JPH0441653U - - Google Patents

Info

Publication number
JPH0441653U
JPH0441653U JP8329590U JP8329590U JPH0441653U JP H0441653 U JPH0441653 U JP H0441653U JP 8329590 U JP8329590 U JP 8329590U JP 8329590 U JP8329590 U JP 8329590U JP H0441653 U JPH0441653 U JP H0441653U
Authority
JP
Japan
Prior art keywords
image
raster
scratches
abnormalities
objects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8329590U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8329590U priority Critical patent/JPH0441653U/ja
Publication of JPH0441653U publication Critical patent/JPH0441653U/ja
Pending legal-status Critical Current

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  • Analysing Materials By The Use Of Radiation (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案のブロツク図、第2図は本考
案の実施例におけるメモリ内容図、第3図は被検
査物の斜視図、第4図は本考案実施例の動作説明
図である。 1……X線源、2……X線TVカメラ、3……
多値フレームメモリ、4……多値Σ演算回路、5
……多値Σ演算メモリ、6……2値化闘値発生回
路、7……2値化回路、8……2値フレームメモ
リ、9……2値Σ演算回路、10……2値Σ演算
メモリ。
Fig. 1 is a block diagram of the present invention, Fig. 2 is a memory content diagram in an embodiment of the present invention, Fig. 3 is a perspective view of an object to be inspected, and Fig. 4 is an explanatory diagram of the operation of the embodiment of the present invention. . 1...X-ray source, 2...X-ray TV camera, 3...
Multi-value frame memory, 4... Multi-value Σ calculation circuit, 5
...Multi-valued Σ calculation memory, 6...Binary value generation circuit, 7...Binary conversion circuit, 8...Binary frame memory, 9...Binary Σ calculation circuit, 10...Binary Σ Arithmetic memory.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] X線等をもちいて物体のキズ及びはんだ付部の
異常を自動的に判定するために、画像の任意のエ
リアの多値画像積分を行い、この積分結果からラ
スター毎の2値化闘値レベルを求め、ラスター毎
にことなつた2値化レベルで画像を2値化するこ
とにより物体のキズ及びはんだ付部の異常の判定
を行うことを特徴とする上記画像処理装置。
In order to automatically determine scratches on objects and abnormalities in soldered parts using X-rays, etc., multilevel image integration is performed on arbitrary areas of the image, and the binarized threshold level for each raster is calculated from this integration result. The above-mentioned image processing device is characterized in that it determines scratches on objects and abnormalities in soldered parts by determining the image and binarizing the image at different binarization levels for each raster.
JP8329590U 1990-08-08 1990-08-08 Pending JPH0441653U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8329590U JPH0441653U (en) 1990-08-08 1990-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8329590U JPH0441653U (en) 1990-08-08 1990-08-08

Publications (1)

Publication Number Publication Date
JPH0441653U true JPH0441653U (en) 1992-04-08

Family

ID=31630841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8329590U Pending JPH0441653U (en) 1990-08-08 1990-08-08

Country Status (1)

Country Link
JP (1) JPH0441653U (en)

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