JPH044105B2 - - Google Patents

Description

Detailed Description of the Invention (Industrial Application Field) The present invention is a method of cutting diamond abrasive grains using wires or It relates to a diamond electrodeposited wire or ribbon electrodeposited on a ribbon.

(Prior Art) In a wire saw using such a conventional diamond electrodeposited wire or ribbon, for example, as shown in FIG. 3, the diamond electrodeposited wire or ribbon 1 stretched between guide rolls 2 is It was brought into contact with a certain semiconductor polycrystalline ingot 3 under an appropriate load, and cutting was performed while supplying a slurry 4 containing free abrasive grains and cutting oil from above. Therefore, there were problems such as the inside of the machine becoming dirty due to slurry scattering and wires being cut due to insufficient supply of slurry. Additionally, conventional diamond electrodeposited wires or ribbons, e.g.
As shown in the figure, since coarse diamond abrasive grains 5 were electrodeposited on the wire or ribbon material with only one electrodeposited layer 6, hard chips of the workpiece such as hard semiconductor polycrystals generated during processing were removed. As a result, the electrodeposited layer 6 of nickel or copper exposed between the electrodeposited diamond abrasive grains 5 is scraped off, so the electrodeposition layer 6 is worn out and removed, causing the diamond abrasive grains 5 to peel off and shorten the life of the wire. There were disadvantages in that the length was short and the processing speed was slow. In this case, diamond abrasive grain 5
Attempts have been made to increase the thickness of the electrodeposited layer 6, but since the electrodeposited layer 6 is still scraped off by hard chips from the workpiece, not only is it inevitable that the diamond abrasive grains 5 will peel off, but the electroplated layer 6 is When the deposited layer 6 became thicker, there was a risk of it becoming less flexible and breaking.

For example, Utility Application No. 58-25511 (Utility Application No. 59-132761)
In the microfilm of issue), on the metal belt,
Several types of abrasive particles of different sizes are electrodeposited in strips with abrasive particle electrodeposition layers of each abrasive particle size divided in the width direction of a metal belt, or abrasive particle electrodeposition layers of different sizes are sequentially applied to each abrasive layer on the metal belt surface. A structure in which the surface width is changed in the width direction depending on the grain size and is layered in a strip-like step shape is disclosed. The problem is that the electrodeposited layer of nickel or copper exposed between the diamond abrasive grains is scraped off, and the electrodeposited layer is worn out and removed, causing the diamond abrasive grains to peel off, shorten the life of the wire, and slow down the processing speed. No technology has been disclosed to solve this problem.

(Problems to be Solved by the Invention) An object of the present invention is to eliminate the drawbacks of the conventional products and provide a method for cutting semiconductor single crystal or polycrystalline ingots, ceramics, glass, jewelry, composite materials, etc. To provide a sawn diamond electrodeposited wire or ribbon with high precision and long life without supplying slurry containing grains.

(Means for Solving the Problems) For this reason, the present invention includes a first electrodeposited layer in which coarse diamond abrasive grains are electrodeposited on a wire or ribbon material, and a wire or ribbon material on which coarse diamond abrasive grains are deposited. a second electrodeposited layer in which fine diamond abrasive grains are electrodeposited, and the first electrodeposition layer between the coarse diamond abrasive grains is covered with the fine diamond abrasive grains of the second electrodeposition layer. It is made into a diamond electrodeposited wire or ribbon.

(Example) Next, an example of the present invention will be described with reference to the drawings. A diamond electrodeposited wire or ribbon according to the present invention shown in FIG. It has a first electrodeposited layer 9 and a second electrodeposited layer in which diamond abrasive grains 10, which are considerably finer than the coarse diamond abrasive grains 8, are electrodeposited on the first electrodeposit layer 9. The electrodeposition may be nickel electrodeposition or copper electrodeposition, the wire material may be piano wire, brass wire, or tool copper wire, and the cross-sectional shape of the wire may be round, triangular, square, irregular shape, etc. It's okay. The ribbon material may be stainless steel, marage steel, or amorphous alloy.

Next, the manufacturing process of diamond electrodeposited wire will be explained with reference to FIG.
The coarse diamond abrasive grains 8 contained in the electrodeposition liquid 8' are firstly electrodeposited therein. In the example, abrasive grain 8
The size is 30 to 40 μm. This abrasive grain contributes to the cutting process. Next, it is placed in the second electrodeposition tank 16,
Diamond abrasive grains 10, which are considerably finer than the abrasive grains contained in the electrodeposition liquid 10', are secondly electrodeposited between the coarse diamond abrasive grains 8, and wound up by a product drum 19. In the example, the size of the fine abrasive grains 10 is 7 to 12 μm.

In the embodiment shown in FIG. 2, the wire material 7 is a piano wire with dimensions of 0.2 mm in diameter x 100 m in length, the size of the coarse diamond abrasive grains 8 is 30 to 40 μm, and the size of the fine diamond abrasive grains is 7-12μm
It was hot.

The electrodeposition conditions were as follows.

(a) 1st electrodeposited nickel sulfamate 520g/nickel chloride 35g/current density 6A/dm ² electrodeposition time 10 minutes feed speed 60mm/min (b) 2nd electrodeposited nickel sulfamate 520g/nickel chloride 35g/ Current density: 3 A/dm ² Electrodeposition time: 10 minutes Feed rate: 60 mm/min Pre-treatment was performed before the first electrodeposition, and post-treatment was appropriately performed after the second electrodeposition. The diamond electrodeposited wire produced in this way has a 150 to 200% improvement in wire life when cutting semiconductor single crystal or polycrystalline ingots, which are said to be difficult-to-cut materials, and eliminates the need to supply slurry. The finish of the cut surface was also improved, and the accuracy was also improved.

(Effects of the Invention) As explained above, according to the present invention, in order to protect the first electrodeposited layer in which coarse diamond abrasive grains are electrodeposited, finer diamond abrasive grains are electrodeposited again as a second electrodeposition layer, and the 1st between coarse diamond abrasive grains
Since the electrodeposited layer is covered with the fine diamond abrasive grains of the second electrodeposited layer, the hard chips of the workpiece such as the hard semiconductor polycrystalline material mentioned above will cause damage between the electrodeposited diamond abrasive grains. The exposed electrodeposited layer of nickel or copper is scraped away, and the electrodeposited layer is worn away and comes off.The rough diamond abrasive grains that actually contribute to the cutting process do not shorten the life of the peeling wire, so To provide a sawing diamond electrodeposited wire or ribbon that has high accuracy and long life without supplying slurry containing abrasive grains when cutting single crystal or polycrystalline ingots, ceramics, glass, jewelry, composite materials, etc. It became.

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view of an example diamond electrodeposited wire or ribbon according to the present invention, and FIG.
FIG. 2 is a schematic explanatory diagram of a manufacturing apparatus for manufacturing the diamond electrodeposited wire shown in the figure. Figure 3 shows how conventional diamond electrodeposited wire or ribbon is used.
An example perspective view, FIG. 4, shows a schematic cross-sectional view of a conventional diamond electrodeposited wire or ribbon. 7... Wire or ribbon material, 8... Coarse diamond abrasive grains, 9... First electrodeposited layer, 10... Fine diamond abrasive grains, 11... Second electrodeposited layer.

Claims (1)

[Claims] 1. A first electrodeposited layer in which coarse diamond abrasive grains are electrodeposited on a wire or ribbon material, and a second electrodeposition layer in which diamond abrasive grains, which are considerably finer than the abrasive grains, are electrodeposited on the first electrodeposition layer. A diamond electrodeposited wire or ribbon, characterized in that the first electrodeposited layer between the coarse diamond abrasive grains is covered with the fine diamond abrasive grains of the second electrodeposition layer.