発明を実施例によつて具体的に説明す
る。
実施例 １
プロピレングリコール、無水フタル酸、無水マ
レイン酸より合成し、熱変形温度100℃、スチレ
ン30重量％含有の積層板用不飽和ポリエステル樹
脂に硬化開始剤としてベンジルパーオキサイドを
１重量％配合した。そしてこの不飽和ポリエステ
ル樹脂液100重量部に対して、エポキシ樹脂（エ
ピクロン825；大日本インキ化学工業株式会社製）
100重量部、ヘキサヒドロ無水フタル酸80重量部
及びベンジルジメチルアミン１重量部を配合して
調製したエポキシ樹脂液を10重量部混合すること
により、ブレンド樹脂液を調製した。一方、基材
としてはガラスクロス（日東紡績株式会社製WE
−18K−BS）２枚とガラスペーパー（日本バイ
リーン株式会社製Ep−4060）２枚を組み合わせ、
ガラスクロス間にガラスペーパーがサンドイツチ
されるようにして用い、添付図における工程によ
つて成形を行なつて厚さ1.6mmの銅張り積層板を
得た。尚、硬化条件は120℃、10分、アフターキ
ユアの硬化条件は180℃、30分で行なつた。
実施例 ２〜５
不飽和ポリエステル樹脂とエポキシ樹脂との配
合割合を次表のように設定し、エポキシ樹脂の配
合を次表のように設定した他は実施例１と同様に
して銅張り積層板を得た。
実施例 ６
不飽和ポリエステル樹脂とエポキシ樹脂との配
合割合及びエポキシ樹脂の配合を次表のように設
定し、さらに基材としてガラスクロスを６枚用い
るようにした他は実施例１と同様にして銅張り積
層板を得た。
従来例
エポキシ樹脂を用いない他は実施例１と同様に
して銅張り積層板を得た。
上記実施例１〜６及び従来例によつて得た銅張
り積層板の特性を次表に示す。尚、次表において
HHPAはヘキサヒドロ無水フタル酸、BDMAは
ベンジルジメチルアミン、NMAはメチルナジツ
ク酸無水物、DDMはジアミノジフエニルメタ
ン、2E4MZは２−エチル−４−メチルイミダゾ
ールを示す。
[Technical Field] The present invention relates to a method for manufacturing a laminate for a printed wiring board using a continuous molding method. [Background Art] Continuous molding methods have recently been attracting attention when molding laminates that serve as insulating substrates for printed wiring boards. That is, in the past, a long substrate was continuously impregnated with a thermosetting resin varnish, dried, and then the resin-impregnated substrate was cut to a predetermined size.
Laminated plates were formed by stacking multiple sheets of this, then layering metal foil such as copper foil, and heating and pressing this laminate between hot platens, but with this method, forming was done in batches. Therefore, continuous molding cannot be performed, and production efficiency is extremely low. Therefore, after impregnating a long base material with a thermosetting resin liquid, multiple sheets of this resin-impregnated base material are passed between rolls and stacked to form a long laminated base material, and a long metal foil is attached to this base material. The thermosetting resin is cured by stacking the sheets and heating them in a curing furnace, thereby continuously forming a laminate with high production efficiency. However, in this continuous method, the resin is cured by heating in a curing furnace without pressing as in the past, so resins that generate gas during curing, such as condensation resins, are not suitable, and unsaturated polyester resins are not suitable. Unsaturated resins such as resins and vinyl ester resins are often used. When glass equipment such as glass cloth or glass paper is used as a base material, there is a problem in that the adhesion between the glass base material and the unsaturated resin is poor and delamination occurs between the base materials. Therefore, the use of epoxy resins that have good adhesion to glass instead of unsaturated resins is being considered, but epoxy resins have a slow reaction rate and cannot be increased in line speed, and the continuous molding method has no merit. There is a problem that does not survive. Furthermore, fast-curing epoxy resins have problems in the pot life of the resin and in the resulting laminates, which have insufficient performance such as heat resistance and electrical properties. [Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing a laminate that can improve interlayer adhesion of a glass substrate while using an unsaturated resin. The purpose is to [Disclosure of the Invention] However, the method for manufacturing a laminate according to the present invention involves continuously feeding a plurality of base materials including at least one glass base material, and blending an epoxy resin containing a curing agent into an unsaturated resin. Each of these base materials is impregnated with the blended resin liquid prepared by the above process, and a laminated base material is formed by stacking the plurality of resin-impregnated base materials and passing them between rolls. Next, each resin of this laminated base material is This invention is characterized in that it is cured, and the present invention will be explained in detail below. A plurality of elongated substrates 1 are used as the substrate 1, and at least one of the plurality of substrates 1 is a glass substrate such as glass cloth or glass paper. Usually all glass substrates, but it is meant that paper substrates may also be included. This base material 1 is wound onto a roll 2 and used. Further, as the resin impregnated into the base material 1, an unsaturated resin such as an unsaturated polyester resin or a vinyl ester resin is used, and Sb 2 O 3 or Al 2 is added as a flame retardant or filler.
(OH) 3 , CaCO 3 , etc., and polybutadiene as a modifier may be blended. Then, an epoxy resin is blended with this resin to prepare a blended resin liquid. Although the epoxy resin is not particularly limited, it is preferably a low molecular weight, solvent-free liquid. In order to achieve flame retardancy, it is preferable to use a brominated epoxy resin. A curing agent for the epoxy resin is also blended into the blended resin liquid, and as this curing agent, acid anhydrides are particularly preferred, and some amines such as aromatic amines can also be used.
Examples include hexahydrophthalic anhydride, methylnadic anhydride, diaminodiphenyl sulfone, diaminodiphenylmethane, and 2-methyl-4-methylimidazole. Furthermore, a curing accelerator for the epoxy resin is also blended into the blended resin liquid, and a common tertiary amine such as benzyldimethylamine or 2-ethyl-4-methylimidazole can be used as the curing accelerator. The blending ratio of unsaturated resin and epoxy resin in the blend resin liquid is preferably unsaturated resin/epoxy resin = 95/5 to 10/90 in weight ratio, particularly 90/10 to 50/
50 is preferred. As shown in the attached drawing, a plurality of base materials 1 are continuously unwound from a roll 2 and immersed in a resin impregnation tank 3. The resin impregnation tank 3 is filled with the blended resin liquid described above. In this manner, the base material 1 is immersed in the resin impregnation tank 3 to impregnate the base material 1 with the blended resin liquid. The impregnation is preferably carried out so that the amount of resin is approximately 50% by weight. Next, a plurality of resin-impregnated base materials 4 impregnated with the blended resin liquid are stacked and rolled into rolls 5 and 5.
A plurality of resin-impregnated base materials 4 are pressed together while squeezing excess blended resin liquid, and the laminated base material 6 in which a plurality of resin-impregnated base materials 4 are laminated in this way is further wound around a roll 7. The long length of copper foil 8 that has been cut is rolled out and is overlapped and crimped by laminating rolls 9,9. The laminate of copper foil 8 is
When the resin-impregnated base material 4 is passed through the rolls 5, 5, the copper foil 8 may be passed at the same time. Thereafter, the laminated base material 6 laminated with the copper foil 8 is introduced into a curing furnace 10, and the unsaturated resin and epoxy resin in the laminated base material 6 are heated and cured under no pressure. After heating and curing in the cure furnace 10, the copper-clad laminate A is obtained by cooling with the cooler 11 and cutting with the cutter 12.
If necessary, this laminate A is also subjected to after-curing. Next, the present invention will be specifically explained using examples. Example 1 An unsaturated polyester resin for laminates synthesized from propylene glycol, phthalic anhydride, and maleic anhydride, having a heat distortion temperature of 100°C and containing 30% by weight of styrene was blended with 1% by weight of benzyl peroxide as a curing initiator. . Then, for 100 parts by weight of this unsaturated polyester resin liquid, epoxy resin (Epicron 825; manufactured by Dainippon Ink and Chemicals Co., Ltd.)
A blended resin liquid was prepared by mixing 10 parts by weight of an epoxy resin liquid prepared by blending 100 parts by weight of hexahydrophthalic anhydride, 80 parts by weight of hexahydrophthalic anhydride, and 1 part by weight of benzyldimethylamine. On the other hand, glass cloth (WE manufactured by Nittobo Co., Ltd.) is used as a base material.
-18K-BS) and two glass papers (Nippon Vilene Co., Ltd. Ep-4060),
Glass paper was sandwiched between glass cloths, and molding was carried out according to the steps shown in the attached drawings to obtain a copper-clad laminate with a thickness of 1.6 mm. The curing conditions were 120°C for 10 minutes, and the after-cure conditions were 180°C for 30 minutes. Examples 2 to 5 Copper-clad laminates were prepared in the same manner as in Example 1, except that the blending ratio of unsaturated polyester resin and epoxy resin was set as shown in the following table, and the blending of epoxy resin was set as shown in the following table. I got it. Example 6 The procedure was the same as in Example 1, except that the blending ratio of unsaturated polyester resin and epoxy resin and the epoxy resin composition were set as shown in the following table, and six sheets of glass cloth were used as the base material. A copper-clad laminate was obtained. Conventional Example A copper-clad laminate was obtained in the same manner as in Example 1 except that epoxy resin was not used. The properties of the copper-clad laminates obtained in Examples 1 to 6 and the conventional example are shown in the following table. In addition, in the following table
HHPA stands for hexahydrophthalic anhydride, BDMA stands for benzyldimethylamine, NMA stands for methylnadic anhydride, DDM stands for diaminodiphenylmethane, and 2E4MZ stands for 2-ethyl-4-methylimidazole.
上述のように本発明によれば、少なくとも一枚
ガラス基材を含む複数枚の基材を連続的に送つ
て、不飽和樹脂に硬化剤入りのエポキシ樹脂を配
合して調整ノブしたレンド樹脂液をこの各基材に
含浸させ、この複数枚の樹脂含浸基材を重ねてロ
ール間に通すことにより積層基材を形成し、次で
この積層基材の各樹脂を硬化させるので積層板を
連続製造しながら、しかも、エポキシ樹脂のガラ
スへの優れた接着性によつて層間接着性を向上さ
せることができ、しかも、エポキシ樹脂のみを基
材に含浸させて成形を行う場合のような、連続成
形工法のメリツトである生産性を損なうことな
く、連続成形により層間接着性の優れた積層板を
連続生産できるものである。
As described above, according to the present invention, a plurality of base materials including at least one glass base material are continuously sent, and an epoxy resin containing a curing agent is blended with an unsaturated resin to form a blend resin liquid that is adjusted with an adjustment knob. is impregnated into each of these base materials, and a laminated base material is formed by stacking these multiple resin-impregnated base materials and passing them between rolls.Next, each resin in this laminated base material is cured, so that the laminated board can be made continuously. In addition, the excellent adhesion of epoxy resin to glass improves interlayer adhesion during manufacturing. It is possible to continuously produce laminates with excellent interlayer adhesion through continuous molding without sacrificing productivity, which is an advantage of the molding method.
添付図は本発明における積層板の製造の工程の
概略図である。
１は基材、４は樹脂含浸基材、５はロール、６
は積層基材である。
The attached drawings are schematic diagrams of the process of manufacturing a laminate according to the present invention. 1 is a base material, 4 is a resin-impregnated base material, 5 is a roll, 6
is a laminated base material.
Claims (1)
材を連続的に送つて、不飽和樹脂に硬化剤入りの
エポキシ樹脂を配合して調製したブレンド樹脂液
をこの各基材に含浸させ、この複数枚の樹脂含浸
基材を重ねてロール間に通すことにより積層基材
を形成し、次でこの積層基材の各樹脂を硬化させ
ることを特徴とする積層板の製造法。1. Continuously send a plurality of substrates including at least one glass substrate, impregnate each substrate with a blended resin liquid prepared by blending an epoxy resin containing a curing agent with an unsaturated resin, and A method for manufacturing a laminate, which comprises forming a laminated base material by stacking a plurality of resin-impregnated base materials and passing them between rolls, and then curing each resin in the laminated base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58084347A JPS59209828A (en) | 1983-05-14 | 1983-05-14 | Manufacture of laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58084347A JPS59209828A (en) | 1983-05-14 | 1983-05-14 | Manufacture of laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59209828A JPS59209828A (en) | 1984-11-28 |
| JPH0441046B2 true JPH0441046B2 (en) | 1992-07-07 |
Family
ID=13827976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58084347A Granted JPS59209828A (en) | 1983-05-14 | 1983-05-14 | Manufacture of laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59209828A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5550875B2 (en) * | 2009-09-25 | 2014-07-16 | パナソニック株式会社 | Liquid thermosetting resin composition, prepreg, metal foil-clad laminate, and printed wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5085688A (en) * | 1973-11-30 | 1975-07-10 | ||
| JPS5857445B2 (en) * | 1976-02-28 | 1983-12-20 | 新神戸電機株式会社 | Method of manufacturing laminates |
-
1983
- 1983-05-14 JP JP58084347A patent/JPS59209828A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59209828A (en) | 1984-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0441046B2 (en) | ||
| JPS6072931A (en) | Production of paper-base phenolic resin laminate | |
| JP4238492B2 (en) | Laminate production method | |
| JPH02258337A (en) | Manufacture of laminate for printed circuit | |
| JPS59209829A (en) | Manufacture of laminate | |
| JPS6364306B2 (en) | ||
| JPS60135425A (en) | Curable resin composition and its molding | |
| JPH0724955A (en) | Copper-clad laminate | |
| JPS60155440A (en) | Making method of laminated board | |
| JPH02133441A (en) | Production of electrical laminate | |
| JPH05318650A (en) | Copper plated laminated sheet | |
| JPS5939546A (en) | Copper lined laminated board | |
| JPS59192567A (en) | Manufacture of laminated board | |
| JPH0257018B2 (en) | ||
| JPH0145418B2 (en) | ||
| JPH0565322A (en) | Thermosetting resin composition and production of laminate from the same | |
| JPS6334132A (en) | Laminated board | |
| JPH05200896A (en) | Manufacture of sealing plate using film-clad material | |
| JPH0192237A (en) | Production of copper-clad laminated sheet | |
| JPH06315998A (en) | Production of laminated sheet | |
| JPS6330538A (en) | Production of laminated sheet | |
| JPH07176844A (en) | Laminated board for printed circuit | |
| JPS63283949A (en) | Preparation of laminated sheet | |
| JPH04268785A (en) | Copper plated laminated board | |
| JPH10182985A (en) | Resin composition for laminated plate and laminated plate |