JPH0441185Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to an automatic anode ball feeding device used in a plating device for printed wiring boards.

[Conventional technology]

Conventionally, anode balls have been supplied to an anode case installed in a plating tank by a method such as manual supply by an operator or manual supply via a cylindrical chute or the like.

[Problem that the invention attempts to solve]

However, when the anode balls are manually supplied by a worker, the anode case is within the operation area of the plating device, which poses a danger to the supply operation, so the plating device must be stopped before supplying. Extremely inefficient. It is also possible to supply the plating equipment from outside its operating area via a cylindrical chute while the equipment is in operation, but this requires a constant worker, which not only results in high costs but also involves danger in the work itself. There were many shortcomings, and the development of new technology was desired.

SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic anode ball feeding device that eliminates the above-mentioned drawbacks.

[Differences between the invention and the conventional technology]

In contrast to the conventional apparatus described above, the present invention has an original content in that anode balls can be automatically supplied unattended without manual intervention by an operator.

[Means for solving problems]

The present invention is to vibrate the anode balls stored in the hopper installed outside the working area of the plating device, align them to each chute installed in multiple rows under the hopper, and take out the anode balls one by one and transfer them to the anode ball transport jig. A feeding mechanism, and an anode ball that transports the anode ball transport jig to a predetermined plating tank via a transport machine, and supplies the anode balls to an anode case installed in the plating tank by mounting it at a predetermined position in the plating tank. This is an automatic anode ball supply device in a plating device for printed wiring boards, characterized in that it has a conveying jig.

〔Example〕 Next, the present invention will be explained with reference to the drawings.

FIG. 1 shows the main body of an automatic anode ball supply device, which has a cylinder 2 and an excitation bar 3 at the bottom of a hopper 1, and multiple rows of chute 4 installed at the bottom of the side wall of the hopper 1, each horizontal chute 4a. A cylinder 5 for attaching an anode ball is installed at each.

FIG. 2 shows an anode ball transport jig 6, in which an anode ball case 7 is arranged at the bottom of a transport hook 6a, a rotating shaft 9 connected to a reversing pin 8 is provided at the center of the anode ball case 7, A rotation return spring 10 is provided at the end of the rotation shaft 9.

In the embodiment, when the anode balls 11 are replenished into the hopper 1 and excited by the cylinder 2 and the excitation bar 3, the anode balls 11 roll downward along the hopper bottom wall slope 1a and are aligned in each chute 4. Further, the anode ball take-out cylinder 5 is operated to take out the anode balls 11 one by one and automatically supply them to the anode ball case 7 of the anode ball transport jig 6.

Furthermore, as shown in FIG.
2 to a predetermined plating tank 13, and when loading it at a predetermined position in the plating tank 13, the reversing pin 8 hits the stopper 14 of the plating tank part, and as a result,
The anode ball case 7 is tilted about the rotating shaft 9, and the anode balls 11 can be automatically supplied to the anode case 15 installed in the plating tank 13.

After the anode balls 11 are automatically supplied, the anode ball transport jig 6 is lifted up by the transport machine 12 and returned to the main body of the automatic anode ball supply device. At this time, the rotational return spring 10 is actuated to The tilt of the case 7 is automatically restored.

[Effect of idea]

As explained above, according to the present invention, the plating device can be stopped by simply replenishing the anode balls at once outside the device operating range, without requiring any manual work, and stopping the plating device to the anode case installed in the plating tank. This has the effect that anode balls can be automatically supplied efficiently and safely without any problems.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view showing the main body of the automatic anode ball supplying device in the present invention, Fig. 2 is an external view of the anode ball conveying jig in the present invention, and Fig. 3 is an embodiment of the present invention. It is a side sectional view at the time of supply. 1... Hoppa, 1a... Hoppa bottom wall slope, 2...
...Cylinder, 3...Excitation bar, 4...Shute,
4a... Horizontal chute, 5... Cylinder for taking out anode balls, 6... Anode ball transport jig, 6a... Transport hook, 7... Anode ball case, 8... Reversing pin, 9... Rotating shaft, 10 …
... Rotation return spring, 11 ... Anode ball, 12
... Conveyor, 13 ... Plating tank, 14 ... Stopper, 15 ... Anode case.

Claims (1)

[Scope of utility model registration request] A mechanism that excites the anode balls stored in the hopper installed outside the plating device operating area, aligns them to each chute installed in multiple rows under the hopper, and takes out the anode balls one by one and supplies them to the anode ball transport jig. and an anode ball transport jig that transports the anode ball transport jig to a predetermined plating tank via a transport machine, and supplies the anode balls to an anode case installed in the plating tank by mounting it at a predetermined position in the plating tank. An automatic anode ball supply device in a plating device for printed wiring boards, characterized in that it has the following.