JPH0442726U - - Google Patents
Info
- Publication number
- JPH0442726U JPH0442726U JP8480590U JP8480590U JPH0442726U JP H0442726 U JPH0442726 U JP H0442726U JP 8480590 U JP8480590 U JP 8480590U JP 8480590 U JP8480590 U JP 8480590U JP H0442726 U JPH0442726 U JP H0442726U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- appropriate amount
- solder
- fused
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による半田付チツプ部品の一実
施例の斜視図、第２図および第３図は本考案によ
る半田付チツプ部品の他の実施例の斜視図、第４
図はリフロー工程後の状態を示したチツプ部品の
斜視図である。
図において、１はチツプ部品本体、２は電極部
、３は半田、４は回路基板パターン、５はリード
付チツプ部品、６はリード脚である。
FIG. 1 is a perspective view of one embodiment of the soldered chip component according to the present invention, FIGS. 2 and 3 are perspective views of other embodiments of the soldered chip component according to the present invention, and FIG.
The figure is a perspective view of the chip component after the reflow process. In the figure, 1 is a chip component body, 2 is an electrode section, 3 is solder, 4 is a circuit board pattern, 5 is a chip component with leads, and 6 is a lead leg.
Claims (1)
形成し、該逆三角形を埋めるように半田を適量融
着させたことを特徴とする半田付チツプ部品。 (2) チツプ部品の電極部の端面にある厚みをも
つて半田を適量融着させたことを特徴とする半田
付チツプ部品。 (3) チツプ部品において、先端部に半田を適量
融着させたリード脚を有することを特徴とする半
田付チツプ部品。[Claims for Utility Model Registration] (1) A soldered chip component characterized in that the side cross section of the electrode portion of the chip component is formed into an inverted triangle, and an appropriate amount of solder is fused to fill the inverted triangle. (2) A soldered chip component characterized by having an appropriate amount of solder fused to a certain thickness on the end face of the electrode part of the chip component. (3) A soldered chip component characterized by having a lead leg with an appropriate amount of solder fused to its tip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8480590U JPH0442726U (en) | 1990-08-10 | 1990-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8480590U JPH0442726U (en) | 1990-08-10 | 1990-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0442726U true JPH0442726U (en) | 1992-04-10 |
Family
ID=31633531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8480590U Pending JPH0442726U (en) | 1990-08-10 | 1990-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442726U (en) |
-
1990
- 1990-08-10 JP JP8480590U patent/JPH0442726U/ja active Pending