JPH0442343U - - Google Patents

Info

Publication number
JPH0442343U
JPH0442343U JP8205090U JP8205090U JPH0442343U JP H0442343 U JPH0442343 U JP H0442343U JP 8205090 U JP8205090 U JP 8205090U JP 8205090 U JP8205090 U JP 8205090U JP H0442343 U JPH0442343 U JP H0442343U
Authority
JP
Japan
Prior art keywords
conductive
ceramics
suction surface
porous ceramics
vacuum chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8205090U
Other languages
Japanese (ja)
Other versions
JPH0751221Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8205090U priority Critical patent/JPH0751221Y2/en
Publication of JPH0442343U publication Critical patent/JPH0442343U/ja
Application granted granted Critical
Publication of JPH0751221Y2 publication Critical patent/JPH0751221Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Jigs For Machine Tools (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例に係る真空チヤツクの縦
断面図である。第２図、第３図はそれぞれ従来の
真空チヤツクの縦断面図である。 １……真空チヤツク、２……多孔質板、２ａ…
…吸着面、３……基体、４……導電部材、５……
検知器、６……カツター。 FIG. 1 is a longitudinal sectional view of a vacuum chuck according to an embodiment of the present invention. 2 and 3 are longitudinal sectional views of a conventional vacuum chuck, respectively. 1... Vacuum chuck, 2... Porous plate, 2a...
...Adsorption surface, 3... Base, 4... Conductive member, 5...
Detector, 6... cutter.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多孔質セラミツクスからなる吸着面の周辺部に
、該吸着面と同一平面となるように、表面に導電
膜を形成した多孔質セラミツクスまたは導電性セ
ラミツクスからなる導電部材を配設したことを特
徴とする真空チヤツク。 A conductive member made of porous ceramics or conductive ceramics having a conductive film formed on its surface is disposed around the suction surface made of porous ceramics so as to be flush with the suction surface. Vacuum chuck.
JP8205090U 1990-07-31 1990-07-31 Vacuum chuck Expired - Lifetime JPH0751221Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8205090U JPH0751221Y2 (en) 1990-07-31 1990-07-31 Vacuum chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8205090U JPH0751221Y2 (en) 1990-07-31 1990-07-31 Vacuum chuck

Publications (2)

Publication Number Publication Date
JPH0442343U true JPH0442343U (en) 1992-04-10
JPH0751221Y2 JPH0751221Y2 (en) 1995-11-22

Family

ID=31628523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8205090U Expired - Lifetime JPH0751221Y2 (en) 1990-07-31 1990-07-31 Vacuum chuck

Country Status (1)

Country Link
JP (1) JPH0751221Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143073A (en) * 1992-10-27 1994-05-24 Sony Corp Vacuum chuck plate
JP2010184331A (en) * 2009-02-13 2010-08-26 Disco Abrasive Syst Ltd Holding table and machining device
CN101961886A (en) * 2009-07-21 2011-02-02 株式会社迪思科 Topping machanism
JP2011023606A (en) * 2009-07-16 2011-02-03 Disco Abrasive Syst Ltd Protection tape peeling apparatus
WO2025105097A1 (en) * 2023-11-17 2025-05-22 住友重機械工業株式会社 Laser processing device and laser anneal device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332096A (en) * 1999-05-21 2000-11-30 Bridgestone Corp Product holder
JP4564138B2 (en) * 2000-07-10 2010-10-20 Ｄｏｗａホールディングス株式会社 Manufacturing method of semiconductor device
JP6078297B2 (en) * 2012-10-31 2017-02-08 株式会社ディスコ Processing equipment
JP6223862B2 (en) * 2014-02-27 2017-11-01 株式会社ディスコ Cutting equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143073A (en) * 1992-10-27 1994-05-24 Sony Corp Vacuum chuck plate
JP2010184331A (en) * 2009-02-13 2010-08-26 Disco Abrasive Syst Ltd Holding table and machining device
JP2011023606A (en) * 2009-07-16 2011-02-03 Disco Abrasive Syst Ltd Protection tape peeling apparatus
CN101961886A (en) * 2009-07-21 2011-02-02 株式会社迪思科 Topping machanism
JP2011023686A (en) * 2009-07-21 2011-02-03 Disco Abrasive Syst Ltd Cutting device
WO2025105097A1 (en) * 2023-11-17 2025-05-22 住友重機械工業株式会社 Laser processing device and laser anneal device

Also Published As

Publication number Publication date
JPH0751221Y2 (en) 1995-11-22

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term